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Keywords: FTIR
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 52–58.
Published Online: March 21, 2005
... microscopy UV Curable ACAs SEM FTIR Curing Degree Shear Load It is believed that lead-tin solder especially eutectic lead-tin solder is the most frequently used soldering material in the electronics industry. Traditionally, electronic components and assemblies are soldered with lead-tin...
