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Journal Articles

Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces

Zhenyu She, Vijay K. Dhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041113.
Paper No: EP-21-1108
https://doi.org/10.1115/1.4052716
Published Online: November 9, 2021
View Article titled, Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces
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Topics: Critical heat flux, Disks, Vapors, Vessels, Boiling, Wavelength, Pool boiling
Journal Articles

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Sushil Bhavnani, Michael C. Hamilton, R. Wayne Johnson, Roy W. Knight, Daniel K. Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010913.
Paper No: EP-15-1108
https://doi.org/10.1115/1.4032462
Published Online: March 10, 2016
View Article titled, Durability of Low Melt Alloys as Thermal Interface Materials
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Topics: Alloys, Thermal resistance, Disks, Copper, Wetting, Reliability, Cycles
Journal Articles

Managing Thermal Emergencies in Disk-Based Storage Systems

Youngjae Kim, Jeonghwan Choi, Sudhanva Gurumurthi, Anand Sivasubramaniam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041105.
https://doi.org/10.1115/1.2993152
Published Online: November 14, 2008
View Article titled, Managing Thermal Emergencies in Disk-Based Storage Systems
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Topics: Disks, Temperature, Emergencies
Journal Articles

Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks (IMECE2006-14540)

A. D. Laws, Y. J. Chang, V. M. Bright, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021011.
https://doi.org/10.1115/1.2912187
Published Online: May 15, 2008
View Article titled, Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks (IMECE2006-14540)
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Topics: Atomic clocks, Disks, Heat conduction, Switches, Temperature, Thermal management, Finite element analysis, Heat, Vehicles
Journal Articles

Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

Y. C. Lee, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
https://doi.org/10.1115/1.2804089
Published Online: January 25, 2007
View Article titled, Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
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Topics: Design, Disks, Heat transfer, Multi-chip modules, Nozzles, Optimization, Reynolds number, Sensitivity analysis
Journal Articles

Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement

C. J. Fang, M. C. Wu, Y. M. Kuo, C. Y. Lee, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 400–410.
https://doi.org/10.1115/1.2804087
Published Online: December 28, 2006
View Article titled, Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement
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Topics: Disks, Heat transfer, Nozzles, Reynolds number, Transients (Dynamics), Turbulence, Heat flux, Steady state, Jets, Rotation
Journal Articles

Laminar Heat Transfer in Constructal Microchannel Networks With Loops

Xiang-Qi Wang, Christopher Yap, Arun S. Mujumdar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 273–280.
https://doi.org/10.1115/1.2229228
Published Online: September 20, 2005
View Article titled, Laminar Heat Transfer in Constructal Microchannel Networks With Loops
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Topics: Damage, Disks, Flow (Dynamics), Heat sinks, Heat transfer, Microchannels, Pressure drop, Temperature, Temperature distribution, Fluids
Journal Articles

Numerical Analysis of Blockage and Optimization of Heat Transfer Performance of Fractal-like Microchannel Nets

Xiang-Qi Wang, Arun S. Mujumdar, Christopher Yap
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 38–45.
https://doi.org/10.1115/1.2159007
Published Online: May 25, 2005
View Article titled, Numerical Analysis of Blockage and Optimization of Heat Transfer Performance of Fractal-like Microchannel Nets
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Topics: Flow (Dynamics), Fractals, Heat transfer, Microchannels, Heat sinks, Temperature, Disks, Optimization, Fluid dynamics, Temperature distribution
Journal Articles

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 472–476.
https://doi.org/10.1115/1.1827263
Published Online: January 24, 2005
View Article titled, Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
Open the PDF for Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices in another window
Topics: Capacitance, Computer cooling, Heat, Junctions, Linear systems, Simulation, Steady state, Temperature, Topology, Transients (Dynamics)
Journal Articles

Transient Convective Heat Transfer of Air Jet Impinging Onto a Confined Ceramic-Based MCM Disk

Li-Kang Liu, Graduate Student, Wen-Shien Su, Graduate Student, Ying-Huei Hung, Professor, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 159–172.
https://doi.org/10.1115/1.1649239
Published Online: April 30, 2004
View Article titled, Transient Convective Heat Transfer of Air Jet Impinging Onto a Confined Ceramic-Based MCM Disk
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Topics: Disks, Heat transfer, Transients (Dynamics), Steady state, Convection, Ceramics, Reynolds number
Journal Articles

Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling

M. M. Yovanovich, Distinguished Professor Emeritus, Principal Scientific Advisor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 169–177.
https://doi.org/10.1115/1.1568124
Published Online: June 10, 2003
View Article titled, Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling
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Topics: Circular cylinders, Cooling, Cylinders, Disks, Heat flux, Temperature, Boundary-value problems, Thermal resistance, Approximation
Journal Articles

Birefringence Reducing Precision Replication Process Assisted by Infrared Radiation

Kimitoshi Sato, Yasuo Kurosaki, Professor, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 111–114.
https://doi.org/10.1115/1.1451846
Published Online: May 2, 2002
View Article titled, Birefringence Reducing Precision Replication Process Assisted by Infrared Radiation
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Topics: Double refraction, Infrared radiation, Irradiation (Radiation exposure), Disks, Molding
Journal Articles

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Xiangcheng Luo,, Yunsheng Xu, and, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2001, 123(3): 309–311.
https://doi.org/10.1115/1.1371925
Published Online: June 26, 2000
View Article titled, Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement
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Topics: Contact resistance, Copper, Cycles, Disks, Electrical conductance, Heating, Silicones, Sodium, Thermal conductivity, Thermal stability
Journal Articles

Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 128–131.
https://doi.org/10.1115/1.483144
Published Online: December 28, 1999
View Article titled, Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance
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Topics: Contact resistance, Particulate matter, Silicones, Sodium, Thermal conductivity, Boron, Water, Copper, Fillers (Materials), Solders
Journal Articles

Modeling Natural Convection From Horizontal Isothermal Annular Heat Sinks

C.-S. Wang, M. M. Yovanovich, J. R. Culham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 44–49.
https://doi.org/10.1115/1.2792660
Published Online: March 1, 1999
View Article titled, Modeling Natural Convection From Horizontal Isothermal Annular Heat Sinks
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Topics: Heat sinks, Modeling, Natural convection, Heat transfer, Boundary layers, Cylinders, Disks, Flow (Dynamics), Geometry
Journal Articles

Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints

S. M. Heinrich, S. Shakya, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 218–227.
https://doi.org/10.1115/1.2792240
Published Online: December 1, 1997
View Article titled, Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints
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Topics: Displacement, Solder joints, Manufacturing, Materials properties, Shear (Mechanics), Boundary-value problems, Die cutting, Dimensions, Disks, Finite element analysis
Journal Articles

Contact Analysis of Regular Patterned Rough Surfaces in Magnetic Recording

Bharat Bhushan, Xuefeng Tian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 26–33.
https://doi.org/10.1115/1.2792064
Published Online: March 1, 1995
View Article titled, Contact Analysis of Regular Patterned Rough Surfaces in Magnetic Recording
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Topics: Magnetic recording, Surface roughness, Design, Disks, Stress, Magnetic heads, Shapes, Thin films
Journal Articles

A Finite Element and Experimental Investigation of a Clamp Plate for a Disk Stack in a Winchester Disk Drive

C. P. Morris, C. W. Bert
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1993, 115(4): 448–451.
https://doi.org/10.1115/1.2909356
Published Online: December 1, 1993
View Article titled, A Finite Element and Experimental Investigation of a Clamp Plate for a Disk Stack in a Winchester Disk Drive
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Topics: Clamps (Tools), Disks, Finite element analysis, Stress
Journal Articles

Numerical Study of Flow and Heat Transfer for Circular Jet Impingement on the Bottom of a Cylindrical Cavity

S. Gavali, K. Karki, S. Patankar, K. Miura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 292–297.
https://doi.org/10.1115/1.2909331
Published Online: September 1, 1993
View Article titled, Numerical Study of Flow and Heat Transfer for Circular Jet Impingement on the Bottom of a Cylindrical Cavity
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Topics: Cavities, Flow (Dynamics), Heat transfer, Nozzles, Separation (Technology), Disks, Fluids, Reynolds number, Thermal boundary layers
Journal Articles

Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions

Frank F. H. Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 214–218.
https://doi.org/10.1115/1.2909320
Published Online: June 1, 1993
View Article titled, Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions
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Topics: Polynomials, Stress, Temperature distribution, Heating, Failure, Fracture (Process), Manufacturing, Temperature, Thermal expansion, Thermal stresses