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Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules

Ram C. Adhikari, Dawood S. Beyragh, Majid Pahlevani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031008.
Paper No: EP-20-1100
https://doi.org/10.1115/1.4049577
Published Online: February 19, 2021
View Article titled, Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules
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Topics: Deflection, Design, Finite element analysis, Light-emitting diodes, Manufacturing, Stress, Testing, Simulation, Finite element model, Engineering prototypes
Journal Articles

Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design

Bryce P. DeFigueiredo, Trent K. Zimmerman, Brian D. Russell, Larry L. Howell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041001.
Paper No: EP-17-1120
https://doi.org/10.1115/1.4040552
Published Online: July 3, 2018
View Article titled, Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design
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Topics: Design, Hinges, Printed circuit boards, Stiffness, Stress, Deflection, Finite element analysis, Engineering prototypes, Materials properties
Journal Articles

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Wei Chen, Anirudh Bhat, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041005.
Paper No: EP-14-1064
https://doi.org/10.1115/1.4031680
Published Online: October 12, 2015
View Article titled, Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages
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Topics: Displacement, Manufacturing, Polymers, Simulation, Testing, Accelerometers, Engineering simulation, Strain gages, Finite element analysis, Engineering prototypes
Journal Articles

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

Yueguang Deng, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031009.
https://doi.org/10.1115/1.4002012
Published Online: September 9, 2010
View Article titled, Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs
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Topics: Cooling, Design, Energy dissipation, Heat, Liquid metals, Pumps, Thermal resistance, Water, Flow (Dynamics), Engineering prototypes
Journal Articles

Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors

Brent L. Weight, Christopher A. Mattson, Spencer P. Magleby, Larry L. Howell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 236–246.
https://doi.org/10.1115/1.2721080
Published Online: July 25, 2006
View Article titled, Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors
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Topics: Design, Engineering prototypes, Modeling, Optimization, Testing, Displacement, Manufacturing, Deflection, Wear
Journal Articles

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Ning Zheng, R. A. Wirtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 1–7.
https://doi.org/10.1115/1.1646419
Published Online: April 30, 2004
View Article titled, A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology
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Topics: Design, Engineering prototypes, Heat, Heat sinks, Latent heat, Storage, Temperature, Thermal conductivity, Thermal energy storage, Interfacial thermal resistance
Journal Articles

A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

Yu-Wen Huang, K. Srihari, Jim Adriance, George Westby
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 282–289.
https://doi.org/10.1115/1.2905699
Published Online: December 1, 1994
View Article titled, A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem
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Topics: Surface mount packaging, Engineering prototypes, Lumber, Machinery, Manufacturing, Nozzles, Printed circuit boards, Surface mount components, Tooling
Journal Articles

Development of Hermetic Microminiature Connectors

M. K. Neilsen, L. A. Andrews, S. L. Monroe, H. L. McCollister
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 405–409.
https://doi.org/10.1115/1.2905427
Published Online: December 1, 1991
View Article titled, Development of Hermetic Microminiature Connectors
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Topics: Alloys, Compression, Compressive stress, Design, Engineering prototypes, Finite element analysis, Finite element model, Fracture (Materials), Glass, Manufacturing
Journal Articles

Fatigue Properties of Microelectronics Solder Joints

N. Nir, T. D. Dudderar, C. C. Wong, A. R. Storm
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 92–101.
https://doi.org/10.1115/1.2905390
Published Online: June 1, 1991
View Article titled, Fatigue Properties of Microelectronics Solder Joints
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Topics: Fatigue properties, Microelectronic devices, Solder joints, Shear (Mechanics), Tin, Vehicles, Computers, Design, Engineering prototypes, Failure
Journal Articles

Automated Electronic Circuit Manufacturing Using Ink-Jet Technology

D. B. Wallace
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 108–111.
https://doi.org/10.1115/1.3226514
Published Online: June 1, 1989
View Article titled, Automated Electronic Circuit Manufacturing Using Ink-Jet Technology
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Topics: Circuits, Inks, Manufacturing, Copper, Paraffin wax, Computer-aided design, Computers, Engineering prototypes