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Journal Articles

Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling

Fei Qin, Shuai Zhao, Yanwei Dai, Lingyun Liu, Tong An, Pei Chen, Yanpeng Gong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031012.
Paper No: EP-21-1125
https://doi.org/10.1115/1.4053028
Published Online: December 27, 2021
View Article titled, Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling
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Topics: Cycles, Nanoindentation, Silver, Stress, Young's modulus, Stress-strain curves
Journal Articles

Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation

Zuozhu Yin, Fenglian Sun, Mengjiao Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021004.
Paper No: EP-18-1042
https://doi.org/10.1115/1.4045980
Published Online: February 4, 2020
View Article titled, Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation
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Topics: Elastic moduli, Intermetallic compounds, Temperature, Tin, Nanoindentation
Journal Articles

Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation

Muhammad Sadiq, Jean-Sebastien Lecomte, Mohammed Cherkaoui
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031005.
Paper No: EP-13-1135
https://doi.org/10.1115/1.4029836
Published Online: September 1, 2015
View Article titled, Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation
Open the PDF for Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation in another window
Topics: Alloys, Mechanical properties, Nanoindentation, Temperature, Tin, Young's modulus, Lead-free solders
Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Leila Ladani, Ousama Abdelhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014501.
Paper No: EP-13-1116
https://doi.org/10.1115/1.4027992
Published Online: October 6, 2014
View Article titled, Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
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Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress
Journal Articles

The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations

Ningbo Liao, Ping Yang, Miao Zhang, Wei Xue
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020901.
https://doi.org/10.1115/1.4003513
Published Online: June 7, 2011
View Article titled, The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations
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Topics: Mechanical properties, Nanoindentation, Simulation, Young's modulus, Molecular dynamics simulation, Heat transfer
Journal Articles

Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Mohd F. Abdulhamid, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
https://doi.org/10.1115/1.3068296
Published Online: February 11, 2009
View Article titled, Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties
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Topics: Annealing, Lead-free solders, Mechanical properties, Solder joints, Solders, Temperature gradient, Tin, Testing, Elastic moduli, Nanoindentation
Journal Articles

Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys

Juan Gomez, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 120–128.
https://doi.org/10.1115/1.2721082
Published Online: October 4, 2006
View Article titled, Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys
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Topics: Alloys, Nanoindentation, Plasticity, Solders, Strain gradient, Microelectronic devices
Journal Articles

A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls

Tadahiro Shibutani, Qiang Yu, Masaki Shiratori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 71–75.
https://doi.org/10.1115/1.2429712
Published Online: May 12, 2006
View Article titled, A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls
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Topics: Creep, Nanoindentation, Solders, Stress, Deformation, Diffusion (Physics)
Journal Articles

Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film

V. Gonda, J. den Toonder, J. Beijer, G. Q. Zhang, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 33–37.
https://doi.org/10.1115/1.1846065
Published Online: March 21, 2005
View Article titled, Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film
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Topics: Polymer films, Thin films, Testing, Creep, Nanoindentation, Stress, Temperature, Viscoelasticity
Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2005, 127(4): 530–536.
https://doi.org/10.1115/1.2070092
Published Online: December 22, 2004
View Article titled, State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
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Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics
Journal Articles

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Changqing Liu, Paul Conway, Dezhi Li, Michael Hendriksen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 359–366.
https://doi.org/10.1115/1.1773391
Published Online: October 6, 2004
View Article titled, Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints
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Topics: Flip-chip, Nanoindentation, Shear (Mechanics), Solders, Tin, Flip-chip devices, Intermetallic compounds, Testing, Reliability, Shear strength
Journal Articles

Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling

J. M. J. den Toonder, Y. Ramone, A. R. van Dijken, J. G. J. Beijer, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 276–285.
https://doi.org/10.1115/1.1938990
Published Online: August 12, 2004
View Article titled, Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling
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Topics: Creep, Finite element analysis, Modeling, Nanoindentation, Stress, Viscoelasticity, Manganese (Metal), Silicon, Relaxation (Physics), Displacement
Journal Articles

Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation

Mithilesh Shah, Kaiyang Zeng, Andrew A. O. Tay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 87–93.
https://doi.org/10.1115/1.1648062
Published Online: April 30, 2004
View Article titled, Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation
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Topics: Heat, Nanoindentation, Recrystallization, Stress, Wire, Secondary ion mass spectrometry, Temperature, Bonding, Elastic moduli, Manganese (Metal)