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Journal Articles

Special Issue With Contributions From ITherm 2004

K. Ramakrishna, Bahgat G. Sammakia, J. Richard Culham, Yogendra K. Joshi

Publisher: ASME

J. Electron. Packag. June 2006, 128(2): 101.

https://doi.org/10.1115/1.2188607

Published Online: June 1, 2006

View Article titled, Special Issue With Contributions From ITherm 2004

Topics: Electronic packaging, Packaging, Thermal management, Heat transfer

Journal Articles

Foreword

Bahgat Sammakia, Dereje Agonafer

Publisher: ASME

J. Electron. Packag. December 2004, 126(4): 409.

https://doi.org/10.1115/1.1827273

Published Online: January 24, 2005

View Article titled, Foreword

Topics: Heat sinks, Packaging, Thermal engineering, Thermal management, Cooling, Computer cooling, Computers, Inventions, Design, Heat transfer

Journal Articles

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

L. J. Ernst, Guest Editor, G. Q. Zhang, Guest Editor

Publisher: ASME

J. Electron. Packag. December 2003, 125(4): 465.

https://doi.org/10.1115/1.1634590

Published Online: December 15, 2003

View Article titled, Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

Topics: Engineering simulation, Microelectromechanical systems, Microelectronic devices, Optimization, Thermal management, Computer simulation, Failure analysis, Micromechanical devices, Packaging

Journal Articles

In Honor of Dr. M. M. Yovanovich

Publisher: ASME

J. Electron. Packag. June 2003, 125(2): 165–168.

https://doi.org/10.1115/1.1568123

Published Online: June 10, 2003

View Article titled, In Honor of Dr. M. M. Yovanovich

Topics: Contact resistance, Convection, Engineering teachers, Graduate students, Heat conduction, Heat transfer, Packaging, Students, Thermal resistance, Modeling

Journal Articles

Special Issue on Solder Geometry

Stephen M. Heinrich

Publisher: ASME

J. Electron. Packag. September 1996, 118(3): 113.

https://doi.org/10.1115/1.2792139

Published Online: September 1, 1996

View Article titled, Special Issue on Solder Geometry

Topics: Geometry, Solders

Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

D. Barker, S. Burchett, H. Conrad, A. Dasgupta, P. Engel, J. Lau, Y. Pao, A. Rafanelli, R. Ross, Jr.

Publisher: ASME

J. Electron. Packag. June 1995, 117(2): 93.

https://doi.org/10.1115/1.2792086

Published Online: June 1, 1995

View Article titled, Special Issue on Mechanics of Surface Mount Assemblies

Topics: Surface mount assemblies

Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Donald Barker, Hans Conrad, Peter Engel, Tai-Ran Hsu, John Lau, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone, Frank Wu

Publisher: ASME

J. Electron. Packag. June 1993, 115(2): 139–140.

https://doi.org/10.1115/1.2909308

Published Online: June 1, 1993

View Article titled, Special Issue on Mechanics of Surface Mount Assemblies

Topics: Surface mount assemblies

Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Donald Barker, Hans Conrad, Peter Engel, John Lan, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone

Publisher: ASME

J. Electron. Packag. June 1992, 114(2): 103.

https://doi.org/10.1115/1.2906403

Published Online: June 1, 1992

View Article titled, Special Issue on Mechanics of Surface Mount Assemblies

Topics: Surface mount assemblies

Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Peter A. Engel, John H. Lau, Yi-Hsin Pao, Anthony J. Rafanelli, Mohamed Zarrugh, Alex Zubelewicz

Publisher: ASME

J. Electron. Packag. June 1991, 113(2): 91.

https://doi.org/10.1115/1.2905389

Published Online: June 1, 1991

View Article titled, Special Issue on Mechanics of Surface Mount Assemblies

Topics: Surface mount assemblies

Journal citation

NARROW

Special Issue With Contributions From ITherm 2004

Foreword

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

In Honor of Dr. M. M. Yovanovich

Special Issue on Solder Geometry

Special Issue on Mechanics of Surface Mount Assemblies

Special Issue on Mechanics of Surface Mount Assemblies

Special Issue on Mechanics of Surface Mount Assemblies

Special Issue on Mechanics of Surface Mount Assemblies

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