Volume 131 Issue 2 | J. Electron. Packag.

Research Papers

Modeling Forced Convection in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Anthony G. Straatman, Lee J. Betchen

J. Electron. Packag. June 2009, 131(2): 021001. doi: https://doi.org/10.1115/1.3103934

View articletitled, Modeling Forced Convection in Finned Metal Foam Heat Sinks

Topics: Aluminum , Computational fluid dynamics , Fins , Heat sinks , Heat transfer , Thermal conductivity , Fluids , Flow (Dynamics) , Metal foams , Forced convection

Research Papers

Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization

Yi-Shao Lai, Ying-Ta Chiu, Chiu-Wen Lee

J. Electron. Packag. June 2009, 131(2): 021002. doi: https://doi.org/10.1115/1.3103945

Abstract

View articletitled, Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization

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Topics: Electrodiffusion , Flip-chip , Reliability , Solder joints , Vehicles

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

Ken-ichi Ohguchi, Katsuhiko Sasaki, Setsuo Aso

J. Electron. Packag. June 2009, 131(2): 021003. doi: https://doi.org/10.1115/1.3103951

Abstract

View articletitled, Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

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Topics: Creep , Lead-free solders , Stress , Stress-strain relations , Deformation , Waves , Solders , Simulation , Constitutive equations , Alloys

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Zongjie Han, Songbai Xue, Jianxin Wang, Xin Zhang, Shenglin Yu, Liang Zhang

J. Electron. Packag. June 2009, 131(2): 021004. doi: https://doi.org/10.1115/1.3103932

Abstract

View articletitled, Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

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Topics: Lasers , Lead-free solders , Mechanical properties , Soldering , Solders , Tin , Reflow soldering

Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

Afzal Husain, Kwang-Yong Kim

J. Electron. Packag. June 2009, 131(2): 021005. doi: https://doi.org/10.1115/1.3103931

Abstract

View articletitled, Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

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Topics: Design , Heat sinks , Microchannels , Optimization , Thermal resistance , Heat transfer , Response surface methodology , Shapes , Flow (Dynamics) , Computer simulation

A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process

Reinhard E. Powell, I. Charles Ume

J. Electron. Packag. June 2009, 131(2): 021006. doi: https://doi.org/10.1115/1.3103938

Abstract

View articletitled, A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process

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Topics: Warping , Printed circuit boards , Measurement systems , Resolution (Optics)

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

Yutaka Kumano, Tetsuyoshi Ogura, Toru Yamada

J. Electron. Packag. June 2009, 131(2): 021007. doi: https://doi.org/10.1115/1.3103947

Abstract

View articletitled, High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

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Topics: Computational fluid dynamics , Junctions , Semiconductors (Materials) , Temperature , Thermal conductivity , Modeling , Thermal analysis , Anisotropy

Analysis of Heat Transfer Enhancement in Minichannel Heat Sinks With Turbulent Flow Using $H_{2} O - {Al}_{2} O_{3}$ Nanofluids

T. L. Bergman

J. Electron. Packag. June 2009, 131(2): 021008. doi: https://doi.org/10.1115/1.3103949

Abstract

View articletitled, Analysis of Heat Transfer Enhancement in Minichannel Heat Sinks With Turbulent Flow Using <span class="inline-formula no-formula-id"><span class="mathFormula"></span><math xmlns="http://www.w3.org/1998/Math/MathML"><mrow xmlns=""><msub><mtext>H</mtext><mn>2</mn></msub><mtext>O</mtext><mo>–</mo><msub><mrow><mtext>Al</mtext></mrow><mn>2</mn></msub><msub><mtext>O</mtext><mn>3</mn></msub></mrow></math></span> Nanofluids

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Topics: Heat sinks , Heat transfer , Nanofluids , Turbulence , Water , Coolants , Fluids

Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems

Madhusudan Iyengar, Roger Schmidt

J. Electron. Packag. June 2009, 131(2): 021009. doi: https://doi.org/10.1115/1.3103952

Abstract

View articletitled, Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems

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Topics: Cooling , Data centers , Flow (Dynamics) , Heat , Temperature , Water , Energy consumption , Heat transfer , Coolants , Cooling towers

Experimental Study of Water Liquid-Vapor Two-Phase Pressure Drop Across an Array of Staggered Micropin-Fins

Christopher A. Konishi, Weilin Qu, Frank E. Pfefferkorn

J. Electron. Packag. June 2009, 131(2): 021010. doi: https://doi.org/10.1115/1.3104028

Abstract

View articletitled, Experimental Study of Water Liquid-Vapor Two-Phase Pressure Drop Across an Array of Staggered Micropin-Fins

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Topics: Fins , Flow (Dynamics) , Pressure drop , Vapors , Water , Friction , Two-phase flow

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

Mustapha Faraji, Hamid El Qarnia

J. Electron. Packag. June 2009, 131(2): 021011. doi: https://doi.org/10.1115/1.3103953

Abstract

View articletitled, Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

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Topics: Cooling , Electronic components , Heat , Heat conduction , Heat transfer , Melting , Rayleigh number , Temperature , Phase change materials , Heat sinks

Measurement and Characterization of the Moisture-Induced Properties of ACF Package

Ji-Young Yoon, Ilho Kim, Soon-Bok Lee

J. Electron. Packag. June 2009, 131(2): 021012. doi: https://doi.org/10.1115/1.3111252

Abstract

View articletitled, Measurement and Characterization of the Moisture-Induced Properties of ACF Package

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Topics: Diffusion (Physics) , Temperature , Finite element analysis

Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics

Myung Ki Sung, Issam Mudawar

J. Electron. Packag. June 2009, 131(2): 021013. doi: https://doi.org/10.1115/1.3111253

Abstract

View articletitled, Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics

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Topics: Cooling , Flow (Dynamics) , Heat , Jets , Microchannels , Temperature , Coolants , Defense industry , Electronics , Thermal management

Fabrication and Bioconjugation of Micro- and Nanoscale Structures Intended for Cancer-Specific Antigen Detection

Kevin M. Klein, Gregory Ostrowicki, Andrew T. Gewirtz, Suresh K. Sitaraman

J. Electron. Packag. June 2009, 131(2): 021014. doi: https://doi.org/10.1115/1.3103937

Abstract

View articletitled, Fabrication and Bioconjugation of Micro- and Nanoscale Structures Intended for Cancer-Specific Antigen Detection

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Topics: Cancer , Manufacturing , Microscale devices , Nanoscale phenomena , Proteins , Electron beams , Lithography , Biomaterials

Technical Briefs

Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System

Cheng-Wei Tien, Kun-Huang Yu, Wen-Junn Sheu, Chi-Chuan Wang

J. Electron. Packag. June 2009, 131(2): 024501. doi: https://doi.org/10.1115/1.3103940

Abstract

View articletitled, Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System

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Topics: Heating , Plates (structures) , Refrigerants , Stress , Cooling , Vapors , Superheating , Two-phase flow , Pressure drop , Pressure

Heat Transfer Limitation of a Micro Heat Pipe

K. N. Shukla

J. Electron. Packag. June 2009, 131(2): 024502. doi: https://doi.org/10.1115/1.3103970

Abstract

View articletitled, Heat Transfer Limitation of a Micro Heat Pipe

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Topics: Heat pipes , Heat transfer , Vapors , Heat

Design Innovation

Direct De-Ionized Water-Cooled Semiconductor Laser Package for Photodynamic Therapy of Esophageal Carcinoma: Design and Analysis

Gemunu Happawana, Amaranath Premasiri, Arye Rosen

J. Electron. Packag. June 2009, 131(2): 025001. doi: https://doi.org/10.1115/1.3103946

Abstract

View articletitled, Direct De-Ionized Water-Cooled Semiconductor Laser Package for Photodynamic Therapy of Esophageal Carcinoma: Design and Analysis

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Topics: Cooling , Design , Lasers , Semiconductor lasers , Water , Photodynamic therapy , Modeling

Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management

Craig Green, Andrei G. Fedorov, Yogendra K. Joshi

J. Electron. Packag. June 2009, 131(2): 025002. doi: https://doi.org/10.1115/1.3104029

Abstract

View articletitled, Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management

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Topics: Coolants , Cooling , Design , Fluids , Heat , Heat sinks , Flow (Dynamics) , Heat flux , Stress , Flux (Metallurgy)

Research Papers

Modeling Forced Convection in Finned Metal Foam Heat Sinks

Research Papers

Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

Analysis of Heat Transfer Enhancement in Minichannel Heat Sinks With Turbulent Flow Using $H_{2} O - {Al}_{2} O_{3}$ Nanofluids

Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems

Experimental Study of Water Liquid-Vapor Two-Phase Pressure Drop Across an Array of Staggered Micropin-Fins

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

Measurement and Characterization of the Moisture-Induced Properties of ACF Package

Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics

Fabrication and Bioconjugation of Micro- and Nanoscale Structures Intended for Cancer-Specific Antigen Detection

Technical Briefs

Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System

Heat Transfer Limitation of a Micro Heat Pipe

Design Innovation

Direct De-Ionized Water-Cooled Semiconductor Laser Package for Photodynamic Therapy of Esophageal Carcinoma: Design and Analysis

Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management

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