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Journal Articles

Thermal Control Strategies for Reliable and Energy-Efficient Data Centers

Rehan Khalid, Aaron P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041004.
Paper No: EP-18-1058
https://doi.org/10.1115/1.4044129
Published Online: July 12, 2019
View Article titled, Thermal Control Strategies for Reliable and Energy-Efficient Data Centers
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Topics: Cooling systems, Data centers, Energy consumption, Flow (Dynamics), Reliability, Temperature, Energy efficiency, Simulation, Control equipment
Journal Articles

Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap

Xuefei Han, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011008.
Paper No: EP-13-1083
https://doi.org/10.1115/1.4028574
Published Online: October 15, 2014
View Article titled, Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap
Open the PDF for Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap in another window
Topics: Computational fluid dynamics, Control equipment, Flow (Dynamics), Fluids, Heat, Modeling, Temperature, Thermal management, Microfluidics
Journal Articles

High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry

Elena Martynenko, Wen Zhou, Alexander Chudnovsky, Ron S. Li, Larry Poglitsch
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 254–259.
https://doi.org/10.1115/1.1462628
Published Online: July 26, 2002
View Article titled, High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry
Open the PDF for High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry in another window
Topics: Displacement, Failure, Fatigue, Fracture (Materials), High cycle fatigue, Reliability, Stress, Temperature, Circuits, Testing