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Journal Articles

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Yuqian Xu, Qiwen Zeng, Yuexing Wang, Mingyong Wu, Xiangyu Chen, Gang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011205.
Paper No: EP-22-1001
https://doi.org/10.1115/1.4054821
Published Online: August 3, 2022
View Article titled, The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods
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Topics: Algebra, Deformation, Differential equations, Genetic algorithms, Stress, Errors, Solders
Journal Articles

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

Mustapha Faraji, Hamid El Qarnia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021011.
https://doi.org/10.1115/1.3103953
Published Online: April 3, 2009
View Article titled, Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
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Topics: Cooling, Electronic components, Heat, Heat conduction, Heat transfer, Melting, Rayleigh number, Temperature, Phase change materials, Heat sinks
Journal Articles

Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct

A. Gupta, Y. Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 243–252.
https://doi.org/10.1115/1.2792629
Published Online: September 1, 1998
View Article titled, Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct
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Topics: Cooling, Ducts, Heat, Reynolds number, Heat transfer, Water, Algebra, Buoyancy, Flow (Dynamics), Flow visualization
Journal Articles

Analysis of Tombstoning Phenomenon During Reflow

Q. Qi, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 61–67.
https://doi.org/10.1115/1.2792287
Published Online: March 1, 1998
View Article titled, Analysis of Tombstoning Phenomenon During Reflow
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Topics: Algebra, Dynamic models, Equations of motion, Geometry, Gravity (Force), Solders
Journal Articles

Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading

J. W. Tierney, J. W. Eischen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 281–287.
https://doi.org/10.1115/1.2792250
Published Online: December 1, 1997
View Article titled, Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading
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Topics: Algebra, Equilibrium (Physics), Finite element analysis, Microelectronic devices, Stress, Stress analysis (Engineering), Stress concentration, Strips
Journal Articles

Numerical Simulation of Impingement Air Cooling From LSI Packages With Large Plate Fins by the Penalty Finite Element Method

T. Tanaka, H. Matsushima, A. Ueki, T. Atarashi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 73–77.
https://doi.org/10.1115/1.2792204
Published Online: March 1, 1997
View Article titled, Numerical Simulation of Impingement Air Cooling From LSI Packages With Large Plate Fins by the Penalty Finite Element Method
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Topics: Computer simulation, Cooling, Finite element methods, Fins, Gradient methods, Algebra, Computers, Flow (Dynamics), Flow visualization, Industrial research