Topics: Electronic packaging , Electronics , Microelectromechanical systems , Design , Internet of things , Condition monitoring , Data centers , Electric vehicles , Energy conversion , Engineering teachers

Research Papers

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure

Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Ruikang Wu, Kai Wang, Xiaobing Luo

J. Electron. Packag. September 2019, 141(3): 031001. doi: https://doi.org/10.1115/1.4042981

Abstract

View articletitled, Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure

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Topics: Heat , Light-emitting diodes , Nanoparticles , Phosphors , Quantum dots , Silicones , Temperature , Shells , Simulation

Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module

Mei-Chien Lu

J. Electron. Packag. September 2019, 141(3): 031002. doi: https://doi.org/10.1115/1.4042984

Abstract

View articletitled, Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module

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Topics: Copper , Silver , Stress , Columns (Structural) , Electronics , Sintering , Design

Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

Jimil M. Shah, Abel Misrak, Dereje Agonafer, Mike Kaler

J. Electron. Packag. September 2019, 141(3): 031003. doi: https://doi.org/10.1115/1.4043481

Abstract

View articletitled, Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

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Topics: Data centers , Fourier transform infrared spectroscopy , Particulate matter , Scanning electron microscopy , Contamination , Dust

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia

J. Electron. Packag. September 2019, 141(3): 031004. doi: https://doi.org/10.1115/1.4042983

Abstract

View articletitled, Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

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Topics: Air flow , Cooling , Data centers , Design , Exhaust systems , Fans , Leakage , Pressure , Sensors , Temperature

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo

J. Electron. Packag. September 2019, 141(3): 031005. doi: https://doi.org/10.1115/1.4042982

Abstract

View articletitled, Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

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Topics: Light-emitting diodes , Particulate matter , Phosphors , Silicones , Packaging , Wetting , Surface energy

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Hua Zhu, Wei Li, Junye Li, Kuang Sheng, Shuai Shao, Haiwang Li, Zhi Tao

J. Electron. Packag. September 2019, 141(3): 031006. doi: https://doi.org/10.1115/1.4043476

Abstract

View articletitled, Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

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Topics: Boiling , Flow (Dynamics) , Heat transfer , Microchannels , Subcooling , Temperature , Heat flux , Bubbles , Nucleate boiling , Flux (Metallurgy)

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Ľuboš Černaj, Daniel Donoval, Jaroslav Kováč, Christian Dua, Sylvain L. Delage, Jean-Claude Jacquet

J. Electron. Packag. September 2019, 141(3): 031007. doi: https://doi.org/10.1115/1.4043477

Abstract

View articletitled, Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

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Topics: Gallium nitride , Heat , Simulation , Temperature , Transistors , Temperature distribution , Temperature measurement , Thermal properties , Gates (Closures) , Thermal analysis

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou

J. Electron. Packag. September 2019, 141(3): 031008. doi: https://doi.org/10.1115/1.4043482

Abstract

View articletitled, Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

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Topics: Artificial neural networks , Computational fluid dynamics , Computer simulation , Flow (Dynamics) , Heat exchangers , Heat transfer , Optimization , Friction , Reynolds number , Genetic algorithms

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen

J. Electron. Packag. September 2019, 141(3): 031009. doi: https://doi.org/10.1115/1.4043483

Abstract

View articletitled, Orientation Effects in Two-Phase Microgap Flow

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Topics: Boiling , Flow (Dynamics) , Gravity (Force) , Heat flux

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark

J. Electron. Packag. September 2019, 141(3): 031010. doi: https://doi.org/10.1115/1.4043479

Abstract

View articletitled, Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

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Topics: Sensors , Circuits , Impact testing , Vibration , Polarization (Electricity) , Polarization (Light) , Polarization (Waves) , Reflow soldering

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Mahsa Montazeri, Cody J. Marbut, David Huitink

J. Electron. Packag. September 2019, 141(3): 031011. doi: https://doi.org/10.1115/1.4043480

Abstract

View articletitled, Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

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Topics: Cycles , Damage , Reliability , Shear (Mechanics) , Solders , Stress , Temperature , Fatigue life , Failure , Finite element analysis

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

Alexander Otto, Sven Rzepka, Bernhard Wunderle

J. Electron. Packag. September 2019, 141(3): 031012. doi: https://doi.org/10.1115/1.4043646

Abstract

View articletitled, Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

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Topics: Cycles , Failure , Junctions , Temperature , Wire , Stress , Failure mechanisms , Thermomechanics

Evaporative Wicking Phenomena on Nanotextured Surfaces

Duong Vy Le, Quang N. Pham, Jonggyu Lee, Shiwei Zhang, Yoonjin Won

J. Electron. Packag. September 2019, 141(3): 031013. doi: https://doi.org/10.1115/1.4044373

Abstract

View articletitled, Evaporative Wicking Phenomena on Nanotextured Surfaces

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Topics: Copper , Evaporation , Flux (Metallurgy) , Heat , Heat flux , Permeability

Dynamic Load Balancing Using Actual Workload Traces Based on Central Processing Unit Temperatures

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi

J. Electron. Packag. September 2019, 141(3): 031014. doi: https://doi.org/10.1115/1.4044262

Abstract

View articletitled, Dynamic Load Balancing Using Actual Workload Traces Based on Central Processing Unit Temperatures

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Topics: Data centers , Stress , Temperature , Rotation

A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

Ashreet Mishra, Agwu A. G. Nnanna

J. Electron. Packag. September 2019, 141(3): 031015. doi: https://doi.org/10.1115/1.4044716

Abstract

View articletitled, A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

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Topics: Activated carbon , Evaporation , Nanofluids , Nanoparticles , Steam , Sunlight , Water , Solar energy

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Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics

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Guest Editorial

Special Issue on InterPACK 2018

Research Papers

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure

Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module

Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Orientation Effects in Two-Phase Microgap Flow

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

Evaporative Wicking Phenomena on Nanotextured Surfaces

Dynamic Load Balancing Using Actual Workload Traces Based on Central Processing Unit Temperatures

A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

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