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Journal Articles

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Yuan-Yun Wu, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011006.
Paper No: EP-13-1063
https://doi.org/10.1115/1.4026171
Published Online: January 8, 2014
View Article titled, The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes
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Topics: Alloys, Bonding, Copper, Design, High temperature, Low temperature, Shear (Mechanics), Silver, Solid solutions, Temperature
Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
https://doi.org/10.1115/1.4005956
Published Online: March 19, 2012
View Article titled, Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
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Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin
Journal Articles

Design Guideline for Ball Impact Test Apparatus

Chang-Lin Yeh, Yi-Shao Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 98–104.
https://doi.org/10.1115/1.2429716
Published Online: April 18, 2006
View Article titled, Design Guideline for Ball Impact Test Apparatus
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Topics: Brittleness, Design, Fracture (Process), Impact testing, Reliability, Solder joints, Transients (Dynamics), Damping, Structural dynamics
Journal Articles

Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities

Bingzhi Su, Y. C. Lee, Martin L. Dunn
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 369–377.
https://doi.org/10.1115/1.1602702
Published Online: September 17, 2003
View Article titled, Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities
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Topics: Corners (Structural elements), Fracture (Materials), Fracture (Process), Gallium arsenide, Geometry, Solders, Stress, Brittleness, Temperature, Finite element analysis
Journal Articles

Free Abrasive Machining in Slicing Brittle Materials With Wiresaw

Fuqian Yang, Research Assistant Professor, Imin Kao, Associate Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 254–259.
https://doi.org/10.1115/1.1348019
Published Online: August 30, 2000
View Article titled, Free Abrasive Machining in Slicing Brittle Materials With Wiresaw
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Topics: Abrasive machining, Abrasives, Brittleness, Cutting, Deformation, Fracture (Materials), Particulate matter, Stress, Wire, Modeling
Journal Articles

A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate

Y. F. Luo, K. P. Rajurkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 201–207.
https://doi.org/10.1115/1.2792092
Published Online: September 1, 1995
View Article titled, A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate
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Topics: Bonding, Micromechanics (Engineering), Strips, Separation (Technology), Adhesion, Brittleness, Deformation, Hardening, Heat treating (Metalworking), Manufacturing
Journal Articles

A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals

Barry Mathieu, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 98–104.
https://doi.org/10.1115/1.2905512
Published Online: June 1, 1994
View Article titled, A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals
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Topics: Glass, Metals, Stress analysis (Engineering), Stress, Design, Experimental design, Fracture (Materials), Fracture (Process), Geometry, Simulation
Journal Articles

Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions

Frank F. H. Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 214–218.
https://doi.org/10.1115/1.2909320
Published Online: June 1, 1993
View Article titled, Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions
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Topics: Polynomials, Stress, Temperature distribution, Heating, Failure, Fracture (Process), Manufacturing, Temperature, Thermal expansion, Thermal stresses