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Journal Articles

Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling

Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar, Mohamad Riduwan Ramli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011005.
Paper No: EP-24-1049
https://doi.org/10.1115/1.4065805
Published Online: July 16, 2024
View Article titled, Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling
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Topics: Alloys, Fatigue life, Solder joints, Solders, Temperature profiles, Ball-Grid-Array packaging, Stress, Temperature, Cycles, Fatigue
Journal Articles

Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041102.
Paper No: EP-24-1007
https://doi.org/10.1115/1.4065537
Published Online: June 17, 2024
View Article titled, Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
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Topics: Coolants, Cooling, Data centers, Density, Heat, Heat exchangers, Temperature, Fluids, Stress, Cooling systems
Journal Articles

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031006.
Paper No: EP-22-1025
https://doi.org/10.1115/1.4064521
Published Online: March 11, 2024
View Article titled, Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging
Open the PDF for Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging in another window
Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Viscoplasticity, Finite element analysis
Journal Articles

Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials

Jiawei Chen, Zhongming Yan, Yang Qiao, Feihong Lin, Yu Wang, Hongcheng Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021011.
Paper No: EP-23-1062
https://doi.org/10.1115/1.4064099
Published Online: December 11, 2023
View Article titled, Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials
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Topics: Energy dissipation, Heat, Topology optimization, Design, Density, Temperature, Topology, Phase change materials
Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041105.
Paper No: EP-23-1012
https://doi.org/10.1115/1.4063541
Published Online: November 1, 2023
View Article titled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
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Topics: Aerosols, Failure, Failure mechanisms, Modeling, Reliability, Silver, Temperature, Testing, Circuits, Printing
Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Article titled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041012.
Paper No: EP-21-1136
https://doi.org/10.1115/1.4053365
Published Online: January 28, 2022
View Article titled, Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
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Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries
Journal Articles

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Vishnu V. B. Reddy, Saurabh Gupta, Jaimal Williamson, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011009.
Paper No: EP-20-1126
https://doi.org/10.1115/1.4050898
Published Online: August 6, 2021
View Article titled, Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages
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Topics: Cycles, Damage, Finite element analysis, Inspection, Lasers, Modeling, Natural language interfaces, Solders, Accelerated life testing, Density
Journal Articles

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020904.
Paper No: EP-20-1119
https://doi.org/10.1115/1.4049928
Published Online: March 5, 2021
View Article titled, Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
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Topics: Boiling, Coolants, Cooling, Data centers, Density, Flow (Dynamics), Fluids, Heat flux, Heat transfer coefficients, Plates (structures)
Journal Articles

Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams

Varun Prasanna Rajamuthu, Sanskar S. Panse, Srinath Ekkad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031003.
Paper No: EP-20-1090
https://doi.org/10.1115/1.4049173
Published Online: January 19, 2021
View Article titled, Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams
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Topics: Density, Foams (Chemistry), Heat transfer, Porosity, Reynolds number, Metal foams, Copper, Flow (Dynamics), Jets
Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020801.
Paper No: EP-20-1074
https://doi.org/10.1115/1.4048038
Published Online: August 27, 2020
View Article titled, Review of Methodologies for Structural Integrity Evaluation of Power Modules
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Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire
Journal Articles

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031107.
Paper No: EP-19-1129
https://doi.org/10.1115/1.4046849
Published Online: April 24, 2020
View Article titled, Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink
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Topics: Circuits, Damage, Electrodiffusion, Failure analysis, Flexible electronics, Inks, Metals, Nanoparticles, Reliability, Density
Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031106.
Paper No: EP-19-1098
https://doi.org/10.1115/1.4046848
Published Online: April 24, 2020
View Article titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach
Open the PDF for Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach in another window
Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles
Journal Articles

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Yi Yang, Tao Long, Songlin Zhuang, Lai Wang, Yi Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031101.
Paper No: EP-19-1109
https://doi.org/10.1115/1.4046763
Published Online: April 17, 2020
View Article titled, High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting
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Topics: Coating processes, Coatings, Composite materials, Crystals, Density, Particulate matter, Phosphors, Power density, Lasers, Aluminum
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011002.
Paper No: EP-19-1029
https://doi.org/10.1115/1.4044218
Published Online: August 1, 2019
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model
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Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints
Journal Articles

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Mahsa Montazeri, Cody J. Marbut, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031011.
Paper No: EP-18-1099
https://doi.org/10.1115/1.4043480
Published Online: May 24, 2019
View Article titled, Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test
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Topics: Cycles, Damage, Reliability, Shear (Mechanics), Solders, Stress, Temperature, Fatigue life, Failure, Finite element analysis
Journal Articles

Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect

Yasuhiro Kimura, Masumi Saka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021008.
Paper No: EP-18-1073
https://doi.org/10.1115/1.4042980
Published Online: April 10, 2019
View Article titled, Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect
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Topics: Current density, Electrodiffusion, Finite element analysis, Flow (Dynamics), Electric potential, Anodes, Damage, Density, Solders, Atoms
Journal Articles

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Weijun Zhu, Gang Dong, Yintang Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041002.
Paper No: EP-18-1007
https://doi.org/10.1115/1.4040670
Published Online: August 3, 2018
View Article titled, Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network
Open the PDF for Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network in another window
Topics: Density, Design, Heat, Modeling, Optimization, Silicon, Temperature, Simulation, Energy dissipation, Gates (Closures)
Journal Articles

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Tingting Zhang, Bahgat G. Sammakia, Zhihao Yang, Howard Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
https://doi.org/10.1115/1.4040204
Published Online: June 11, 2018
View Article titled, Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
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Topics: Composite materials, Copper, Density, Nanocomposites, Packing (Shipments), Packings (Cushioning), Particulate matter, Thermal conductivity, Fillers (Materials), Silver
Journal Articles

Special Section on InterPACK 2017—Part 2

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
https://doi.org/10.1115/1.4039963
Published Online: May 9, 2018
View Article titled, Special Section on InterPACK 2017—Part 2
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Topics: Batteries, Density, Electronic packaging, Microelectromechanical systems, Optoelectronic devices, Packaging, Semiconductor wafers, Sensors, Reliability