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Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021010.
Paper No: EP-22-1043
https://doi.org/10.1115/1.4056113
Published Online: November 11, 2022
View Article titled, Effective Constitutive Relations for Sintered Nano Copper Joints
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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering
Journal Articles

Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies

Subhasis Mukherjee, Mohammed Nuhi, Abhijit Dasgupta, Mohammad Modarres
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2016, 138(3): 030801.
Paper No: EP-15-1143
https://doi.org/10.1115/1.4033375
Published Online: June 8, 2016
View Article titled, Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies
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Topics: Creep, Solders, Tin, Constitutive equations
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011005.
https://doi.org/10.1115/1.4000754
Published Online: March 4, 2010
View Article titled, Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
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Topics: Constitutive equations, Creep, Density, Fatigue, Finite element methods, Hardening, Lead-free solders, Modeling, Reliability, Semiconductor wafers
Journal Articles

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

Ken-ichi Ohguchi, Katsuhiko Sasaki, Setsuo Aso
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
https://doi.org/10.1115/1.3103951
Published Online: March 27, 2009
View Article titled, Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
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Topics: Creep, Lead-free solders, Stress, Stress-strain relations, Deformation, Waves, Solders, Simulation, Constitutive equations, Alloys
Journal Articles

Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder

David M. Pierce, Sheri D. Sheppard, Arlo F. Fossum, Paul T. Vianco, Mike K. Neilsen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011002.
https://doi.org/10.1115/1.2837513
Published Online: January 31, 2008
View Article titled, Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder
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Topics: Constitutive equations, Creep, Damage, Finite element analysis, Plasticity, Simulation, Solders, Temperature, Stress, Fatigue
Journal Articles

Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder

Gang Chen, Xu Chen, Kwang Soo Kim, Mohammad Abdel-Karim, Masao Sakane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 278–286.
https://doi.org/10.1115/1.2753917
Published Online: July 20, 2006
View Article titled, Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder
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Topics: Constitutive equations, Hardening, Kinematics, Shear (Mechanics), Solders, Stress, Deformation
Journal Articles

Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5 Sn - 3.5 Ag Solder Alloy Under Cyclic Multiaxial Straining

Xianjie Yang, Yan Luo, Qing Gao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 41–47.
https://doi.org/10.1115/1.2429708
Published Online: May 18, 2006
View Article titled, Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5 Sn - 3.5 Ag Solder Alloy Under Cyclic Multiaxial Straining
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Topics: Deformation, Modeling, Solders, Stress, Alloys, Tin, Constitutive equations
Journal Articles

Behavior of Lead-Free Solder Under Thermomechanical Loading

Y. Wei, C. L. Chow, K. J. Lau, P. Vianco, H. E. Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 367–373.
https://doi.org/10.1115/1.1773197
Published Online: October 6, 2004
View Article titled, Behavior of Lead-Free Solder Under Thermomechanical Loading
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Topics: Constitutive equations, Damage, Deformation, Finite element analysis, Lead-free solders, Solders, Stress, Temperature, Thermomechanics, Alloys
Journal Articles

A Damage-Mechanics-Based Constitutive Model for Solder Joints

C. Basaran, Y. Zhao, H. Tang, J. Gomez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 208–214.
https://doi.org/10.1115/1.1939822
Published Online: July 23, 2004
View Article titled, A Damage-Mechanics-Based Constitutive Model for Solder Joints
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Topics: Constitutive equations, Creep, Damage, Flow (Dynamics), Hardening, Kinematics, Solder joints, Solders, Stress, Temperature
Journal Articles

Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing

Chandrakant S. Desai, Zhichao Wang, Russell Whitenack, Tribikram Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 225–231.
https://doi.org/10.1115/1.1756146
Published Online: July 8, 2004
View Article titled, Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing
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Topics: Failure, Solders, Stress, Temperature, Testing, Thermomechanics, Modeling, Electronic packaging, Fracture (Process), Constitutive equations
Journal Articles

Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

Xianjie Yang, C. L. Chow, K. J. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 148–158.
https://doi.org/10.1115/1.1649246
Published Online: April 30, 2004
View Article titled, Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
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Topics: Algorithms, Computer simulation, Constitutive equations, Damage, Hardening, Shear (Mechanics), Solders, Stress, Viscoplasticity, Finite element analysis
Journal Articles

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
https://doi.org/10.1115/1.1648060
Published Online: April 30, 2004
View Article titled, Failure Analysis of Miniature Solder Specimen
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Topics: Damage, Failure analysis, Finite element analysis, Solders, Creep, Fatigue, Constitutive equations, Nonequilibrium thermodynamics, Stress, Displacement
Journal Articles

A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints

Hong Tang, Cemal Basaran, Mem. ASME, Associate Professor and Director,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 120–125.
https://doi.org/10.1115/1.1536171
Published Online: March 14, 2003
View Article titled, A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints
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Topics: Cycles, Damage, Fatigue life, Finite element analysis, Simulation, Solder joints, Solders, Constitutive equations, Fatigue, Ball-Grid-Array packaging
Journal Articles

Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

Robert Darveaux
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 147–154.
https://doi.org/10.1115/1.1413764
Published Online: July 26, 2002
View Article titled, Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction
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Topics: Fatigue life, Finite element analysis, Fracture (Materials), Constitutive equations, Solder joints, Simulation, Density
Journal Articles

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

Sung Yi, Guangxing Luo, Kerm Sin Chian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 91–96.
https://doi.org/10.1115/1.1451845
Published Online: May 2, 2002
View Article titled, A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders
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Topics: Constitutive equations, Creep, Deformation, Dislocations, Grain boundaries, Grain size, Solders, Stress tensors, Temperature
Journal Articles

A New Creep Constitutive Model for Eutectic Solder Alloy

X. Q. Shi, Z. P. Wang, W. Zhou, H. L. J. Pang, Q. J. Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 85–90.
https://doi.org/10.1115/1.1462624
Published Online: May 2, 2002
View Article titled, A New Creep Constitutive Model for Eutectic Solder Alloy
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Topics: Constitutive equations, Creep, Solders, Stress, Temperature
Journal Articles

Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

Cemal Basaran, Assoc. Prof., and Director,, Rumpa Chandaroy, Staff Consultant,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. March 2002, 124(1): 60–66.
https://doi.org/10.1115/1.1400752
Published Online: March 15, 2001
View Article titled, Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading
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Topics: Constitutive equations, Damage, Fatigue life, Solder joints, Stress, Thermomechanics, Vibration, Finite element analysis, Reliability, Thermal expansion
Journal Articles

Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder

V. Stolkarts, L. M. Keer, ASME Fellow, M. E. Fine
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 351–355.
https://doi.org/10.1115/1.1407825
Published Online: February 23, 2000
View Article titled, Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder
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Topics: Cycles, Damage, Solders, Temperature, Fatigue, Simulation, Constitutive equations
Journal Articles

Three-Dimensional Effects of Solder Joints in Micro-Scale BGA Assembly

J. Zhu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 297–302.
https://doi.org/10.1115/1.2793856
Published Online: December 1, 1999
View Article titled, Three-Dimensional Effects of Solder Joints in Micro-Scale BGA Assembly
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Topics: Ball-Grid-Array packaging, Manufacturing, Microscale devices, Solder joints, Creep, Design, Solders, Cycles, Modeling, Reliability