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Volume 131, Issue 4

December 2009

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Research Papers
Technical Briefs

Research Papers

Measurement of Leak Rate for MEMS Vacuum Packaging

Zhiyin Gan, Dexiu Huang, Xuefang Wang, Dong Lin, Sheng Liu

J. Electron. Packag. December 2009, 131(4): 041001. doi: https://doi.org/10.1115/1.3144148

Abstract

View articletitled, Measurement of Leak Rate for MEMS Vacuum Packaging

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Topics: Leakage , Packaging , Vacuum , Pressure , Flow (Dynamics)

A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks

Chuen-Ching Wang, Wen-Ran Yang, Jin-Jia Chen, Wei-Wen Shi

J. Electron. Packag. December 2009, 131(4): 041002. doi: https://doi.org/10.1115/1.4000207

Abstract

View articletitled, A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks

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Topics: Design , Flip-chip , Lenses (Optics) , Optical fiber

The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface

Dominiek Degryse, Bart Vandevelde, Eric Beyne, Joris Degrieck

J. Electron. Packag. December 2009, 131(4): 041003. doi: https://doi.org/10.1115/1.4000209

Abstract

View articletitled, The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface

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Topics: Fracture (Materials) , Shear (Mechanics) , Modeling , Fracture mechanics

The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps

Jose Omar S. Amistoso, Alberto V. Amorsolo, Jr.

J. Electron. Packag. December 2009, 131(4): 041004. doi: https://doi.org/10.1115/1.4000206

Abstract

View articletitled, The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps

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Topics: Intermetallic compounds , Solders , Temperature , Tin , Semiconductor wafers , Failure mechanisms

Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

A. D. Laws, R. Borwick, III, P. Stupar, J. DeNatale, Y. C. Lee

J. Electron. Packag. December 2009, 131(4): 041005. doi: https://doi.org/10.1115/1.4000211

Abstract

View articletitled, Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

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Topics: Design , Physics , Atomic clocks , Temperature , Thermal resistance , Shock (Mechanics) , Finite element analysis , Structural analysis

Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites

Jun Zeng, Renli Fu, Simeon Agathopoulos, Shaodong Zhang, Xiufeng Song, Hong He

J. Electron. Packag. December 2009, 131(4): 041006. doi: https://doi.org/10.1115/1.4000210

Abstract

View articletitled, Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites

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Topics: Composite materials , Epoxy resins , Fillers (Materials) , Particulate matter , Thermal conductivity , Epoxy adhesives , Finite element analysis

Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls

Wan Ho Song, Ali Karimi, Yan Huang, Michael Mayer, Norman Zhou, Jae Pil Jung

J. Electron. Packag. December 2009, 131(4): 041007. doi: https://doi.org/10.1115/1.4000281

Abstract

View articletitled, Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls

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Topics: Bonding , Displacement , Elastic moduli , Finite element analysis , Modeling , Sensitivity analysis , Simulation , Stress , Finite element model

Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film

Jianhua Zhang, Fang Yuan, Jinsong Zhang

J. Electron. Packag. December 2009, 131(4): 041008. doi: https://doi.org/10.1115/1.4000361

Abstract

View articletitled, Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film

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Topics: Bonding , Warping , Glass , Temperature

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Chuen-Ching Wang, Yao-Ting Ye, Jing-Fung Lin

J. Electron. Packag. December 2009, 131(4): 041009. doi: https://doi.org/10.1115/1.4000363

Abstract

View articletitled, Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

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Topics: Adhesives , Complementary metal oxide semiconductors , Energy dissipation , Glass , Packaging , Sensors , Taguchi methods , Temperature , Bonding , Heat

A Novel Ceramic Packaging Technique Using Selective Induction Heating

Sheng Liu, Wenming Liu, Changyong Lin, Mingxiang Chen

J. Electron. Packag. December 2009, 131(4): 041010. doi: https://doi.org/10.1115/1.4000366

Abstract

View articletitled, A Novel Ceramic Packaging Technique Using Selective Induction Heating

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Topics: Ceramics , Electromagnetic induction , Heating , Packaging , Temperature

Technical Briefs

Novel Design of Thermal-Via Configurations for Collector-Up HBTs

Pei-Hsuan Lee, Hsien-Cheng Tseng, Jung-Hua Chou

J. Electron. Packag. December 2009, 131(4): 044501. doi: https://doi.org/10.1115/1.4000282

Abstract

View articletitled, Novel Design of Thermal-Via Configurations for Collector-Up HBTs

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Topics: Design , Finite element model , Gallium arsenide , Temperature , Temperature distribution , Transistors , Finite element analysis , Packaging , Heat

Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

D. Bhate, G. Subbarayan, J. Zhao, V. Gupta, D. Edwards

J. Electron. Packag. December 2009, 131(4): 044502. doi: https://doi.org/10.1115/1.4000208

Abstract

View articletitled, Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

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Topics: Geometry , Solder joints , Solders , Failure , Fatigue , Alloys , Energy dissipation

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Research Papers

Measurement of Leak Rate for MEMS Vacuum Packaging

A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks

The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface

The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps

Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites

Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls

Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

A Novel Ceramic Packaging Technique Using Selective Induction Heating

Technical Briefs

Novel Design of Thermal-Via Configurations for Collector-Up HBTs

Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

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