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Issues
September 2022
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Review Articles
Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review
Satyam Saini, Jimil M. Shah, Pardeep Shahi, Pratik Bansode, Dereje Agonafer, Prabjit Singh, Roger Schmidt, Mike Kaler
J. Electron. Packag. September 2022, 144(3): 030801.
doi: https://doi.org/10.1115/1.4051255
Topics:
Contamination
,
Corrosion
,
Data centers
,
Particulate matter
,
Reliability
,
Temperature
,
Copper
,
Silver
,
Failure
Recent Developments in Air Pumps for Thermal Management of Electronics
J. Electron. Packag. September 2022, 144(3): 030802.
doi: https://doi.org/10.1115/1.4051970
Topics:
Pumps
,
Flow (Dynamics)
,
Diaphragms (Mechanical devices)
,
Diaphragms (Structural)
,
Fans
,
Electronics
,
Cooling
Research Papers
Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures
Manu Yadav, Thaer Alghoul, Sanoop Thekkut, Ronit Das, Christopher Greene, Peter Borgesen, A. R. Nazmus Sakib, Luke Wentlent, Shantanu Joshi
J. Electron. Packag. September 2022, 144(3): 031001.
doi: https://doi.org/10.1115/1.4051620
Topics:
Fatigue
,
Solder joints
,
Stiffness
,
Stress
,
Temperature
,
Failure
,
Deformation
,
Manufacturing
,
Shear (Mechanics)
Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test
J. Electron. Packag. September 2022, 144(3): 031002.
doi: https://doi.org/10.1115/1.4051256
Topics:
Bending strength
,
Silicon
,
Stress
,
Fittings
,
Deflection
Effect of Cyclic Stress on Electrochemical Corrosion Behavior of SAC305 Solder
J. Electron. Packag. September 2022, 144(3): 031003.
doi: https://doi.org/10.1115/1.4051753
High-Performance Planar Thermal Diode With Wickless Components
J. Electron. Packag. September 2022, 144(3): 031004.
doi: https://doi.org/10.1115/1.4051467
Topics:
Heat
,
Vapors
,
Temperature
,
Thermal resistance
,
Heat transfer
,
Condensation
,
Copper
A Hybrid Antenna in Package Solution Using FOWLP Technology
J. Electron. Packag. September 2022, 144(3): 031005.
doi: https://doi.org/10.1115/1.4051379
Topics:
Design
,
Manufacturing
,
Millimeter waves
,
Semiconductor wafers
,
Warping
,
Waveguides
,
Solders
,
Temperature
,
Molding
Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints
J. Electron. Packag. September 2022, 144(3): 031006.
doi: https://doi.org/10.1115/1.4051647
Topics:
Damage
,
Durability
,
Fatigue
,
Shear (Mechanics)
,
Solder joints
,
Solders
,
Stress
,
Finite element analysis
,
Fatigue damage
,
Hydrostatics
Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip
J. Electron. Packag. September 2022, 144(3): 031007.
doi: https://doi.org/10.1115/1.4051468
Topics:
Flip-chip
,
Flip-chip devices
,
Reliability
,
Thermal conductivity
,
Temperature
,
Current density
Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties
J. Electron. Packag. September 2022, 144(3): 031008.
doi: https://doi.org/10.1115/1.4052076
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds
Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen
J. Electron. Packag. September 2022, 144(3): 031009.
doi: https://doi.org/10.1115/1.4051728
Topics:
Creep
,
Deformation
,
Diffusion (Physics)
,
Dislocations
,
Stress
,
Temperature
,
Annealing
,
Nanoparticles
,
Particulate matter
,
Copper
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling
J. Electron. Packag. September 2022, 144(3): 031010.
doi: https://doi.org/10.1115/1.4051754
Topics:
Cooling
,
Temperature
,
Temperature control
,
Water
,
Water temperature
,
Weight (Mass)
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model
J. Electron. Packag. September 2022, 144(3): 031011.
doi: https://doi.org/10.1115/1.4052948
Topics:
Heat flux
,
Relaxation (Physics)
,
Temperature
,
Elemental semiconductors
,
Temperature gradient
,
Heat
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling
J. Electron. Packag. September 2022, 144(3): 031012.
doi: https://doi.org/10.1115/1.4053028
Topics:
Cycles
,
Nanoindentation
,
Silver
,
Stress
,
Young's modulus
,
Stress-strain curves
A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
J. Electron. Packag. September 2022, 144(3): 031013.
doi: https://doi.org/10.1115/1.4053767
Topics:
Design
,
Solder joints
,
Temperature
,
Thermomechanics
,
Geometry
,
Finite element analysis
,
Convection
,
Cycles
,
Sensitivity analysis
Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading
J. Electron. Packag. September 2022, 144(3): 031014.
doi: https://doi.org/10.1115/1.4053889
Topics:
Columns (Structural)
,
Copper
,
Current density
,
Flip-chip devices
,
Solder joints
,
Solders
,
Temperature
,
Tin
,
Joules
,
Reliability
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour
J. Electron. Packag. September 2022, 144(3): 031015.
doi: https://doi.org/10.1115/1.4053890
Topics:
Air flow
,
Computational fluid dynamics
,
Cooling
,
Data centers
,
Flow (Dynamics)
,
Pressure
,
Temperature
,
Tiles
,
Modeling
A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules
J. Electron. Packag. September 2022, 144(3): 031016.
doi: https://doi.org/10.1115/1.4053891
Topics:
Ceramics
,
Electric fields
,
Electrodes
,
Silicones
,
Insulation
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia
J. Electron. Packag. September 2022, 144(3): 031017.
doi: https://doi.org/10.1115/1.4054461
Topics:
Flow (Dynamics)
,
Heat sinks
,
Manifolds
,
Pressure drop
,
Thermal resistance
,
Design
,
Computer simulation
,
Fluids
,
Temperature
,
Heat transfer
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