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Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Article titled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2014, 136(4): 040801.
Paper No: EP-14-1068
https://doi.org/10.1115/1.4028629
Published Online: October 15, 2014
View Article titled, Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
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Topics: Integrated circuit packaging, Manufacturing, Semiconductor wafers, Supply chains, Wire bonding, Packaging, Integrated circuits, Bonding
Journal Articles

Mechanical Design of Electronic Systems

John H. L. Pang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
https://doi.org/10.1115/1.4000755
Published Online: March 19, 2010
View Article titled, Mechanical Design of Electronic Systems
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Topics: Circuits, Design, Design engineering, Electronic systems, Reliability, Testing, Integrated circuits, Circuit design, Integrated circuit packaging, Life testing
Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
https://doi.org/10.1115/1.2753908
Published Online: April 16, 2007
View Article titled, Flexible Profile Compact Thermal Models for Practical Geometries
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Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability
Journal Articles

Three-Dimensional Paddle Shift Modeling for IC Packaging

Chien-Chang Pei, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
https://doi.org/10.1115/1.1938986
Published Online: December 2, 2004
View Article titled, Three-Dimensional Paddle Shift Modeling for IC Packaging
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Topics: Computation, Deflection, Flow (Dynamics), Fluid dynamics, Geometry, Integrated circuit packaging, Integrated circuits, Mesh generation, Modeling, Molding
Journal Articles

Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Hung-Lung Lee, Shyang-Jye Chang, Sheng-Jye Hwang, Associate Professor,, Francis Su, S. K. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 268–275.
https://doi.org/10.1115/1.1569957
Published Online: June 10, 2003
View Article titled, Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance
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Topics: Computer-aided design, Design, Design methodology, Flow (Dynamics), Taguchi methods, Noise factors, Molding, Packaging, Simulation, Manufacturing
Journal Articles

An Efficient Solution for Wire Sweep Analysis in IC Packaging

Jerry Su, Sheng-Jye Hwang, Associate Professor, Francis Su, Shou-Kang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 139–143.
https://doi.org/10.1115/1.1535447
Published Online: March 14, 2003
View Article titled, An Efficient Solution for Wire Sweep Analysis in IC Packaging
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Topics: Wire, Flow (Dynamics), Integrated circuits, Integrated circuit packaging
Journal Articles

Special Issue on Poly’2000, London

Bernd Michel,, Guest Editor, Poly’2000 Co-chair, Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2002, 124(4): 317.
https://doi.org/10.1115/1.1497626
Published Online: December 12, 2002
View Article titled, Special Issue on Poly’2000, London
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Topics: Adhesion, Adhesives, Fracture mechanics, Integrated circuit packaging, Packaging, Polymers, Reliability, Stress, Thermal management, Workshops (Work spaces)
Journal Articles

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Sheng Chang and, Fu-Pen Chiang, Yifan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
https://doi.org/10.1115/1.1481367
Published Online: July 26, 2002
View Article titled, Measurement of Thermal Deformation of Interconnect Layers Using SIEM
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Topics: Deformation, Dielectric materials, Displacement, Electron microscopy, Interferometry, Packaging, Reliability, Resolution (Optics), Thermal deformation, Thermal expansion
Journal Articles

Foreword

Marta Rencz ,, Guest Editor, Clemens Lasance ,, Guest Editor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 321–322.
https://doi.org/10.1115/1.1389845
Published Online: December 1, 2001
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Topics: Integrated circuit packaging, Integrated circuits, Micromechanical devices, Modeling, Packaging, Thermal management, Workshops (Work spaces)
Journal Articles

Mechanical Analysis of Electronic Packaging Systems

Stephen A. McKeown,, Author, A. J. Rafanelli,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2000, 122(1): 73.
https://doi.org/10.1115/1.483132
Published Online: March 1, 2000
View Article titled, Mechanical Analysis of Electronic Packaging Systems
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Topics: Electronic packaging, Engineering education, Integrated circuit packaging, Packaging
Journal Articles

Lead-On-Chip Versus Chip-On-Lead Packages and Solder Failure Criteria

Boris Mirman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2000, 122(3): 279–280.
https://doi.org/10.1115/1.1286105
Published Online: January 9, 2000
View Article titled, Lead-On-Chip Versus Chip-On-Lead Packages and Solder Failure Criteria
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Topics: Failure, Reliability, Solders, Stress, Molding, Solder joints, Thermal stresses, Integrated circuits, Failure analysis, Integrated circuit packaging