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Journal Articles

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Ning Zheng, R. A. Wirtz

Publisher: ASME

J. Electron. Packag. March 2004, 126(1): 1–7.

https://doi.org/10.1115/1.1646419

Published Online: April 30, 2004

View Article titled, A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Topics: Design, Engineering prototypes, Heat, Heat sinks, Latent heat, Storage, Temperature, Thermal conductivity, Thermal energy storage, Interfacial thermal resistance

Journal Articles

Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Hung-Lung Lee, Shyang-Jye Chang, Sheng-Jye Hwang, Associate Professor,, Francis Su, S. K. Chen

Publisher: ASME

J. Electron. Packag. June 2003, 125(2): 268–275.

https://doi.org/10.1115/1.1569957

Published Online: June 10, 2003

View Article titled, Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Topics: Computer-aided design, Design, Design methodology, Flow (Dynamics), Taguchi methods, Noise factors, Molding, Packaging, Simulation, Manufacturing

Journal Articles

Forced Convection Board Level Thermal Design Methodology for Electronic Systems

Reena Cole, Tara Dalton, Jeff Punch, Mark R. Davies, Ronan Grimes

Publisher: ASME

J. Electron. Packag. June 2001, 123(2): 120–126.

https://doi.org/10.1115/1.1339822

Published Online: July 21, 2000

View Article titled, Forced Convection Board Level Thermal Design Methodology for Electronic Systems

Topics: Design, Design methodology, Electronic systems, Flow (Dynamics), Forced convection, Temperature, Thermal resistance, Junctions, Reynolds number, Reliability

Journal Articles

Methodology for Automated Design of Microelectronic Packages

S. D. Rajan, V. Sarihan, M. Mahalingam

Publisher: ASME

J. Electron. Packag. December 1994, 116(4): 274–281.

https://doi.org/10.1115/1.2905698

Published Online: December 1, 1994

View Article titled, Methodology for Automated Design of Microelectronic Packages

Topics: Design, Nonlinear programming, Computer software, Design methodology, Finite element analysis, Packaging, Design sensitivity analysis, Electronic packages, Electronic packaging, Equipment performance

Journal Articles

A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards

A. Hadim

Publisher: ASME

J. Electron. Packag. September 1993, 115(3): 339–342.

https://doi.org/10.1115/1.2909338

Published Online: September 1, 1993

View Article titled, A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards

Topics: Design methodology, Printed circuit boards, Thermal analysis, Algorithms, Computer-aided engineering, Design, Errors, Modeling, Natural convection, Temperature

Journal Articles

A Shape Optimal Design Methodology for Packaging Design

S. D. Rajan, Ben Nagaraj, Mali Mahalingam

Publisher: ASME

J. Electron. Packag. December 1992, 114(4): 461–466.

https://doi.org/10.1115/1.2905481

Published Online: December 1, 1992

View Article titled, A Shape Optimal Design Methodology for Packaging Design

Topics: Design, Design methodology, Packaging, Shapes, Nonlinear programming, Aerospace industry, Electronic packaging, Finite element analysis

Journal Articles

State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

Avram Bar-Cohen

Publisher: ASME

J. Electron. Packag. September 1992, 114(3): 257–270.

https://doi.org/10.1115/1.2905450

Published Online: September 1, 1992

View Article titled, State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

Topics: Electronic equipment, Packaging, Design methodology, Design, Errors, Mechanical engineers, Scalars

Journal citation

NARROW

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Forced Convection Board Level Thermal Design Methodology for Electronic Systems

Methodology for Automated Design of Microelectronic Packages

A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards

A Shape Optimal Design Methodology for Packaging Design

State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Forced Convection Board Level Thermal Design Methodology for Electronic Systems

Methodology for Automated Design of Microelectronic Packages

A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards

A Shape Optimal Design Methodology for Packaging Design

State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

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