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Journal Articles

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Tolga Emir, Hamza Ourabi, Mete Budakli, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2022, 144(4): 040801.
Paper No: EP-21-1129
https://doi.org/10.1115/1.4054184
Published Online: April 28, 2022
View Article titled, Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review
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Topics: Boiling, Bubbles, Critical heat flux, Heat transfer, Pool boiling, Pressure, Nucleation (Physics), Fluids, Water, Heat
Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
https://doi.org/10.1115/1.4052790
Published Online: November 9, 2021
View Article titled, Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces
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Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)
Includes: Supplementary data
Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Hua Zhu, Wei Li, Junye Li, Kuang Sheng, Shuai Shao, Haiwang Li, Zhi Tao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031006.
Paper No: EP-18-1092
https://doi.org/10.1115/1.4043476
Published Online: May 17, 2019
View Article titled, Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Subcooling, Temperature, Heat flux, Bubbles, Nucleate boiling, Flux (Metallurgy)
Journal Articles

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020906.
Paper No: EP-18-1003
https://doi.org/10.1115/1.4040088
Published Online: May 9, 2018
View Article titled, Enhanced Heat Transfer Using Microporous Copper Inverse Opals
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Topics: Copper, Critical heat flux, Heat transfer, Pool boiling, Boiling, Heat transfer coefficients, Bubbles
Journal Articles

Gas–Liquid Flow Dispersion in Micro-Orifices and Bubble Coalescence With High Flow Rates

A. Tollkötter, F. Reichmann, F. Schirmbeck, J. Wesholowski, N. Kockmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010905.
Paper No: EP-15-1105
https://doi.org/10.1115/1.4032557
Published Online: March 10, 2016
View Article titled, Gas–Liquid Flow Dispersion in Micro-Orifices and Bubble Coalescence With High Flow Rates
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Topics: Bubbles, Flow (Dynamics), Orifices
Journal Articles

Self-Propelled Sliding Bubble Motion Induced by Surface Microstructure in Pool Boiling of a Dielectric Fluid Under Microgravity

Naveenan Thiagarajan, Sushil H. Bhavnani, Vinod Narayanan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021009.
Paper No: EP-14-1073
https://doi.org/10.1115/1.4029246
Published Online: June 1, 2015
View Article titled, Self-Propelled Sliding Bubble Motion Induced by Surface Microstructure in Pool Boiling of a Dielectric Fluid Under Microgravity
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Topics: Bubbles, Vapors, Liquid films, Fluids, Pool boiling
Journal Articles

Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink

Tailian Chen, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 398–404.
https://doi.org/10.1115/1.2351905
Published Online: February 1, 2006
View Article titled, Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink
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Topics: Boiling, Bubbles, Flow (Dynamics), Heat sinks, Heat transfer, Microchannels, Pressure drop, Temperature, Wall temperature, Flow instability
Journal Articles

Boiling Heat Transfer Enhancement Using a Submerged, Vibration-Induced Jet

Steven W. Tillery, Samuel N. Heffington, Marc K. Smith, Ari Glezer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 145–149.
https://doi.org/10.1115/1.2188954
Published Online: February 1, 2006
View Article titled, Boiling Heat Transfer Enhancement Using a Submerged, Vibration-Induced Jet
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Topics: Boiling, Bubbles, Heat transfer, Temperature, Vibration, Vapors, Water, Diaphragms (Mechanical devices), Diaphragms (Structural), Heat flux
Journal Articles

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Daijiao Wang, Ronald L. Panton
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 120–126.
https://doi.org/10.1115/1.1876472
Published Online: May 18, 2004
View Article titled, Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies
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Topics: Cooling, Flip-chip assemblies, Heating, Melting, Solder joints, Solders, Temperature, Bubbles, Flow (Dynamics), Reliability
Journal Articles

Pumpless Loop for Narrow Channel and Micro-Channel Boiling

Swaraj Mukherjee, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 431–441.
https://doi.org/10.1115/1.1602708
Published Online: September 17, 2003
View Article titled, Pumpless Loop for Narrow Channel and Micro-Channel Boiling
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Topics: Boilers, Boiling, Cooling, Critical heat flux, Flow (Dynamics), Pressure drop, Water, Coolants, Heat, Temperature
Journal Articles

Simulation of Void Growth in Molten Solder Bumps

Ronald L. Panton, Fellow ASME, Jong W. Lee, Lakhi Goenka, Achyuta Achari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 329–334.
https://doi.org/10.1115/1.1569954
Published Online: September 17, 2003
View Article titled, Simulation of Void Growth in Molten Solder Bumps
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Topics: Bubbles, Melting, Solders, Flow (Dynamics), Surface tension, Viscosity, Temperature
Journal Articles

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

S. M. You, T. W. Simon, A. Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 17–25.
https://doi.org/10.1115/1.2792195
Published Online: March 1, 1997
View Article titled, Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface
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Topics: Heat transfer, Pool boiling, Boiling, Bubbles, Fluids, Heat, Heating, Aluminum, Computer cooling, Platinum
Journal Articles

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Sejin Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 178–184.
https://doi.org/10.1115/1.2792089
Published Online: September 1, 1995
View Article titled, A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments
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Topics: Semiconductors (Materials), Wire, Deformation, Flow (Dynamics), Bubbles, Cavities, Fluids, Model development, Shapes, Transfer molding
Journal Articles

Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips

I. Mudawar, T. M. Anderson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 375–382.
https://doi.org/10.1115/1.2904392
Published Online: December 1, 1990
View Article titled, Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips
Open the PDF for Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips in another window
Topics: Coolants, Cooling systems, Density, Design, Pool boiling, Pressure, Subcooling, Boiling, Critical heat flux, Temperature