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Volume 137, Issue 1

March 2015

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Review Article
Research Papers
Technical Brief

Review Article

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar

J. Electron. Packag. March 2015, 137(1): 010801. doi: https://doi.org/10.1115/1.4028890

Abstract

View articletitled, Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

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Topics: Cooling , Copper , Flat heat pipes , Fluids , Heat , Heat pipes , Silicon , Stress , Teams , Thermal conductivity

Research Papers

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

Michael James Martin, Harish Manohara

J. Electron. Packag. March 2015, 137(1): 011001. doi: https://doi.org/10.1115/1.4028185

Abstract

View articletitled, Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

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Topics: Bridges (Structures) , Nanotubes , Pressure , Sensors , Temperature , Heating , Modeling

Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method

S. Kim, M. Mayer, J. Persic, J. T. Moon

J. Electron. Packag. March 2015, 137(1): 011002. doi: https://doi.org/10.1115/1.4028281

Abstract

View articletitled, Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method

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Topics: Temperature , Wire

Fast and Accurate Evaluation of Cooling in Data Centers

Harshad Bhagwat, Umesh Singh, Anirudh Deodhar, Amarendra Singh, Anand Sivasubramaniam

J. Electron. Packag. March 2015, 137(1): 011003. doi: https://doi.org/10.1115/1.4028315

Abstract

View articletitled, Fast and Accurate Evaluation of Cooling in Data Centers

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Topics: Cooling , Data centers , Temperature , Computational fluid dynamics

Effect of a Slotted Shield on Thermal and Hydraulic Performance of a Heat Sink

Mohamed L. Elsayed, Osama Mesalhy

J. Electron. Packag. March 2015, 137(1): 011004. doi: https://doi.org/10.1115/1.4027920

Abstract

View articletitled, Effect of a Slotted Shield on Thermal and Hydraulic Performance of a Heat Sink

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Topics: Flow (Dynamics) , Heat sinks , Thermal resistance , Pressure drop

On-Chip Power Generation Using Ultrathin Thermoelectric Generators

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar

J. Electron. Packag. March 2015, 137(1): 011005. doi: https://doi.org/10.1115/1.4027995

Abstract

View articletitled, On-Chip Power Generation Using Ultrathin Thermoelectric Generators

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Topics: Electronic packages , Energy generation , Generators , Heat flux , Junctions , Stress , Temperature , Waste heat , Transients (Dynamics)

Optimization of Thermoelectric Coolers for Hotspot Cooling in Three-Dimensional Stacked Chips

Matthew Redmond, Satish Kumar

J. Electron. Packag. March 2015, 137(1): 011006. doi: https://doi.org/10.1115/1.4028254

Abstract

View articletitled, Optimization of Thermoelectric Coolers for Hotspot Cooling in Three-Dimensional Stacked Chips

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Topics: Cooling , Optimization , Temperature , Thermoelectric coolers

Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers

Vikneshan Sundaralingam, Vaibhav K. Arghode, Yogendra Joshi, Wally Phelps

J. Electron. Packag. March 2015, 137(1): 011007. doi: https://doi.org/10.1115/1.4028520

Abstract

View articletitled, Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers

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Topics: Air flow , Containment , Data centers , Flow (Dynamics) , Stress , Temperature , Tiles , Uncertainty , Heat

Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap

Xuefei Han, Yogendra K. Joshi

J. Electron. Packag. March 2015, 137(1): 011008. doi: https://doi.org/10.1115/1.4028574

Abstract

View articletitled, Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap

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Topics: Computational fluid dynamics , Control equipment , Flow (Dynamics) , Fluids , Heat , Modeling , Temperature , Thermal management , Microfluidics

Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations

Matthew Ernst, Ed Habtour, Abhijit Dasgupta, Michael Pohland, Mark Robeson, Mark Paulus

J. Electron. Packag. March 2015, 137(1): 011009. doi: https://doi.org/10.1115/1.4028516

Abstract

View articletitled, Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations

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Topics: Durability , Excitation , Vibration , Inductors , Random vibration , Printed circuit boards , Electronic components , Failure

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker

J. Electron. Packag. March 2015, 137(1): 011010. doi: https://doi.org/10.1115/1.4028641

Abstract

View articletitled, Stress–Strain Behavior of SAC305 at High Strain Rates

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Topics: Deformation , Displacement , Failure , Finite element analysis , Finite element model , Lead-free solders , Manufacturing , Solders , Stress , Trusses (Building)

Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data Center

Vaibhav K. Arghode, Yogendra Joshi

J. Electron. Packag. March 2015, 137(1): 011011. doi: https://doi.org/10.1115/1.4028835

Abstract

View articletitled, Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data Center

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Topics: Air flow , Tiles , Porosity , Data centers

Modeling and Experimental Study of a Wire Clamp for Wire Bonding

Fuliang Wang, Dengke Fan

J. Electron. Packag. March 2015, 137(1): 011012. doi: https://doi.org/10.1115/1.4028836

Abstract

View articletitled, Modeling and Experimental Study of a Wire Clamp for Wire Bonding

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Topics: Clamps (Tools) , Wire , Wire bonding

Technical Brief

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Leila Ladani, Ousama Abdelhadi

J. Electron. Packag. March 2015, 137(1): 014501. doi: https://doi.org/10.1115/1.4027992

Abstract

View articletitled, Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

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Topics: Intermetallic compounds , Mechanical properties , Nanoindentation , Solder joints , Tin , Mechanical behavior , Size effect , Elastic moduli , Yield strength , Stress