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Keywords: FR-4
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Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Jingshi Meng, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
https://doi.org/10.1115/1.4036187
Published Online: June 14, 2017
... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 26, 2015; final manuscript received March 1, 2017; published online June 14, 2017. Assoc. Editor: Jeffrey C. Suhling. 26 09 2015 01 03 2017 Composite materials COTS Failure analysis FR-4 Harsh...
View Article titled, Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components
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Topics: Failure, Failure mechanisms, Microelectromechanical systems, Printed circuit boards, Stress, Resonance, Clearances (Engineering), Vibration, Finite element analysis, Electrical wires
Journal Articles

Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies

Umut Zeynep Uras, Mehmet Arık, Enes Tamdoğan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020907.
Paper No: EP-16-1139
https://doi.org/10.1115/1.4036403
Published Online: June 12, 2017
... June 12, 2017. Assoc. Editor: Justin A. Weibel. 16 12 2016 28 03 2017 Flexible circuits FR-4 Harsh environment Reliability Thermal analysis With a quadruple increase of optical enhancement in late 1990s creating new application opportunities, light emitting diodes (LEDs...
View Article titled, Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies
Open the PDF for Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies in another window
Topics: Engines, Light-emitting diodes, Temperature, Lumber, Flat heat pipes, Electronics, Thermal conductivity, Temperature distribution, Vapors
Journal Articles

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Li-Anne Liew, Ching-Yi Lin, Ryan Lewis, Susan Song, Qian Li, Ronggui Yang, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011003.
Paper No: EP-16-1103
https://doi.org/10.1115/1.4035241
Published Online: December 7, 2016
... of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received August 30, 2016; final manuscript received November 13, 2016; published online December 7, 2016. Assoc. Editor: Xiaobing Luo. 30 08 2016 13 11 2016 Flexible circuits FR-4 Polyimide Power...
View Article titled, Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology
Open the PDF for Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology in another window
Topics: Copper, Heat, Manufacturing, Printed circuit boards, Vapors, Water, Nylon fabrics, Condensers (steam plant), Thermal resistance
Journal Articles

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Sharan Kallolimath, Jiang Jenny Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041001.
Paper No: EP-14-1082
https://doi.org/10.1115/1.4034187
Published Online: August 10, 2016
... September 29, 2014; final manuscript received July 14, 2016; published online August 10, 2016. Assoc. Editor: Toru Ikeda. 29 09 2014 14 07 2016 3D packaging Area array COB CSP FR-4 Wafer level packaging Mechanical failures of hand-held devices lose their effective...
View Article titled, Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response
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Topics: Electrons, Finite element analysis, Lumber, Shock (Mechanics), Simulation, Stress, Solder joints, Modeling, Symmetry (Physics), Boundary-value problems
Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board

Jingshi Meng, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010914.
Paper No: EP-15-1101
https://doi.org/10.1115/1.4032495
Published Online: March 10, 2016
... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 26, 2015; final manuscript received January 6, 2016; published online March 10, 2016. Assoc. Editor: Jeffrey C. Suhling. 26 09 2015 06 01 2016 Composite materials COTS FR-4 Harsh environment MEMS...
View Article titled, Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board
Open the PDF for Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board in another window
Topics: Damping, Printed circuit boards, Microbeams
Journal Articles

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

D. N. Borza, I. T. Nistea
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041007.
https://doi.org/10.1115/1.4007812
Published Online: November 26, 2012
... in the corresponding solder joints. The general principle of increasing the fundamental frequency and decreasing the static or dynamic displacement values has to be checked against the consequences on the PCB curvature near large electronic devices having high stiffness. failure analysis FR-4 harsh environment...
View Article titled, Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level
Open the PDF for Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level in another window
Topics: Deformation, Failure, Printed circuit board assemblies, Screws, Stress, Vibration, Solder joints, Interferometry, Displacement, Boundary-value problems
Journal Articles

Effect of RCC on the Reliability of Adhesive Flip Chip Joints

Laura K. Frisk, Kati H. Kokko
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 260–265.
https://doi.org/10.1115/1.2753909
Published Online: October 27, 2006
... these demands. In the SBU process, additional dielectric and conductor layers are formed on a core board, which is typically made of FR-4. Microvias are formed on these layers to achieve an electrical connection between them and the core board. Resin-coated copper foil (RCC) is the most widely used dielectric...
View Article titled, Effect of RCC on the Reliability of Adhesive Flip Chip Joints
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Topics: Adhesives, Bonding, Flip-chip, Flip-chip devices, Particulate matter, Pressure, Reliability, Temperature, Failure, Delamination