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Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011005.
Paper No: EP-20-1097
https://doi.org/10.1115/1.4049813
Published Online: August 6, 2021
View Article titled, Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals
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Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering
Journal Articles

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

D. N. Borza, I. T. Nistea
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041007.
https://doi.org/10.1115/1.4007812
Published Online: November 26, 2012
View Article titled, Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level
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Topics: Deformation, Failure, Printed circuit board assemblies, Screws, Stress, Vibration, Solder joints, Interferometry, Displacement, Boundary-value problems
Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
https://doi.org/10.1115/1.4005956
Published Online: March 19, 2012
View Article titled, Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
Open the PDF for Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test in another window
Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin
Journal Articles

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

Hung-Jen Chang, Jung-Hua Chou, Tao-Chih Chang, Chau-Jie Zhan, Min-Hsiung Hon, Chi-Shiung Hsi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
https://doi.org/10.1115/1.4003989
Published Online: June 23, 2011
View Article titled, Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly
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Topics: Alloys, Ball-Grid-Array packaging, Intermetallic compounds, Lead-free solders, Solder joints, Solders, Tin, Fracture (Materials), Finishes, Printed circuit board assemblies
Journal Articles

Board Level Drop Test Analysis Based on Modal Test and Simulation

Fang Liu, Guang Meng, Mei Zhao, Junfeng Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021007.
https://doi.org/10.1115/1.2912212
Published Online: May 8, 2008
View Article titled, Board Level Drop Test Analysis Based on Modal Test and Simulation
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Topics: Elastic moduli, Simulation, Printed circuit board assemblies, Damping, Design, Boundary-value problems
Journal Articles

CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering

Ismail Fidan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2004, 126(1): 173–176.
https://doi.org/10.1115/1.1646422
Published Online: April 30, 2004
View Article titled, CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering
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Topics: Electronics, Lasers, Manufacturing, Printed circuit board assemblies, Reliability, Soldering, Solders, Computer-aided engineering, Production planning, Solder joints
Journal Articles

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

John H. Lau, Fellow ASME, S. W. Ricky Lee, Stephen H. Pan, Chris Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 205–211.
https://doi.org/10.1115/1.1462626
Published Online: July 26, 2002
View Article titled, Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications
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Topics: Creep, Flip-chip devices, Solder joints, Solders, Flip-chip, Printed circuit board assemblies
Journal Articles

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

John H. Lau, Fellow ASME, Stephen H. Pan, Chris Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 69–76.
https://doi.org/10.1115/1.1400995
Published Online: May 2, 2002
View Article titled, Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board
Open the PDF for Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board in another window
Topics: Creep, Solder joints, Lead-free solders, Solders, Shear (Mechanics), Corners (Structural elements), Shear stress, Stress, Printed circuit board assemblies, Reliability
Journal Articles

Planning of Component Placement/Insertion Sequence and Feeder Setup in PCB Assembly Using Genetic Algorithm

M. C. Leu, H. Wong, Z. Ji
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 424–432.
https://doi.org/10.1115/1.2909352
Published Online: December 1, 1993
View Article titled, Planning of Component Placement/Insertion Sequence and Feeder Setup in PCB Assembly Using Genetic Algorithm
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Topics: Genetic algorithms, Printed circuit board assemblies, Algorithms, Manufacturing, Machinery
Journal Articles

Application of Linear Assignment Model for Planning of Robotic Printed Circuit Board Assembly

Z. Ji, M. C. Leu, H. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 455–460.
https://doi.org/10.1115/1.2905480
Published Online: December 1, 1992
View Article titled, Application of Linear Assignment Model for Planning of Robotic Printed Circuit Board Assembly
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Topics: Printed circuit board assemblies, Robotics, Manufacturing, Printed circuit boards
Journal Articles

Two-Level Nonlinear Mixed Discrete-Continuous Optimization-Based Design: An Application to Printed Circuit Board Assemblies

S. Praharaj, S. Azarm
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 425–435.
https://doi.org/10.1115/1.2905476
Published Online: December 1, 1992
View Article titled, Two-Level Nonlinear Mixed Discrete-Continuous Optimization-Based Design: An Application to Printed Circuit Board Assemblies
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Topics: Design, Optimization, Printed circuit board assemblies, Algorithms, Flow (Dynamics), Lumber, Manufacturing, Printed circuit boards, Reliability
Journal Articles

Modeling and Performance Analysis of a Flexible PCB Assembly Station Using Petri Nets

MengChu Zhou, Ming C. Leu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 410–416.
https://doi.org/10.1115/1.2905428
Published Online: December 1, 1991
View Article titled, Modeling and Performance Analysis of a Flexible PCB Assembly Station Using Petri Nets
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Topics: Modeling, Printed circuit board assemblies, Manufacturing, Robots, Failure, Printed circuit boards, Synchronization, Systems analysis