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Journal Articles

Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures

David Newport, Colin Forno, Maurice Whelan

Publisher: ASME

J. Electron. Packag. September 2010, 132(3): 031001.

https://doi.org/10.1115/1.4002161

Published Online: September 8, 2010

View Article titled, Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures

Topics: Cylinders, Interferometers, Interferometry, Temperature, Flow (Dynamics), Cooling, Thermal conductivity, Natural convection, Computer cooling

Journal Articles

A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels

David A. Dillard, Alok Mallick, Donatus C. Ohanehi, Jang-Horng Yu, Didier R. Lefebvre

Publisher: ASME

J. Electron. Packag. September 2008, 130(3): 031006.

https://doi.org/10.1115/1.2957326

Published Online: July 30, 2008

View Article titled, A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels

Topics: Cylinders, Elastomers, High pressure (Physics), Poisson ratio, Pressure, Casting, Pressure sensors, Deformation, Stress

Journal Articles

Models of Steady Heat Conduction in Multiple Cylindrical Domains

Anand Desai, James Geer, Bahgat Sammakia

Publisher: ASME

J. Electron. Packag. March 2006, 128(1): 10–17.

https://doi.org/10.1115/1.2159003

Published Online: May 18, 2005

View Article titled, Models of Steady Heat Conduction in Multiple Cylindrical Domains

Topics: Boundary-value problems, Geometry, Heat, Heat conduction, Heat flux, Heat sinks, Integrated circuits, Temperature, Thermal conductivity, Thermal management

Journal Articles

A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps

Chyi-Lang Lai, Wen-Bin Young

Publisher: ASME

J. Electron. Packag. June 2004, 126(2): 186–194.

https://doi.org/10.1115/1.1649244

Published Online: July 8, 2004

View Article titled, A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps

Topics: Flow (Dynamics), Flow simulation, Permeability, Plates (structures), Porous materials, Simulation, Solders, Shapes, Cylinders

Journal Articles

Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling

M. M. Yovanovich, Distinguished Professor Emeritus, Principal Scientific Advisor,

Publisher: ASME

J. Electron. Packag. June 2003, 125(2): 169–177.

https://doi.org/10.1115/1.1568124

Published Online: June 10, 2003

View Article titled, Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling

Topics: Circular cylinders, Cooling, Cylinders, Disks, Heat flux, Temperature, Boundary-value problems, Thermal resistance, Approximation

Journal Articles

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Zhe Zhang, Graduate Research Assistant,, E. E. Marotta, Senior Engineer/Scientist/Adjunct Professor—Thermal Development,, J. M. Ochterbeck, Associate Professor,

Publisher: ASME

J. Electron. Packag. June 2003, 125(2): 186–191.

https://doi.org/10.1115/1.1568126

Published Online: June 10, 2003

View Article titled, Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Topics: Boundary-value problems, Contact resistance, Cylinders, Stress, Temperature, Thermal conductivity, Model development, Mechanical properties, Dimensions, Contact mechanics

Journal Articles

Modeling Natural Convection From Horizontal Isothermal Annular Heat Sinks

C.-S. Wang, M. M. Yovanovich, J. R. Culham

Publisher: ASME

J. Electron. Packag. March 1999, 121(1): 44–49.

https://doi.org/10.1115/1.2792660

Published Online: March 1, 1999

View Article titled, Modeling Natural Convection From Horizontal Isothermal Annular Heat Sinks

Topics: Heat sinks, Modeling, Natural convection, Heat transfer, Boundary layers, Cylinders, Disks, Flow (Dynamics), Geometry

Journal Articles

Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Sanjeev Sathe

Publisher: ASME

J. Electron. Packag. September 1994, 116(3): 230–233.

https://doi.org/10.1115/1.2905690

Published Online: September 1, 1994

View Article titled, Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Topics: Cylinders, Electronic packages, Heat conduction, Heat, Thermal conductivity, Aluminum, Copper, Dielectric materials, Dimensions, Electronic equipment

Journal Articles

Bending and Twisting of 60Sn40Pb Solder Interconnects With Creep

John H. Lau

Publisher: ASME

J. Electron. Packag. June 1994, 116(2): 154–157.

https://doi.org/10.1115/1.2905504

Published Online: June 1, 1994

View Article titled, Bending and Twisting of 60Sn40Pb Solder Interconnects With Creep

Topics: Creep, Solders, Cylinders, Geometry, Materials properties

Journal citation

NARROW

Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures

A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels

Models of Steady Heat Conduction in Multiple Cylindrical Domains

A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps

Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Modeling Natural Convection From Horizontal Isothermal Annular Heat Sinks

Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Bending and Twisting of 60Sn40Pb Solder Interconnects With Creep

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