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Journal Articles

Electroplated Connections Between Carbon Fiber and Nickel

Christopher Bilger, Hugh A. Bruck, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011009.
Paper No: EP-16-1045
https://doi.org/10.1115/1.4035703
Published Online: January 27, 2017
View Article titled, Electroplated Connections Between Carbon Fiber and Nickel
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Topics: Carbon fibers, Nickel, Metals, Carbon, Solders, Batteries, Electroplating
Journal Articles

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

M. K. Md Arshad, I. Ahmad, A. Jalar, G. Omar, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
https://doi.org/10.1115/1.2229223
Published Online: November 29, 2005
View Article titled, The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition
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Topics: Adhesion, Aluminum, Atomic force microscopy, Nickel, Shear strength, Solders, Focused ion beams, Metallurgy, Scanning electron microscopy, X-rays
Journal Articles

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

Jaap M. J. den Toonder, Mem. ASME, Christian W. Rademaker, Ching-Li Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
https://doi.org/10.1115/1.1604151
Published Online: December 15, 2003
View Article titled, Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation
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Topics: Capacitors, Ceramics, Computation, Computer simulation, Cooling, Finite element analysis, Residual stresses, Simulation, Sintering, Stress
Journal Articles

Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles

G. B. Dou, Y. C. Chan, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 609–616.
https://doi.org/10.1115/1.1604808
Published Online: December 15, 2003
View Article titled, Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles
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Topics: Particulate matter, Nickel
Journal Articles

0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding

Xiaoping Shui, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 236–238.
https://doi.org/10.1115/1.2792242
Published Online: December 1, 1997
View Article titled, 0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding
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Topics: Composite materials, Electromagnetic interference, Nickel, Silicones, Cables, Electrical resistivity, Gaskets
Journal Articles

Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors

Mingguang Zhu, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 417–420.
https://doi.org/10.1115/1.2905429
Published Online: December 1, 1991
View Article titled, Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors
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Topics: Composite materials, Fibers, Nickel, Silicones, Electrical resistivity, Compression, Copper, Electromagnetic interference, Gaskets, Heating
Journal Articles

A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging

C. G. Woychik, A. K. Trivedi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 223–233.
https://doi.org/10.1115/1.2904371
Published Online: September 1, 1990
View Article titled, A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging
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Topics: Nickel, Packaging, Intermetallic compounds, Tin, Gold plating, Alloys, Contamination, Nickel plating, Particulate matter, Pins (Engineering)