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Journal Articles

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals

Abhishek Deshpande, Aniket Bharamgonda, Qian Jiang, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041102.
Paper No: EP-23-1038
https://doi.org/10.1115/1.4063325
Published Online: October 5, 2023
View Article titled, Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals
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Topics: Anisotropy, Cooling, Crystals, Finite element analysis, Grain size, Shear (Mechanics), Solder joints, Solders, Stress, Tin
Journal Articles

Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

Etienne L. Bonnaud
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041013.
https://doi.org/10.1115/1.4005451
Published Online: December 19, 2011
View Article titled, Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations
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Topics: Engineering simulation, Failure, Hardening, Lead-free solders, Simulation, Solder joints, Solders, Stress, Finite element analysis
Journal Articles

Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156)

M. Dube, T. Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Discussions
J. Electron. Packag. December 2011, 133(4): 045502.
https://doi.org/10.1115/1.4000902
Published Online: November 17, 2011
View Article titled, Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156)
Open the PDF for Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156) in another window
Topics: Electrons, Solders, Hardening
Journal Articles

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011005.
https://doi.org/10.1115/1.4000754
Published Online: March 4, 2010
View Article titled, Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
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Topics: Constitutive equations, Creep, Density, Fatigue, Finite element methods, Hardening, Lead-free solders, Modeling, Reliability, Semiconductor wafers
Journal Articles

Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder

Gang Chen, Xu Chen, Kwang Soo Kim, Mohammad Abdel-Karim, Masao Sakane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 278–286.
https://doi.org/10.1115/1.2753917
Published Online: July 20, 2006
View Article titled, Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder
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Topics: Constitutive equations, Hardening, Kinematics, Shear (Mechanics), Solders, Stress, Deformation
Journal Articles

A Damage-Mechanics-Based Constitutive Model for Solder Joints

C. Basaran, Y. Zhao, H. Tang, J. Gomez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 208–214.
https://doi.org/10.1115/1.1939822
Published Online: July 23, 2004
View Article titled, A Damage-Mechanics-Based Constitutive Model for Solder Joints
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Topics: Constitutive equations, Creep, Damage, Flow (Dynamics), Hardening, Kinematics, Solder joints, Solders, Stress, Temperature
Journal Articles

Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy

Qiang Xiao, Harold J. Bailey, William D. Armstrong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 208–212.
https://doi.org/10.1115/1.1756144
Published Online: July 8, 2004
View Article titled, Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy
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Topics: Alloys, Solders, Temperature, Eutectic alloys, Lead-free solders, Tin, Hardening, Tensile strength
Journal Articles

Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

Xianjie Yang, C. L. Chow, K. J. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 148–158.
https://doi.org/10.1115/1.1649246
Published Online: April 30, 2004
View Article titled, Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
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Topics: Algorithms, Computer simulation, Constitutive equations, Damage, Hardening, Shear (Mechanics), Solders, Stress, Viscoplasticity, Finite element analysis
Journal Articles

A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys

Z. Qian, W. Ren, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 162–168.
https://doi.org/10.1115/1.2792679
Published Online: September 1, 1999
View Article titled, A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys
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Topics: Alloys, Damage, Fatigue, Solders, Viscoplasticity, Constitutive equations, Creep, Damage mechanics, Deformation, Elasticity
Journal Articles

A Model Study of Thermal Stress-Induced Voiding in Electronic Packages

Y. Huang, K. X. Hu, C. P. Yeh, N.-Y. Li, K. C. Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 229–234.
https://doi.org/10.1115/1.2792157
Published Online: December 1, 1996
View Article titled, A Model Study of Thermal Stress-Induced Voiding in Electronic Packages
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Topics: Electronic packages, Stress, Cavitation, Solids, Adhesives, Design, Failure mechanisms, Hardening, Hydrostatics, Integrated circuits
Journal Articles

A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate

Y. F. Luo, K. P. Rajurkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 201–207.
https://doi.org/10.1115/1.2792092
Published Online: September 1, 1995
View Article titled, A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate
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Topics: Bonding, Micromechanics (Engineering), Strips, Separation (Technology), Adhesion, Brittleness, Deformation, Hardening, Heat treating (Metalworking), Manufacturing
Journal Articles

Ramberg-Osgood Parameters for 63–37 Sn-Pb Solder

A. J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 234–238.
https://doi.org/10.1115/1.2906423
Published Online: June 1, 1992
View Article titled, Ramberg-Osgood Parameters for 63–37 Sn-Pb Solder
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Topics: Solders, Tin, Fracture toughness, Hardening, Stress, Work hardening
Journal Articles

Micromechanical Method to Predict Fatigue Life of Solder

A. Zubelewicz, Q. Guo, E. C. Cutiongco, M. E. Fine, L. M. Keer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 179–182.
https://doi.org/10.1115/1.2904360
Published Online: June 1, 1990
View Article titled, Micromechanical Method to Predict Fatigue Life of Solder
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Topics: Fatigue life, Solders, Fatigue, Tension, Constitutive equations, Hardening, Stress