Volume 144 Issue 4 | J. Electron. Packag.

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Volume 144, Issue 4

December 2022

ISSN 1043-7398

EISSN 1528-9044

Review Article

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Tolga Emir, Hamza Ourabi, Mete Budakli, Mehmet Arik

J. Electron. Packag. December 2022, 144(4): 040801. doi: https://doi.org/10.1115/1.4054184

Abstract

View articletitled, Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

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Topics: Boiling , Bubbles , Critical heat flux , Heat transfer , Pool boiling , Pressure , Nucleation (Physics) , Fluids , Water , Heat

Research Papers

Optimized Design of Various Ag Decorated Sn-xAg-Cu_0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee

J. Electron. Packag. December 2022, 144(4): 041001. doi: https://doi.org/10.1115/1.4052075

Abstract

View articletitled, Optimized Design of Various Ag Decorated Sn-xAg-Cu<sub>0.7</sub> Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

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Topics: Fatigue , Solders , Tin , Displacement , Fracture (Materials) , Intermetallic compounds , Packaging , Reliability , Temperature

Coupled Calculations of Data Center Cooling and Power Distribution Systems

Aaron P. Wemhoff, Faisal Ahmed

J. Electron. Packag. December 2022, 144(4): 041002. doi: https://doi.org/10.1115/1.4052101

Abstract

View articletitled, Coupled Calculations of Data Center Cooling and Power Distribution Systems

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Topics: Cooling , Cooling systems , Data centers , Power systems (Machinery) , Stress , Energy efficiency , Electronic systems , Uncertainty

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang

J. Electron. Packag. December 2022, 144(4): 041003. doi: https://doi.org/10.1115/1.4052275

Abstract

View articletitled, A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

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Topics: Computational fluid dynamics , Flip-chip , Flip-chip packages , Flow (Dynamics) , Simulation , Solders , Surface energy , Uncertainty , Shapes , Packaging

Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration

Geoffrey A. Garcia, Kody Wakumoto, Joseph J. Brown

J. Electron. Packag. December 2022, 144(4): 041004. doi: https://doi.org/10.1115/1.4052325

Abstract

View articletitled, Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration

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Topics: Cantilevers , Design , Deflection , Microfabrication , Metamaterials , Modeling , Finite element analysis , Stress

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li

J. Electron. Packag. December 2022, 144(4): 041005. doi: https://doi.org/10.1115/1.4052246

Abstract

View articletitled, Design and Fabrication of Leadless Package Structure for Pressure Sensors

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Topics: Design , Glass , Manufacturing , Pressure , Pressure sensors , Silver , Thermal stresses , Bonding , Stress , Temperature

Influence of Laser Soldering Temperatures on Through-Hole Component

Saifulmajdy A. Zahiri, Aizat Abas, M. F. M. Sharif, Fakhrozi Che Ani

J. Electron. Packag. December 2022, 144(4): 041006. doi: https://doi.org/10.1115/1.4052175

Abstract

View articletitled, Influence of Laser Soldering Temperatures on Through-Hole Component

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Topics: Flow (Dynamics) , Lasers , Soldering , Solders , Temperature , Lead-free solders , Finite volume methods , Pressure

Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel

D. Sathish Kumar, S. Jayavel

J. Electron. Packag. December 2022, 144(4): 041007. doi: https://doi.org/10.1115/1.4052537

Abstract

View articletitled, Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel

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Topics: Bifurcation , Flow (Dynamics) , Heat transfer , Microchannels , Fluids , Entropy , Pressure drop

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Pardeep Shahi, Apruv Pravin Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer

J. Electron. Packag. December 2022, 144(4): 041008. doi: https://doi.org/10.1115/1.4052324

Abstract

View articletitled, Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

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Topics: Computational fluid dynamics , Cooling , Design , Flow (Dynamics) , Flow control , Valves , Pressure drop

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Fei Chong Ng, Mohamad Aizat Abas

J. Electron. Packag. December 2022, 144(4): 041009. doi: https://doi.org/10.1115/1.4052920

Abstract

View articletitled, Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

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Topics: Design , Flip-chip packages , Flow (Dynamics) , Optimization , Fluids , Computer simulation

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Qiming Zhang, S. W. Ricky Lee

J. Electron. Packag. December 2022, 144(4): 041010. doi: https://doi.org/10.1115/1.4053309

Abstract

View articletitled, Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

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Topics: Failure , Shear (Mechanics) , Testing , Finite element analysis

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Wei Tong, Alireza Ganjali, Omidreza Ghaffari, Chady al Sayed, Luc Fréchette, Julien Sylvestre

J. Electron. Packag. December 2022, 144(4): 041011. doi: https://doi.org/10.1115/1.4053310

Abstract

View articletitled, Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

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Topics: Boiling , Cooling , Heat , Heat transfer coefficients , Temperature , Critical heat flux , Temperature distribution , Flat heat pipes

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. December 2022, 144(4): 041012. doi: https://doi.org/10.1115/1.4053365

Abstract

View articletitled, Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

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Topics: Damage , Density , Electric current , Inks , Nanoparticles , Reliability , Lasers , Diffusion (Physics) , Atoms , Grain boundaries

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu

J. Electron. Packag. December 2022, 144(4): 041013. doi: https://doi.org/10.1115/1.4053432

Abstract

View articletitled, Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

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Topics: Epoxy resins , Pressure , Silver , Sintering , Temperature , Reliability , Shear strength , Epoxy adhesives , Shear (Mechanics)

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Zhigang Gao, Tianhu Wang, Yuxin Yang, Xiaolong Shang, Junhua Bai, Peng Li

J. Electron. Packag. December 2022, 144(4): 041014. doi: https://doi.org/10.1115/1.4053433

Abstract

View articletitled, Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

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Topics: Flow (Dynamics) , Heat sinks , Heat transfer , Methane , Microchannels , Pressure , Electromechanical actuators

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia

J. Electron. Packag. December 2022, 144(4): 041015. doi: https://doi.org/10.1115/1.4053643

Abstract

View articletitled, A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

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Topics: Air flow , Design , Stress , Flow (Dynamics) , Control systems , Heat , Data centers , Inertia (Mechanics)

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla

J. Electron. Packag. December 2022, 144(4): 041016. doi: https://doi.org/10.1115/1.4054096

Abstract

View articletitled, Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

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Topics: Fracture (Materials) , Fracture (Process) , Intermetallic compounds , Solder joints , Solders , Tin , Reliability , Fractography , Lead-free solders , Failure

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim

J. Electron. Packag. December 2022, 144(4): 041017. doi: https://doi.org/10.1115/1.4054183

Abstract

View articletitled, Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Supplementary data

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Topics: Deformation , Electrical resistance , Fatigue , Metals , Molding , Polymers , Reliability , Silicon , Simulation , Stress

Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation

Zuraihana Bachok, Mohamad Aizat Abas, Muhammad Zaim Hanif Nazarudin, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani

J. Electron. Packag. December 2022, 144(4): 041018. doi: https://doi.org/10.1115/1.4054132

Abstract

View articletitled, Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation

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Topics: Lasers , Soldering , Solders

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

Sara K. Lyons, Aditya Chandramohan, Justin A. Weibel, Suresh V. Garimella

J. Electron. Packag. December 2022, 144(4): 041019. doi: https://doi.org/10.1115/1.4054263

Abstract

View articletitled, Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

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Topics: Resolution (Optics) , Temperature , Thermography , Deformation , Temperature measurement , Emissivity

Review Article

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Research Papers

Optimized Design of Various Ag Decorated Sn-xAg-Cu_0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

Coupled Calculations of Data Center Cooling and Power Distribution Systems

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Influence of Laser Soldering Temperatures on Through-Hole Component

Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

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