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Journal Articles

Local Heat Transfer Characteristics in Simulated Electronic Modules

Seong-Yeon Yoo, Jong-Hark Park, Min-Ho Chung

Publisher: ASME

J. Electron. Packag. September 2003, 125(3): 362–368.

https://doi.org/10.1115/1.1602478

Published Online: September 17, 2003

View Article titled, Local Heat Transfer Characteristics in Simulated Electronic Modules

Topics: Generators, Heat transfer, Vortices, Flow (Dynamics), Heat transfer coefficients, Wakes, Forced convection

Journal Articles

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

Alfonso Ortega, Shankar Ramanathan

Publisher: ASME

J. Electron. Packag. June 2003, 125(2): 226–234.

https://doi.org/10.1115/1.1569506

Published Online: June 10, 2003

View Article titled, On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

Topics: Cooling, Flow (Dynamics), Heat, Strips, Temperature, Wakes, Electronic components, Turbulence

Journal Articles

Experimental Evaluation of Air-Cooling Electronics at High Altitudes

Henry Wong, Robert E. Peck

Publisher: ASME

J. Electron. Packag. December 2001, 123(4): 356–365.

https://doi.org/10.1115/1.1392319

Published Online: December 20, 1999

View Article titled, Experimental Evaluation of Air-Cooling Electronics at High Altitudes

Topics: Convection, Cooling, Flow (Dynamics), Heat transfer coefficients, Seas, Temperature, Wakes, Heating, Design, Wind tunnels

Journal Articles

The Thermal Wake Function for Rectangular Electronic Modules

S. S. Kang

Publisher: ASME

J. Electron. Packag. March 1994, 116(1): 55–59.

https://doi.org/10.1115/1.2905494

Published Online: March 1, 1994

View Article titled, The Thermal Wake Function for Rectangular Electronic Modules

Topics: Wakes, Flow (Dynamics), Heat, Turbulence

Journal Articles

A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks

G. L. Lehmann, S. J. Kosteva

Publisher: ASME

J. Electron. Packag. September 1990, 112(3): 234–240.

https://doi.org/10.1115/1.2904372

Published Online: September 1, 1990

View Article titled, A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks

Topics: Cooling, Forced convection, Heat sinks, Heat transfer coefficients, Channel flow, Convection, Electronic packaging, Flow (Dynamics), Geometry, Heat transfer

Journal Articles

Experimental Modeling of Convection Downstream from an Electronic Package Row

R. A. Wirtz, W. McAuliffe

Publisher: ASME

J. Electron. Packag. September 1989, 111(3): 207–212.

https://doi.org/10.1115/1.3226535

Published Online: September 1, 1989

View Article titled, Experimental Modeling of Convection Downstream from an Electronic Package Row

Topics: Convection, Electronic packages, Modeling, Flow (Dynamics), Heat transfer, Flow visualization, Reynolds number, Wakes, Coolants, Heat transfer coefficients

Journal citation

NARROW

Local Heat Transfer Characteristics in Simulated Electronic Modules

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

Experimental Evaluation of Air-Cooling Electronics at High Altitudes

The Thermal Wake Function for Rectangular Electronic Modules

A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks

Experimental Modeling of Convection Downstream from an Electronic Package Row

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Local Heat Transfer Characteristics in Simulated Electronic Modules

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

Experimental Evaluation of Air-Cooling Electronics at High Altitudes

The Thermal Wake Function for Rectangular Electronic Modules

A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks

Experimental Modeling of Convection Downstream from an Electronic Package Row

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

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