1-18 of 18
Cracking (Materials)
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020801.
Paper No: EP-20-1074
https://doi.org/10.1115/1.4048038
Published Online: August 27, 2020
View Article titled, Review of Methodologies for Structural Integrity Evaluation of Power Modules
Open the PDF for Review of Methodologies for Structural Integrity Evaluation of Power Modules in another window
Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire
Journal Articles

Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

P. Borgesen, D. Blass, M. Meilunas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011010.
https://doi.org/10.1115/1.4005904
Published Online: March 19, 2012
View Article titled, Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies
Open the PDF for Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies in another window
Topics: Ball-Grid-Array packaging, Bonding, Corners (Structural elements), Fracture (Materials), Solder joints, Solders, Cycles, Manufacturing, Cracking (Materials), Fracture (Process)
Journal Articles

Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading

Takehiro Saitoh, Hidehito Matsuyama, Masayuki Toya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 420–425.
https://doi.org/10.1115/1.1602706
Published Online: September 17, 2003
View Article titled, Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading
Open the PDF for Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading in another window
Topics: Delamination, Fracture (Process), Resins, Temperature, Copper alloys, Fracture mechanics, Alloys, Radioactive tracers, Wedges, Cracking (Materials)
Journal Articles

A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips

Boris Mirman, Emanuel Bobrov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2001, 123(4): 405.
https://doi.org/10.1115/1.1400975
Published Online: September 19, 2000
View Article titled, A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips
Open the PDF for A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips in another window
Topics: Copper, Cracking (Materials), Deformation, Flip-chip devices, Fracture (Process), Metallurgy, High temperature
Journal Articles

Flip-Chip BGA Design to Avert Die Cracking

J.-B. Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 58–63.
https://doi.org/10.1115/1.1329130
Published Online: October 29, 1999
View Article titled, Flip-Chip BGA Design to Avert Die Cracking
Open the PDF for Flip-Chip BGA Design to Avert Die Cracking in another window
Topics: Ball-Grid-Array packaging, Design, Finite element analysis, Flip-chip, Fracture (Materials), Fracture (Process), Fracture mechanics, Cracking (Materials)
Journal Articles

Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)

S. A. Taylor, K. Chen, R. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 85–88.
https://doi.org/10.1115/1.2792224
Published Online: June 1, 1997
View Article titled, Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)
Open the PDF for Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs) in another window
Topics: Acoustics, Computers, Cracking (Materials), Equilibrium (Physics), Fracture (Process), Heat, Heating, High temperature, Lumber, Microscopy
Journal Articles

Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints

Edward Jih, Yi-Hsin Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 94–99.
https://doi.org/10.1115/1.2792087
Published Online: June 1, 1995
View Article titled, Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints
Open the PDF for Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints in another window
Topics: Design, Resistors, Solder joints, Finite element analysis, Capacitors, Cracking (Materials), Creep, Electronic packaging, Failure, Fatigue
Journal Articles

Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

R. K. Govila, Y.-H. Pao, C. Larner, J. Lau, S. Twerefour, S. Erasmus, S. Dolot
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 184–190.
https://doi.org/10.1115/1.2905684
Published Online: September 1, 1994
View Article titled, Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack
Open the PDF for Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack in another window
Topics: Failure analysis, Solder joints, Water, Solders, Cycles, Crack propagation, Cracking (Materials), Failure, Failure mechanisms, Fatigue damage
Journal Articles

Crack Propagation in Solder Joints During Thermal-Mechanical Cycling

Ronald G. Ross, Jr., Liang-chi Wen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 69–75.
https://doi.org/10.1115/1.2905507
Published Online: June 1, 1994
View Article titled, Crack Propagation in Solder Joints During Thermal-Mechanical Cycling
Open the PDF for Crack Propagation in Solder Joints During Thermal-Mechanical Cycling in another window
Topics: Crack propagation, Solder joints, Failure, Creep, Cycles, Finite element analysis, Fracture (Materials), Solders, Computer software, Cracking (Materials)
Journal Articles

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

R. K. Govila, E. Jih, Y.-H. Pao, C. Larner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 83–88.
https://doi.org/10.1115/1.2905509
Published Online: June 1, 1994
View Article titled, Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
Open the PDF for Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors in another window
Topics: Fatigue damage, Resistors, Solder joints, Solders, Damage, Stress concentration, Corners (Structural elements), Cracking (Materials), Cycles, Design
Journal Articles

Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards

Tsung-Yu Pan, Ronald R. Cooper, Howard D. Blair, Thomas J. Whalen, John M. Nicholson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 76–82.
https://doi.org/10.1115/1.2905508
Published Online: June 1, 1994
View Article titled, Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards
Open the PDF for Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards in another window
Topics: Experimental analysis, Fatigue, Printed circuit boards, Cycles, Design, Electrical resistance, Fracture (Materials), Chain, Cracking (Materials), Electronic packages
Journal Articles

Modeling of Heat Transfer in the Surface Mounting of Electronic Components

S. K. Rastogi, D. Poulikakos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 373–381.
https://doi.org/10.1115/1.2909346
Published Online: December 1, 1993
View Article titled, Modeling of Heat Transfer in the Surface Mounting of Electronic Components
Open the PDF for Modeling of Heat Transfer in the Surface Mounting of Electronic Components in another window
Topics: Electronic components, Heat transfer, Modeling, Temperature, Cracking (Materials), Fracture (Process), Printed circuit boards, Temperature gradient, Thermal stresses
Journal Articles

Reliability of Postmolded IC Packages

L. T. Nguyen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 346–355.
https://doi.org/10.1115/1.2909343
Published Online: December 1, 1993
View Article titled, Reliability of Postmolded IC Packages
Open the PDF for Reliability of Postmolded IC Packages in another window
Topics: Reliability, Molding, Stress, Adhesion, Water, Corrosion, Metals, Corners (Structural elements), Cracking (Materials), Damage
Journal Articles

Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages

L. T. Nguyen, M. Michael
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 225–232.
https://doi.org/10.1115/1.2909322
Published Online: September 1, 1993
View Article titled, Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages
Open the PDF for Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages in another window
Topics: Adhesion, Acoustics, Cracking (Materials), Deformation, Delamination, Design, Epoxy adhesives, Epoxy resins, Fatigue failure, Finite element analysis
Journal Articles

Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints

A. I. Attarwala, J. K. Tien, G. Y. Masada, G. Dody
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 109–111.
https://doi.org/10.1115/1.2906405
Published Online: June 1, 1992
View Article titled, Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints
Open the PDF for Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints in another window
Topics: Creep, Fatigue damage, Solder joints, Tin, Fatigue, Fracture (Materials), Solders, Crack propagation, Cracking (Materials), Cycles
Journal Articles

Strains in Aluminum-Adhesive-Ceramic Trilayers

P. M. Hall, F. L. Howland, Y. S. Kim, L. H. Herring
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 288–302.
https://doi.org/10.1115/1.2904381
Published Online: December 1, 1990
View Article titled, Strains in Aluminum-Adhesive-Ceramic Trilayers
Open the PDF for Strains in Aluminum-Adhesive-Ceramic Trilayers in another window
Topics: Adhesives, Aluminum, Ceramics, Epoxy adhesives, Epoxy resins, Elastic moduli, Temperature, Dimensions, Elastomers, Heat
Journal Articles

Modeling Thermal Stress Behavior in Microelectronic Components

G. C. Scott, G. Astfalk
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 35–40.
https://doi.org/10.1115/1.2904338
Published Online: March 1, 1990
View Article titled, Modeling Thermal Stress Behavior in Microelectronic Components
Open the PDF for Modeling Thermal Stress Behavior in Microelectronic Components in another window
Topics: Modeling, Thermal stresses, Stress, Failure, Mechanical properties, Thermal stress cracking, Capacitors, Ceramics, Cracking (Materials), Dimensions
Journal Articles

Combined Moisture and Thermal Stresses Failure Mode in a PLCC

Y. Kornblum, J. C. Glaser
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 249–254.
https://doi.org/10.1115/1.3226543
Published Online: December 1, 1989
View Article titled, Combined Moisture and Thermal Stresses Failure Mode in a PLCC
Open the PDF for Combined Moisture and Thermal Stresses Failure Mode in a PLCC in another window
Topics: Cracking (Materials), Failure mechanisms, Finite element analysis, Fracture (Materials), Fracture (Process), Materials properties, Soldering, Stress, Temperature, Thermal stresses