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Journal Articles

Effect of Stress on the Dielectric Constant of Alumina

Sihai Wen, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 235–236.
https://doi.org/10.1115/1.1939029
Published Online: August 24, 2004
View Article titled, Effect of Stress on the Dielectric Constant of Alumina
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Topics: Stress, Compressive stress
Journal Articles

3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

John H. Lau, Stephen H. Pan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 621–624.
https://doi.org/10.1115/1.1604805
Published Online: December 15, 2003
View Article titled, 3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components
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Topics: Boundary-value problems, Compressive stress, Copper, Finite element analysis, Stress, Stress analysis (Engineering), Tin, Chemical reactions, Displacement, Materials properties
Journal Articles

Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers

W. W. King, C. J. Aloisio, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 133–137.
https://doi.org/10.1115/1.2792219
Published Online: June 1, 1997
View Article titled, Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers
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Topics: Coatings, Delamination, Optical fiber, Polymers, Thermomechanics, Tension, Fibers, Compressive stress, Composite materials, Hydrostatics
Journal Articles

Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 261–265.
https://doi.org/10.1115/1.2792102
Published Online: December 1, 1995
View Article titled, Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design
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Topics: Design, Fibers, Lasers, Optimization, Stress, Rotation, Buckling, Compressive stress, Deformation, Optical instruments
Journal Articles

Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder

Q. Guo, E. C. Cutiongco, L. M. Keer, M. E. Fine
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 145–151.
https://doi.org/10.1115/1.2906411
Published Online: June 1, 1992
View Article titled, Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder
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Topics: Fatigue life, Solders, Thermomechanics, Failure, Fatigue testing, Cycles, Fatigue, Compressive stress, Dislocations, Stress
Journal Articles

Development of Hermetic Microminiature Connectors

M. K. Neilsen, L. A. Andrews, S. L. Monroe, H. L. McCollister
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 405–409.
https://doi.org/10.1115/1.2905427
Published Online: December 1, 1991
View Article titled, Development of Hermetic Microminiature Connectors
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Topics: Alloys, Compression, Compressive stress, Design, Engineering prototypes, Finite element analysis, Finite element model, Fracture (Materials), Glass, Manufacturing
Journal Articles

Effects of Configuration on Plastic Package Stresses

L. T. Nguyen, S. A. Gee, W. F. v. d. Bogert
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 397–404.
https://doi.org/10.1115/1.2905426
Published Online: December 1, 1991
View Article titled, Effects of Configuration on Plastic Package Stresses
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Topics: Stress, Coating processes, Coatings, Compressive stress, Molding, Finite element analysis, Silicones, Simulation, Strain gages
Journal Articles

Isothermal Fatigue of 63Sn-37Pb Solder

E. C. Cutiongco, S. Vaynman, M. E. Fine, D. A. Jeannotte
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 110–114.
https://doi.org/10.1115/1.2904350
Published Online: June 1, 1990
View Article titled, Isothermal Fatigue of 63Sn-37Pb Solder
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Topics: Fatigue, Solders, Fatigue life, Cycles, Temperature, Tension, Failure, Fracture (Process), Tin, Compressive stress