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Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
https://doi.org/10.1115/1.4054183
Published Online: April 22, 2022
View Article titled, Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress
Includes: Supplementary data
Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Article titled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Journal Articles

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

R. I. Okereke, S. K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031006.
Paper No: EP-14-1030
https://doi.org/10.1115/1.4030065
Published Online: September 1, 2015
View Article titled, Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics
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Topics: Dimensions, Electrical resistance, Fatigue life, Manufacturing, Solders, Stress, Warping, Cycles, Signals, Thermomechanics
Journal Articles

Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener

Hiromasa Teshima, Kohei Kojima, Yang Ju
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2014, 136(4): 044501.
Paper No: EP-13-1132
https://doi.org/10.1115/1.4028316
Published Online: September 19, 2014
View Article titled, Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener
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Topics: Aluminum, Bonding, Manufacturing, Nanowires, Fasteners, Electrical resistance
Journal Articles

Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance

B. Fiedler, M. Fine, K. Kao, L. Keer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031006.
https://doi.org/10.1115/1.4006708
Published Online: July 18, 2012
View Article titled, Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance
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Topics: Ball-Grid-Array packaging, Electrical resistance, Fracture (Materials), Shear (Mechanics), Stress, Cycles, Fatigue cracks, Failure, Fatigue, Shear stress
Journal Articles

Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface

Tan Chee Wei, Abdul Razak Daud
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 617–620.
https://doi.org/10.1115/1.1604809
Published Online: December 15, 2003
View Article titled, Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface
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Topics: Intermetallic compounds, Bonding, Copper, Shear (Mechanics), Electrical properties, Electrical resistance, Wire bonding, Wire
Journal Articles

Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate

Johan Liu, Zonghe Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 240–245.
https://doi.org/10.1115/1.1478059
Published Online: July 26, 2002
View Article titled, Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate
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Topics: Adhesive joints, Adhesives, Contact resistance, Cycles, Failure, Flip-chip, Reliability, Temperature, Testing, Electrical resistance
Journal Articles

Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69]

Zongrong Liu and, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Announcements
J. Electron. Packag. June 2001, 123(2): 159.
https://doi.org/10.1115/1.1371772
Published Online: June 1, 2001
View Article titled, Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69]
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Topics: Electrons, Glass, Metals, Thick films, Adhesion, Electrical resistance, Packaging, Titanium alloys
Journal Articles

Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards

Tsung-Yu Pan, Ronald R. Cooper, Howard D. Blair, Thomas J. Whalen, John M. Nicholson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 76–82.
https://doi.org/10.1115/1.2905508
Published Online: June 1, 1994
View Article titled, Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards
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Topics: Experimental analysis, Fatigue, Printed circuit boards, Cycles, Design, Electrical resistance, Fracture (Materials), Chain, Cracking (Materials), Electronic packages