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Keywords: High Cycle Fatigue
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011005.
Paper No: EP-19-1027
Published Online: September 19, 2019
... cycle of deformation, the spring structure will be damaged and cause device failure, we call this failure mode high cycle fatigue (HCF). This is very common for MEMS products, but it is difficult for designers to predict it at design stage. To prevent early fatigue problems and reduce product...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 254–259.
Published Online: July 26, 2002
... lifetime has been observed due to higher displacements in high cycle fatigue. Observed temperature effect was however counter-intuitive. Failure mechanisms are discussed and complete fracture analysis is presented. In various FPC systems, it has been found that the changes take place in FPC failure...
