1-20 of 63
Electronic packages
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
https://doi.org/10.1115/1.4056445
Published Online: December 23, 2022
View Article titled, Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
Open the PDF for Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies in another window
Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles
Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041108.
Paper No: EP-21-1037
https://doi.org/10.1115/1.4052711
Published Online: November 2, 2021
View Article titled, Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies
Open the PDF for Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies in another window
Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing
Journal Articles

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Patrick Krane, David Gonzalez Cuadrado, Francisco Lozano, Guillermo Paniagua, Amy Marconnet
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011008.
Paper No: EP-20-1121
https://doi.org/10.1115/1.4050200
Published Online: August 6, 2021
View Article titled, Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods
Open the PDF for Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods in another window
Topics: Electronic packages, Heat, Temperature, Errors, Heat conduction
Journal Articles

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
https://doi.org/10.1115/1.4043406
Published Online: May 8, 2019
View Article titled, Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages
Open the PDF for Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages in another window
Topics: Cooling, Flow (Dynamics), Heat, Heat sinks, Temperature, Geometry, Coolants, Fins, Silicon, Electronic packages
Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
https://doi.org/10.1115/1.4028641
Published Online: March 1, 2015
View Article titled, Stress–Strain Behavior of SAC305 at High Strain Rates
Open the PDF for Stress–Strain Behavior of SAC305 at High Strain Rates in another window
Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)
Journal Articles

On-Chip Power Generation Using Ultrathin Thermoelectric Generators

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011005.
Paper No: EP-14-1012
https://doi.org/10.1115/1.4027995
Published Online: October 6, 2014
View Article titled, On-Chip Power Generation Using Ultrathin Thermoelectric Generators
Open the PDF for On-Chip Power Generation Using Ultrathin Thermoelectric Generators in another window
Topics: Electronic packages, Energy generation, Generators, Heat flux, Junctions, Stress, Temperature, Waste heat, Transients (Dynamics)
Journal Articles

3D Compact Model of Packaged Thermoelectric Coolers

Owen Sullivan, Borislav Alexandrov, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031006.
Paper No: EP-13-1006
https://doi.org/10.1115/1.4024653
Published Online: June 24, 2013
View Article titled, 3D Compact Model of Packaged Thermoelectric Coolers
Open the PDF for 3D Compact Model of Packaged Thermoelectric Coolers in another window
Topics: Thermoelectric coolers, Cooling, Electronic packages, Steady state, Flat heat pipes
Journal Articles

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

B. Xie, X. J. Fan, X. Q. Shi, H. Ding
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031010.
https://doi.org/10.1115/1.3144147
Published Online: July 31, 2009
View Article titled, Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
Open the PDF for Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation in another window
Topics: Diffusion (Physics), Modeling, Temperature, Vapor pressure, Electronic packages
Journal Articles

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Jin Yang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
https://doi.org/10.1115/1.3068301
Published Online: February 18, 2009
View Article titled, Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals
Open the PDF for Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals in another window
Topics: Electronic packages, Flip-chip devices, Lasers, Signals, Solders, Tin, Ultrasound, Vehicles, X-rays, Inspection
Journal Articles

Integrating Compact Thermal Models in CFD Simulations of Electronic Packages

Rohit Dev Gupta, Vinayak Eswaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021002.
https://doi.org/10.1115/1.2837511
Published Online: April 15, 2008
View Article titled, Integrating Compact Thermal Models in CFD Simulations of Electronic Packages
Open the PDF for Integrating Compact Thermal Models in CFD Simulations of Electronic Packages in another window
Topics: Computational fluid dynamics, Electronic packages, Flow (Dynamics), Junctions, Simulation, Temperature, Heat transfer, Computation, Heat, Boundary-value problems
Journal Articles

Submodeling Analysis for Path-Dependent Thermomechanical Problems

Tong Hong Wang, Yi-Shao Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 135–140.
https://doi.org/10.1115/1.1869513
Published Online: September 28, 2004
View Article titled, Submodeling Analysis for Path-Dependent Thermomechanical Problems
Open the PDF for Submodeling Analysis for Path-Dependent Thermomechanical Problems in another window
Topics: Fatigue, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Strips, Electronic packages
Journal Articles

The Moulded Electronic Package (MEP)

David J. J. Lowrie
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 34–36.
https://doi.org/10.1115/1.1646424
Published Online: April 30, 2004
View Article titled, The Moulded Electronic Package (MEP)
Open the PDF for The Moulded Electronic Package (MEP) in another window
Topics: Electronic packages, Circuits
Journal Articles

Three- and Four-Point Bend Testing for Electronic Packages

Santosh Shetty, Tommi Reinikainen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 556–561.
https://doi.org/10.1115/1.1604158
Published Online: December 15, 2003
View Article titled, Three- and Four-Point Bend Testing for Electronic Packages
Open the PDF for Three- and Four-Point Bend Testing for Electronic Packages in another window
Topics: Printed circuit boards, Reliability, Simulation, Solder joints, Stress, Testing, Electronic packages, Failure
Journal Articles

Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages

Michael C. Larson, Mem. ASME, Melody A. Verges, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 18–23.
https://doi.org/10.1115/1.1520430
Published Online: March 14, 2003
View Article titled, Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages
Open the PDF for Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages in another window
Topics: Compression, Die cutting, Fatigue cracks, Fatigue life, Fracture (Materials), Printed circuit boards, Shear (Mechanics), Shearing (Deformation), Solders, Stress
Journal Articles

Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips

Sergey Shkarayev, Mem. ASME,, Sergey Savastiouk, Oleg Siniaguine
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 98–103.
https://doi.org/10.1115/1.1535932
Published Online: March 14, 2003
View Article titled, Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips
Open the PDF for Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips in another window
Topics: Design, Reliability, Stress, Electronic packages, Corners (Structural elements), Event history analysis, Solders
Journal Articles

Validation of Electronic Package Reliability Using Speckle Interferometry

H.-Y. Yeh, K. Cote
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 277–280.
https://doi.org/10.1115/1.1478060
Published Online: July 26, 2002
View Article titled, Validation of Electronic Package Reliability Using Speckle Interferometry
Open the PDF for Validation of Electronic Package Reliability Using Speckle Interferometry in another window
Topics: Creep, Displacement measurement, Electronic packages, Electronic speckle pattern interferometry, Interferometry, Reliability, Thermal expansion, Solder joints, Temperature, Cycles
Journal Articles

Applications of a Decomposed Analysis Procedure for Area-Array Packages

Terrace B. Thompson, Ganesh Subbarayan, Associate Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 132–140.
https://doi.org/10.1115/1.1339197
Published Online: September 14, 2000
View Article titled, Applications of a Decomposed Analysis Procedure for Area-Array Packages
Open the PDF for Applications of a Decomposed Analysis Procedure for Area-Array Packages in another window
Topics: Displacement, Electronic packages, Errors, Finite element analysis, Optimization, Shear (Mechanics), Solder joints, Solders, Finite element model
Journal Articles

Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

J. R. Culham, Associate Professor and Director, Mem. ASME,, M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,, T. F. Lemczyk, Project Engineer,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 233–239.
https://doi.org/10.1115/1.1287928
Published Online: September 1, 2000
View Article titled, Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
Open the PDF for Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution in another window
Topics: Boundary-value problems, Cavities, Electronic packages, Fourier series, Multi-chip modules, Temperature, Thermal characterization, Laplace equations, Modeling, Junctions
Journal Articles

Handbook of Electronic Package Design

Michael Pecht,, Editor, Anthony J. Rafanelli,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 2000, 122(2): 178–179.
https://doi.org/10.1115/1.483153
Published Online: June 1, 2000
View Article titled, Handbook of Electronic Package Design
Open the PDF for Handbook of Electronic Package Design in another window
Topics: Design, Electronic packages, Thermal management, Printed circuit boards, Packaging
Journal Articles

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Yong Du, Jie-Hua Zhao, Paul Ho
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 196–199.
https://doi.org/10.1115/1.1347987
Published Online: March 21, 2000
View Article titled, An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling
Open the PDF for An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling in another window
Topics: Electronic packages, Finite element analysis, Laser beams, Temperature, Flip-chip packages, Warping, Thermal expansion, Deformation, Lasers, Packaging