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Journal Articles

Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices

Thomas Fellner, Elena Zukowski, Jürgen Wilde, H. Kück, H. Richter, M. Schober, P. Buckmüller

Publisher: ASME

J. Electron. Packag. September 2012, 134(3): 031002.

https://doi.org/10.1115/1.4006927

Published Online: July 18, 2012

View Article titled, Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices

Topics: Creep, Modeling, Press fits, Reliability, Simulation, Stress, Temperature, Deformation, Friction, Manufacturing

Journal Articles

Analysis of Solderless Press-Fit Interconnections During the Assembly Process

Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano

Publisher: ASME

J. Electron. Packag. September 2008, 130(3): 031007.

https://doi.org/10.1115/1.2957330

Published Online: July 30, 2008

View Article titled, Analysis of Solderless Press-Fit Interconnections During the Assembly Process

Topics: Finite element analysis, Manufacturing, Pins (Engineering), Press fits, Stress, Friction

Journal Articles

Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages

Y. Kondo, H. Matsushima, T. Komatsu

Publisher: ASME

J. Electron. Packag. September 2000, 122(3): 240–246.

https://doi.org/10.1115/1.1289761

Published Online: February 15, 2000

View Article titled, Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages

Topics: Cooling, Heat sinks, Optimization, Pins (Engineering), Pressure drop, Thermal resistance, Impingement cooling, Flow (Dynamics), Fins, Flow visualization

Journal Articles

Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors

G. Ganguly, A. Dasgupta

Publisher: ASME

J. Electron. Packag. June 1995, 117(2): 147–152.

https://doi.org/10.1115/1.2792082

Published Online: June 1, 1995

View Article titled, Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors

Topics: Copper, Damage, Deformation, Failure analysis, Finite element analysis, Fourier series, Manufacturing, Materials properties, Pins (Engineering), Printed circuit boards

Journal Articles

Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress

Peter A. Engel, Shou-Chien Chou

Publisher: ASME

J. Electron. Packag. June 1995, 117(2): 136–140.

https://doi.org/10.1115/1.2792080

Published Online: June 1, 1995

View Article titled, Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress

Topics: Deformation, Solder joints, Thermal stresses, Solders, Temperature, Stress, Creep, Pins (Engineering), Stress-strain curves, Tin

Journal Articles

Comparison of LCC Solder Joint Life Predictions With Experimental Data

Liang-chi Wen, Ronald G. Ross, Jr.

Publisher: ASME

J. Electron. Packag. June 1995, 117(2): 109–115.

https://doi.org/10.1115/1.2792076

Published Online: June 1, 1995

View Article titled, Comparison of LCC Solder Joint Life Predictions With Experimental Data

Topics: Solder joints, Algorithms, Pins (Engineering), Stress, Temperature, Failure, Electronic packaging, Fatigue, Ceramics, Computer software

Journal Articles

Effect of Pin Fin Density of the Thermal Performance of Unshrouded Pin Fin Heat Sinks

Kaveh Azar, Carlo D. Mandrone

Publisher: ASME

J. Electron. Packag. December 1994, 116(4): 306–309.

https://doi.org/10.1115/1.2905702

Published Online: December 1, 1994

View Article titled, Effect of Pin Fin Density of the Thermal Performance of Unshrouded Pin Fin Heat Sinks

Topics: Density, Heat sinks, Thermal resistance, Fins, Forced convection, Air flow, Cooling, Flow (Dynamics), Heat transfer coefficients, Pins (Engineering)

Journal Articles

Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Sanjeev Sathe

Publisher: ASME

J. Electron. Packag. September 1994, 116(3): 230–233.

https://doi.org/10.1115/1.2905690

Published Online: September 1, 1994

View Article titled, Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Topics: Cylinders, Electronic packages, Heat conduction, Heat, Thermal conductivity, Aluminum, Copper, Dielectric materials, Dimensions, Electronic equipment

Journal Articles

Development of Hermetic Microminiature Connectors

M. K. Neilsen, L. A. Andrews, S. L. Monroe, H. L. McCollister

Publisher: ASME

J. Electron. Packag. December 1991, 113(4): 405–409.

https://doi.org/10.1115/1.2905427

Published Online: December 1, 1991

View Article titled, Development of Hermetic Microminiature Connectors

Topics: Alloys, Compression, Compressive stress, Design, Engineering prototypes, Finite element analysis, Finite element model, Fracture (Materials), Glass, Manufacturing

Journal Articles

A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging

C. G. Woychik, A. K. Trivedi

Publisher: ASME

J. Electron. Packag. September 1990, 112(3): 223–233.

https://doi.org/10.1115/1.2904371

Published Online: September 1, 1990

View Article titled, A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging

Topics: Nickel, Packaging, Intermetallic compounds, Tin, Gold plating, Alloys, Contamination, Nickel plating, Particulate matter, Pins (Engineering)

Journal citation

NARROW

Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices

Analysis of Solderless Press-Fit Interconnections During the Assembly Process

Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages

Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors

Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress

Comparison of LCC Solder Joint Life Predictions With Experimental Data

Effect of Pin Fin Density of the Thermal Performance of Unshrouded Pin Fin Heat Sinks

Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Development of Hermetic Microminiature Connectors

A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging

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