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Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
https://doi.org/10.1115/1.4052790
Published Online: November 9, 2021
View Article titled, Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces
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Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)
Includes: Supplementary data
Journal Articles

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

James Spencer Lundh, Yiwen Song, Bikramjit Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Brianna A. Klein, Dustin Kendig, Hyungtak Kim, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031113.
Paper No: EP-20-1012
https://doi.org/10.1115/1.4047100
Published Online: May 21, 2020
View Article titled, Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
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Topics: Dynamics (Mechanics), Electronics, Energy gap, Gallium nitride, Heating, Imaging, Steady state, Temperature, Temperature measurement, Thermal characterization
Journal Articles

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 373–381.
https://doi.org/10.1115/1.2804085
Published Online: March 25, 2007
View Article titled, Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
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Topics: Ball-Grid-Array packaging, Displacement, Errors, Finite element model, Reliability, Shells, Shock (Mechanics), Transients (Dynamics), Dynamics (Mechanics), Modeling
Journal Articles

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Fang Liu, Guang Meng, Mei Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 266–272.
https://doi.org/10.1115/1.2753910
Published Online: March 15, 2007
View Article titled, Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
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Topics: Damping, Deflection, Dynamics (Mechanics), Springs, Viscoelasticity, Viscosity, Dynamic analysis
Journal Articles

Board Level Drop Impact—Fundamental and Parametric Analysis

E. H. Wong, Y-W Mai, S. K. W. Seah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
https://doi.org/10.1115/1.2065747
Published Online: March 30, 2005
View Article titled, Board Level Drop Impact—Fundamental and Parametric Analysis
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Topics: Stress, Dynamics (Mechanics), Springs, Manufacturing
Journal Articles

Dynamics Of Board-Level Drop Impact

E. H. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 200–207.
https://doi.org/10.1115/1.1938987
Published Online: July 17, 2004
View Article titled, Dynamics Of Board-Level Drop Impact
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Topics: Corners (Structural elements), Deflection, Dynamics (Mechanics), Finite element analysis, Springs, Stress, Electronic packaging, Impact testing
Journal Articles

Wetting Dynamics of Molten Solder Alloys on Metal Substrates

T. J. Singler, J. A. Clum, E. R. Prack
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 128–134.
https://doi.org/10.1115/1.2906409
Published Online: June 1, 1992
View Article titled, Wetting Dynamics of Molten Solder Alloys on Metal Substrates
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Topics: Alloys, Dynamics (Mechanics), Metals, Solders, Wetting, Surface energy, Tin, Tin alloys
Journal Articles

A Study of Forces and Motion Generated During Pulsed Laser Welding of Optical Packages

S. Rangwala
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 343–349.
https://doi.org/10.1115/1.2905418
Published Online: December 1, 1991
View Article titled, A Study of Forces and Motion Generated During Pulsed Laser Welding of Optical Packages
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Topics: Laser welding, Lasers, Cooling, Dynamics (Mechanics), Laser beams, Manufacturing, Shrinkage (Materials), Thermal stresses, Waves, Welding
Journal Articles

A Creep/Relaxation Model Which Exhibits Chaotic Instability—Comparison With Solder Data

S. J. Russell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1991, 113(2): 190–193.
https://doi.org/10.1115/1.2905386
Published Online: June 1, 1991
View Article titled, A Creep/Relaxation Model Which Exhibits Chaotic Instability—Comparison With Solder Data
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Topics: Aeroelasticity, Solders, Stress, Chaos, Grain size, Steady state, Creep, Dynamics (Mechanics), Fatigue, Relaxation (Physics)
Journal Articles

Damage Boundary Curves: A Computational (FEM) Approach

D. V. Caletka, R. N. Caldwell, J. T. Vogelmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 198–203.
https://doi.org/10.1115/1.2904367
Published Online: September 1, 1990
View Article titled, Damage Boundary Curves: A Computational (FEM) Approach
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Topics: Damage, Finite element methods, Failure, Transients (Dynamics), Deflection, Design, Dynamic analysis, Dynamics (Mechanics), Electronic packages, Failure mechanisms