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Journal Articles

Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Hung-Lung Lee, Shyang-Jye Chang, Sheng-Jye Hwang, Associate Professor,, Francis Su, S. K. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 268–275.
https://doi.org/10.1115/1.1569957
Published Online: June 10, 2003
...Hung-Lung Lee; Shyang-Jye Chang; Sheng-Jye Hwang, Associate Professor,; Francis Su; S. K. Chen This paper presents a methodology for TSOP II LOC packaging design. The design objectives are: 1) to optimize mold-flow balance, which in turn minimizes air traps, and 2) to minimize manufacturing...
View Article titled, Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize <span class="search-highlight">Mold</span>-<span class="search-highlight">Flow</span> <span class="search-highlight">Balance</span>
Open the PDF for Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize <span class="search-highlight">Mold</span>-<span class="search-highlight">Flow</span> <span class="search-highlight">Balance</span> in another window
Topics: Computer-aided design, Design, Design methodology, Flow (Dynamics), Taguchi methods, Noise factors, Molding, Packaging, Simulation, Manufacturing