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Keywords: Laplace equations
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Journal Articles
J. R. Culham, Associate Professor and Director, Mem. ASME,, M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,, T. F. Lemczyk, Project Engineer,
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 233–239.
Published Online: September 1, 2000
... to complex and time consuming simulations if component details are to be adequately resolved. An analytical approach for characterizing electronic packages is presented, based on the steady-state solution of the Laplace equation for general rectangular geometries, where boundary conditions are uniformly...
