Topics: Semiconductor wafers, Shrinkage (Materials), Temperature, Warping, Molding, Manufacturing, Epoxy resins, Packaging, Epoxy adhesives

Topics: Ball-Grid-Array packages, Delamination, Flip-chip, Flip-chip devices, Fracture (Materials), Shrinkage (Materials), Stress, Temperature, Epoxy resins, Molding

Topics: Epoxy resins, Finite element analysis, Molding, Shrinkage (Materials), Warping, Thermal expansion, Temperature, Fillers (Materials)

Topics: Shrinkage (Materials), Simulation, Warping, Temperature

Topics: Adhesives, Hardening (Curing), Shrinkage (Materials), Ultraviolet radiation, Ultraviolet cured adhesives, Optical measurement

Topics: Differential scanning calorimetry, Molding, Pressure, Shrinkage (Materials), Temperature, Thermal expansion, Epoxy resins, Chemical kinetics, Viscosity

Topics: Hardening (Curing), Relaxation (Physics), Shrinkage (Materials), Stress, Modeling, Flip-chip devices, Polymers, Storage, Deformation

Topics: Coatings, Delamination, Optical fiber, Polymers, Thermomechanics, Tension, Fibers, Compressive stress, Composite materials, Hydrostatics

Topics: Shrinkage (Materials), Hardening (Curing), Epoxy resins, Finite element analysis, Stress, Temperature, Constitutive equations, Cooling, Damage, Delamination

Topics: High temperature superconductors, Residual stresses, Thin films, Oxygen, Stress, Dimensions, Shrinkage (Materials), Stoichiometry, Temperature, Thermal expansion

Topics: Laser welding, Lasers, Cooling, Dynamics (Mechanics), Laser beams, Manufacturing, Shrinkage (Materials), Thermal stresses, Waves, Welding

Topics: Deformation, Epoxy adhesives, Epoxy resins, Glass, Hardening (Curing), Laminates, Lamination, Microelectronic devices, Polymerization, Residual stresses

Topics: Aluminum, Bonding, Porosity, Shrinkage (Materials), Alloys, Metals, Density, Solidification, Accounting, Geometry