Skip Nav Destination
Issues
June 2011
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Guest Editorial
Introduction for JEP Special Issue on Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020301.
doi: https://doi.org/10.1115/1.4004324
Carbon Nanotubes
The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations
J. Electron. Packag. June 2011, 133(2): 020901.
doi: https://doi.org/10.1115/1.4003513
Application of Carbon Nanotubes to Thermal Interface Materials
Drazen Fabris, Michael Rosshirt, Christopher Cardenas, Patrick Wilhite, Toshishige Yamada, Cary Y. Yang
J. Electron. Packag. June 2011, 133(2): 020902.
doi: https://doi.org/10.1115/1.4003864
Topics:
Carbon nanotubes
,
Thermal conductivity
,
Thermal resistance
,
Pressure
The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations
J. Electron. Packag. June 2011, 133(2): 020903.
doi: https://doi.org/10.1115/1.4003866
Topics:
Atoms
,
Carbon nanotubes
,
Chain
,
Displacement
,
Failure
,
Molecular dynamics simulation
,
Nanotubes
,
Simulation
,
Single-walled carbon nanotubes
,
Stress
Synthesis of Double Wall Carbon Nanotubes Using Sulfur as Catalyst
J. Electron. Packag. June 2011, 133(2): 020904.
doi: https://doi.org/10.1115/1.4003867
Topics:
Carbon nanotubes
,
Catalysts
,
Chemical vapor deposition
,
Nanotubes
,
Sulfur
Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites
J. Electron. Packag. June 2011, 133(2): 020905.
doi: https://doi.org/10.1115/1.4003988
Topics:
Carbon nanotubes
,
Composite materials
,
Epoxy adhesives
,
Epoxy resins
,
Fillers (Materials)
,
Graphite
,
Oxidation
,
Particle size
,
Polymers
,
Thermal conductivity
A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials
J. Electron. Packag. June 2011, 133(2): 020906.
doi: https://doi.org/10.1115/1.4004220
Topics:
Carbon nanotubes
,
Electrodes
Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces
Stephen L. Hodson, Thiruvelu Bhuvana, Baratunde A. Cola, Xianfan Xu, G. U. Kulkarni, Timothy S. Fisher
J. Electron. Packag. June 2011, 133(2): 020907.
doi: https://doi.org/10.1115/1.4004094
Topics:
Carbon nanotubes
,
Palladium
,
Nanoparticles
Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations
J. Electron. Packag. June 2011, 133(2): 020908.
doi: https://doi.org/10.1115/1.4004095
Topics:
Carbon nanotubes
,
Contact resistance
,
Electrodes
,
Electron configuration
Research Papers
Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints
J. Electron. Packag. June 2011, 133(2): 021001.
doi: https://doi.org/10.1115/1.4003863
Topics:
Reliability
,
Solder joints
,
Solders
,
Temperature
,
Ball-Grid-Array packaging
,
Fatigue life
,
Manufacturing
,
Alloys
Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials
J. Electron. Packag. June 2011, 133(2): 021002.
doi: https://doi.org/10.1115/1.4003865
Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates
J. Electron. Packag. June 2011, 133(2): 021003.
doi: https://doi.org/10.1115/1.4003868
Topics:
Bonding
,
Silicon chips
,
Pressure
,
Shear (Mechanics)
,
Silicon
,
Thermal expansion
,
Low temperature
,
Temperature
Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly
J. Electron. Packag. June 2011, 133(2): 021004.
doi: https://doi.org/10.1115/1.4003989
Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
J. Electron. Packag. June 2011, 133(2): 021005.
doi: https://doi.org/10.1115/1.4003990
Simplified Thermal Model of a Stacked Ball Grid Array Package
J. Electron. Packag. June 2011, 133(2): 021006.
doi: https://doi.org/10.1115/1.4003991
Topics:
Ball-Grid-Array packages
,
Solders
,
Temperature
,
Thermal resistance
,
Ball-Grid-Array packaging
,
Heat
,
Errors
,
Boundary-value problems
,
Junctions
Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
J. Electron. Packag. June 2011, 133(2): 021007.
doi: https://doi.org/10.1115/1.4003992
Topics:
Cycles
,
Fatigue
,
Fatigue cracks
,
Flip-chip
,
Flip-chip devices
,
Nondestructive evaluation
,
Solders
,
Synchrotron radiation
,
X-rays
,
Imaging
Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel
J. Electron. Packag. June 2011, 133(2): 021008.
doi: https://doi.org/10.1115/1.4004218
Topics:
Bronze
,
Gas flow
,
Heat flux
,
Heat transfer
,
Microchannels
,
Nitrogen
,
Slip flow
,
Temperature
,
Thermal conductivity
,
Silicon nitride ceramics
Email alerts
RSS Feeds
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag (June 2025)
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag (June 2025)