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Keywords: Reliability Assessment
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 254–259.
Published Online: July 26, 2002
... to the core layer. Fatigue data on FPCs are not commonly available in published literature. Presented in this paper is the fatigue resistance and reliability assessment of polyimide based FPCs. Fatigue resistance of a specific material system was analyzed as a function of temperature and frequency through...