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Journal Articles

A Computational and Experimental Investigation of Synthetic Jets for Cooling of Electronics

Mehmet Arik, Yogen V. Utturkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021005.
Paper No: EP-14-1018
https://doi.org/10.1115/1.4029067
Published Online: June 1, 2015
View Article titled, A Computational and Experimental Investigation of Synthetic Jets for Cooling of Electronics
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Topics: Computational fluid dynamics, Cooling, Dipoles (Electromagnetism), Electronics, Flow (Dynamics), Heat transfer, Jets, Vortices
Journal Articles

Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime

Gongnan Xie, Masoud Asadi, Bengt Sunden, Shaofei Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031013.
Paper No: EP-13-1138
https://doi.org/10.1115/1.4027728
Published Online: June 10, 2014
View Article titled, Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime
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Topics: Design, Flow (Dynamics), Geometry, Heat transfer, Optimization, Reynolds number, Thermal resistance, Vortices, Wavelength, Degrees of freedom
Journal Articles

Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers

David J. Lettieri, Michael M. Toulouse, Cullen E. Bash, Amip J. Shah, Van P. Carey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030903.
Paper No: EP-12-1090
https://doi.org/10.1115/1.4024302
Published Online: July 24, 2013
View Article titled, Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers
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Topics: Buoyancy, Computational fluid dynamics, Data centers, Flow (Dynamics), Temperature, Vortices, Server racks, Approximation
Journal Articles

Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins

Y. S. Chung, D. H. Lee, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 106–112.
https://doi.org/10.1115/1.1849235
Published Online: June 3, 2005
View Article titled, Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins
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Topics: Flat plates, Flow (Dynamics), Flow visualization, Nozzles, Pressure, Liquid crystals, Temperature distribution, Fins, Jets, Testing
Journal Articles

Local Heat Transfer Characteristics in Simulated Electronic Modules

Seong-Yeon Yoo, Jong-Hark Park, Min-Ho Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 362–368.
https://doi.org/10.1115/1.1602478
Published Online: September 17, 2003
View Article titled, Local Heat Transfer Characteristics in Simulated Electronic Modules
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Topics: Generators, Heat transfer, Vortices, Flow (Dynamics), Heat transfer coefficients, Wakes, Forced convection
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

K. J. Zwick, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 215–219.
https://doi.org/10.1115/1.2792094
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization
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Topics: Flow visualization, Hardening (Curing), Jets, Ovens, Vapors, Vortices, Condensation, Contamination, Flow (Dynamics), Bonding
Journal Articles

Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection

S. V. Garimella, D. J. Schlitz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 410–415.
https://doi.org/10.1115/1.2909350
Published Online: December 1, 1993
View Article titled, Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection
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Topics: Computers, Forced convection, Generators, Temperature, Vortices, Flow (Dynamics), Pressure drop, Reynolds number, Coolants, Cooling
Journal Articles

An Experimental Study of Natural Convection From an Array of Heated Protrusions on a Vertical Surface in Water

Y. Joshi, T. Willson, S. J. Hazard, III
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 121–128.
https://doi.org/10.1115/1.3226516
Published Online: June 1, 1989
View Article titled, An Experimental Study of Natural Convection From an Array of Heated Protrusions on a Vertical Surface in Water
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Topics: Natural convection, Water, Fluids, Transients (Dynamics), Accounting, Energy dissipation, Flow (Dynamics), Heat transfer, Probes, Steady state