.../1.4048493 [34] Zhou , F. , Dede , E. M. , and Joshi , S. N. , 2015 , “ A Novel Design of Hybrid Slot Jet and Mini-Channel Cold Plate for Electronics Cooling ,” 2015 31st Thermal Measurement, Modeling & Management Symposium ( SEMI-THERM ), San Jose, CA, Mar. 15–19, pp. 60...

... and Thermomechanical Phenomena in Electronic Systems ( ITherm ), Las Vegas, NV, May 28–31, pp. 540 – 545 . 10.1109/ITHERM.2019.8757380 [6] Chu , R. C. , 2004 , “ The Challenges of Electronic Cooling: Past, Current and Future ,” ASME J. Electron. Packag. , 126 ( 4 ), pp. 491 – 500 . 10.1115...

...@usherbrooke.ca 29 04 2021 26 07 2021 27 08 2021 immersion cooling dielectric liquids pool boiling heat spreading integrated heat spreader electronics cooling e-mail:  Wei.Tong@usherbrooke.ca e-mail:  seyedyaser.nabavilarimi@usherbrooke.ca e-mail:  chady.al.sayed...

... of Metallic Phase Change Materials Under Pulsed Power Loading ,” ASME Paper No. IPACK2017-74118. 10.1115/IPACK2017-74118 e-mail:  jaeholee@uci.edu 29 02 2020 16 05 2020 29 06 2020 thermal management electronics cooling heat guiding heterogeneous package...

.../1.4040956 [10] Rachedi , R. , and Chikh , S. , 2001 , “ Enhancement of Electronic Cooling by Insertion of Foam Materials ,” Heat Mass Transfer , 37 ( 4–5 ), pp. 371 – 378 . 10.1007/s002310100192 [11] Bayomy , A. M. , Saghir , M. Z. , and Yousefi , T...

.... , Cheng , C. H. , Wang , J. C. , and Chen , S. L. , 2008 , “ Heat Pipe for Cooling of Electronic Equipment ,” Energy Convers. Manage. , 49 ( 11 ), pp. 3398 – 3404 . 10.1016/j.enconman.2008.05.002 [3] Wang , J. , 2011 , “ L-Type Heat Pipes Application in Electronic Cooling System...

... designs critical for faster penetration of LED systems into general lighting applications. LED cooling natural convection heat sink chimney electronics cooling A19 bulb One particular area of strong interest is adoption of SSL for regular light bulbs. The large number of bulb sockets...

... with significantly lower pressure drops. cooling 3D IC review single-phase cooling electronics cooling flow boiling microchannels A 3D IC architecture incorporates multiple device layers that are interconnected through vertical interconnects to extend the performance of a 2D chip. A high level...

... that result in a lower overall temperature difference. Microchannels provide a very high heat transfer coefficient and a small flow passage volume. They have been identified as an effective technique in electronics cooling [ 1–4 ]. Colgan et al. [ 5 ] demonstrated a liquid cooler using offset strip fins...

... and development efforts are still on-going, especially in the area of nanocomposites, to deliver technologically viable thermoelectric coolers with an effective Z T > 2 . electronics cooling thermal analysis MEMS cooling electronics packaging 2010 American Society of Mechanical...

... blades centrifugal casting cooling fans miniature fans centrifugal flow blade design scaling phenomena electronics cooling Continual advancements in the manufacturing capabilities of microprocessor technologies have resulted in a rapidly expanding portable electronics market...

.... convection heat sink metal foam graphite foam electronics cooling Commercially produced metal foams are typically made from aluminum, nickel, steel, copper, and some of their alloys. These materials are known to have high thermal conductivities. This class of porous media has many practical...

... enhancement electronics cooling heat spreader experimental Historically the power dissipated from a microprocessor has increased with its computing performance. To slow this trend, microprocessor architectures are being designed with multiple processor cores that are integrated onto a monolithic...

... pressure drop at moderate and high pin spacing, but have only minor influence on heat transfer. 24 10 2004 30 07 2005 thermal management (packaging) integrated circuit packaging heat sinks cooling pin fins heat sink bypass tip leakage electronics cooling Thermal...

... with increasing Re number, pin density, and pin diameter. 13 12 2004 14 06 2005 heat sinks heat transfer jets thermal management (packaging) pin fin heat sinks impinging jet electronics cooling In order to extend the usefulness of direct air cooling in the thermal management...

... integrated circuit packaging thermal management (packaging) Conduction Electronics Cooling Heat Spreaders Heat Sinks Spreading Resistance Thermal spreading resistance results from discrete heat sources in many engineering systems. Typical applications include cooling of electronic devices...

... their performance to that of single jets at a given flow rate, pressure drop, or pumping power. Jet Impingement Air Jets Multiple Jets Electronics Cooling jets heat transfer confined flow stagnation flow 01 November 1998 26 December 2000 Contributed by the Electronic...

... the greatest surface-to-coolant temperature difference; as the coolant picks up heat from the target, it also speeds up, thus compensating for its expected loss in heat-removal capability. Electronics Cooling Jet Impingement Air Suction Pull and Push Modes Air Jets Confined Jets Heat Sinks Pin...