1-7 of 7
Wedges
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications

A. Polyakov, M. Bartek, J. N. Burghartz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 7–11.
https://doi.org/10.1115/1.1846059
Published Online: March 21, 2005
View Article titled, Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications
Open the PDF for Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications in another window
Topics: Adhesives, Bonding, Semiconductor wafers, Fracture toughness, Wedges, Tensile strength
Journal Articles

Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading

Takehiro Saitoh, Hidehito Matsuyama, Masayuki Toya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 420–425.
https://doi.org/10.1115/1.1602706
Published Online: September 17, 2003
View Article titled, Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading
Open the PDF for Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading in another window
Topics: Delamination, Fracture (Process), Resins, Temperature, Copper alloys, Fracture mechanics, Alloys, Radioactive tracers, Wedges, Cracking (Materials)
Journal Articles

Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration

G. H. Lim, J. H. Ong, J. E. T. Penny
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1999, 121(2): 122–126.
https://doi.org/10.1115/1.2792666
Published Online: June 1, 1999
View Article titled, Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration
Open the PDF for Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration in another window
Topics: Printed circuit boards, Vibration, Wedges, Boundary-value problems, Dynamic response, Springs, Vibration tests
Journal Articles

Modeling the Vibration Restraints of Wedge Lock Card Guides

D. B. Barker, Y. S. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 189–194.
https://doi.org/10.1115/1.2909316
Published Online: June 1, 1993
View Article titled, Modeling the Vibration Restraints of Wedge Lock Card Guides
Open the PDF for Modeling the Vibration Restraints of Wedge Lock Card Guides in another window
Topics: Locks (Waterways), Modeling, Vibration, Wedges, Boundary-value problems, Deflection, Elastic constants, Frequency response, Rotation, Springs
Journal Articles

The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam

Wan-Lee Yin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 208–213.
https://doi.org/10.1115/1.2909319
Published Online: June 1, 1993
View Article titled, The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam
Open the PDF for The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam in another window
Topics: Thermal stresses, Stress, Elasticity, Polynomials, Stress singularity, Variational techniques, Wedges
Journal Articles

Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits

J. C. W. van Vroonhoven
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 28–33.
https://doi.org/10.1115/1.2909298
Published Online: March 1, 1993
View Article titled, Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits
Open the PDF for Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits in another window
Topics: Adhesion, Delamination, Integrated circuits, Stress singularity, Fracture (Materials), Failure, Fracture (Process), Silicon chips, Stress, Temperature
Journal Articles

Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Molding

E. Suhir, L. T. Manzione
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 16–20.
https://doi.org/10.1115/1.2905359
Published Online: March 1, 1991
View Article titled, Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Molding
Open the PDF for Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Molding in another window
Topics: Stress, Transfer molding, Wire, Molding, Arches, Bonding, Design, Flow (Dynamics), Integrated circuits, Shapes