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Journal Articles

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Hao Cheng, Yang Peng, Yun Mou, Qinglei Sun, Mingxiang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041003.
Paper No: EP-18-1070
https://doi.org/10.1115/1.4043645
Published Online: May 24, 2019
View Article titled, Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
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Topics: Cements (Adhesives), Ceramics, Dams, Manufacturing, Reliability, Shear strength, Low temperature, Molding, Temperature, Viscosity
Journal Articles

Reliability Considerations for Oil Immersion-Cooled Data Centers

Jimil M. Shah, Richard Eiland, Pavan Rajmane, Ashwin Siddarth, Dereje Agonafer, Veerendra Mulay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021007.
Paper No: EP-18-1050
https://doi.org/10.1115/1.4042979
Published Online: April 10, 2019
View Article titled, Reliability Considerations for Oil Immersion-Cooled Data Centers
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Topics: Cooling, Data centers, Mineral oil, Printed circuit boards, Reliability, Temperature, Testing, Capacitors, Viscosity
Journal Articles

An Experimental Study on Heat Transfer Enhancement of Non-Newtonian Fluid in a Rectangular Channel With Dimples/Protrusions

Di Zhang, Lu Zheng, Gongnan Xie, Yonghui Xie
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021005.
Paper No: EP-13-1079
https://doi.org/10.1115/1.4025713
Published Online: April 29, 2014
View Article titled, An Experimental Study on Heat Transfer Enhancement of Non-Newtonian Fluid in a Rectangular Channel With Dimples/Protrusions
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Topics: Flow (Dynamics), Fluids, Heat transfer, Non-Newtonian fluids, Viscosity, Friction, Shear (Mechanics)
Journal Articles

Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection

Yasutada Nakagawa, Ryohei Yokoyama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011005.
https://doi.org/10.1115/1.4005954
Published Online: March 19, 2012
View Article titled, Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection
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Topics: Hardening (Curing), Heating, Optimization, Temperature, Viscosity, Anisotropy
Journal Articles

Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards

M. O. Özdemir, H. Yüncü
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031006.
https://doi.org/10.1115/1.4004097
Published Online: September 14, 2011
View Article titled, Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards
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Topics: Flow (Dynamics), Forced convection, Heat, Heat transfer, Lumber, Optimization, Pressure, Pressure drop, Temperature, Laminar flow
Journal Articles

Thermal Conductivity of Diamond-Containing Grease

Hung-En Chou, Shang-Ray Yang, Sea-Fue Wang, James C. Sung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041015.
https://doi.org/10.1115/1.4003002
Published Online: December 9, 2010
View Article titled, Thermal Conductivity of Diamond-Containing Grease
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Topics: Diamonds, Fillers (Materials), Plasma desorption mass spectrometry, Thermal conductivity, Viscosity
Journal Articles

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

Brett Fennell, Sangil Lee, Daniel F. Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041013.
https://doi.org/10.1115/1.4002825
Published Online: December 8, 2010
View Article titled, Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid
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Topics: Flip-chip devices, Flow (Dynamics), Solders, Modeling, Springs, Surface tension, Viscosity, Fluids, Dampers
Journal Articles

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu, Horizon Gitano, Z. M. Ariff, R. Razali, K. A. Ahmad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014502.
https://doi.org/10.1115/1.4000719
Published Online: March 4, 2010
View Article titled, Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement
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Topics: Cavities, Computer simulation, Epoxy adhesives, Epoxy resins, Finite difference methods, Flow (Dynamics), Integrated circuits, Molding, Pressure, Simulation
Journal Articles

Modeling of Resin Flow in Reinforced Dielectric Prepregs

Pavel Simacek, Suresh G. Advani, Kossi Zonvide, Leonard W. Barrett
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021001.
https://doi.org/10.1115/1.2837510
Published Online: April 15, 2008
View Article titled, Modeling of Resin Flow in Reinforced Dielectric Prepregs
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Topics: Copper, Flow (Dynamics), Pressure, Resins, Printed circuit boards, Permeability, Viscosity, Porosity
Journal Articles

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Fang Liu, Guang Meng, Mei Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 266–272.
https://doi.org/10.1115/1.2753910
Published Online: March 15, 2007
View Article titled, Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
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Topics: Damping, Deflection, Dynamics (Mechanics), Springs, Viscoelasticity, Viscosity, Dynamic analysis
Journal Articles

The Role of Fin Geometry in Heat Sink Performance

W. A. Khan, J. R. Culham, M. M. Yovanovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 324–330.
https://doi.org/10.1115/1.2351896
Published Online: February 24, 2006
View Article titled, The Role of Fin Geometry in Heat Sink Performance
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Topics: Drag (Fluid dynamics), Entropy, Geometry, Heat sinks, Heat transfer, Reynolds number, Thermal resistance, Heat transfer coefficients, Viscosity
Journal Articles

An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature

Peter Rodgers, Vale´rie Eveloy, M. S. J. Hashmi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 67–75.
https://doi.org/10.1115/1.1849234
Published Online: March 21, 2005
View Article titled, An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature
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Topics: Computational fluid dynamics, Flow (Dynamics), Heat transfer, Junctions, Modeling, Temperature, Turbulence, Viscosity, Eddies (Fluid dynamics), Air flow
Journal Articles

Time-Dependent Rheological Behavior of Fluids For Electronics Packaging

X. B. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 370–374.
https://doi.org/10.1115/1.2056568
Published Online: March 9, 2005
View Article titled, Time-Dependent Rheological Behavior of Fluids For Electronics Packaging
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Topics: Die cutting, Electronic packaging, Fluids, Rheology, Shearing (Deformation), Viscosity, Shear rate, Flow (Dynamics), Adhesives
Journal Articles

Simulation of Void Growth in Molten Solder Bumps

Ronald L. Panton, Fellow ASME, Jong W. Lee, Lakhi Goenka, Achyuta Achari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 329–334.
https://doi.org/10.1115/1.1569954
Published Online: September 17, 2003
View Article titled, Simulation of Void Growth in Molten Solder Bumps
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Topics: Bubbles, Melting, Solders, Flow (Dynamics), Surface tension, Viscosity, Temperature
Journal Articles

Study of P-V-T-C Relation of EMC

Yi-San Chang, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 371–373.
https://doi.org/10.1115/1.1498266
Published Online: December 12, 2002
View Article titled, Study of P-V-T-C Relation of EMC
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Topics: Differential scanning calorimetry, Molding, Pressure, Shrinkage (Materials), Temperature, Thermal expansion, Epoxy resins, Chemical kinetics, Viscosity
Journal Articles

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

L. Nguyen, C. Quentin, W. Lee, S. Bayyuk, S. A. Bidstrup-Allen, S.-T. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 138–146.
https://doi.org/10.1115/1.483146
Published Online: September 21, 1999
View Article titled, Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding
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Topics: Cavities, Flow (Dynamics), Molding, Pressure, Simulation, Temperature, Transfer molding, Viscosity, Computer simulation, Computer software
Journal Articles

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Sejin Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 20–27.
https://doi.org/10.1115/1.483127
Published Online: August 17, 1999
View Article titled, Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation
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Topics: Cavities, Flow (Dynamics), Hardening (Curing), Molding, Packing (Shipments), Packings (Cushioning), Pressure, Semiconductors (Materials), Temperature, Viscosity
Journal Articles

Study of Print Release Process in Solder Paste Printing

C. Sahay, L. M. Head, R. Shereen, P. Dujari, J. H. Constable, G. Westby
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 230–234.
https://doi.org/10.1115/1.2792097
Published Online: September 1, 1995
View Article titled, Study of Print Release Process in Solder Paste Printing
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Topics: Printing, Solders, Shear strength, Boundary layers, Density, Dimensions, Reflow soldering, Separation (Technology), Shear (Mechanics), Surface mount technology
Journal Articles

Thermal Model of a PC

Ronald L. Linton, D. Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 134–137.
https://doi.org/10.1115/1.2905501
Published Online: June 1, 1994
View Article titled, Thermal Model of a PC
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Topics: Air flow, Computers, Convection, Cooling, Electronic packages, Flow (Dynamics), Geometry, Modeling, Simulation, Temperature