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J. Electron. Packag.
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    Journal Articles

    Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

    Zhe Zhang, Graduate Research Assistant,, E. E. Marotta, Senior Engineer/Scientist/Adjunct Professor—Thermal Development,, J. M. Ochterbeck, Associate Professor,
    Journal: Journal of Electronic Packaging
    Publisher: ASME
    Article Type: Technical Papers
    J. Electron. Packag. June 2003, 125(2): 186–191.
    https://doi.org/10.1115/1.1568126
    Published Online: June 10, 2003
    Abstract
    View Article titled, Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces
    Open the PDF for Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces in another window
    Topics: Boundary-value problems, Contact resistance, Cylinders, Stress, Temperature, Thermal conductivity, Model development, Mechanical properties, Dimensions, Contact mechanics
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