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Journal Articles

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu, Horizon Gitano, Z. M. Ariff, R. Razali, K. A. Ahmad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014502.
https://doi.org/10.1115/1.4000719
Published Online: March 4, 2010
View Article titled, Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement
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Topics: Cavities, Computer simulation, Epoxy adhesives, Epoxy resins, Finite difference methods, Flow (Dynamics), Integrated circuits, Molding, Pressure, Simulation
Journal Articles

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Changsoo Jang, Seungbae Park, Bongtae Han, Samson Yoon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011004.
https://doi.org/10.1115/1.2837521
Published Online: January 31, 2008
View Article titled, Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
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Topics: Diffusion (Physics), Temperature, Transients (Dynamics), Finite difference methods
Journal Articles

Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process

Kang Yong Lee, Taek Sung Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 148–155.
https://doi.org/10.1115/1.2792677
Published Online: September 1, 1999
View Article titled, Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process
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Topics: Fracture (Materials), Fracture (Process), Reflow soldering, Delamination, Design, Finite difference methods, Fracture mechanics, Heating, Integrated circuits, Shapes
Journal Articles

Transient Natural Convection From a Leadless Chip Carrier in a Liquid Filled Enclosure: A Numerical Study

D. Wroblewski, Y. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 271–279.
https://doi.org/10.1115/1.2905451
Published Online: September 1, 1992
View Article titled, Transient Natural Convection From a Leadless Chip Carrier in a Liquid Filled Enclosure: A Numerical Study
Open the PDF for Transient Natural Convection From a Leadless Chip Carrier in a Liquid Filled Enclosure: A Numerical Study in another window
Topics: Natural convection, Transients (Dynamics), Fluids, Temperature, Heat conduction, Heat, Coolants, Flow (Dynamics), Plumes (Fluid dynamics), Steady state