Topics: Heat transfer coefficients , Metal foams , Porosity , Thermal conductivity , Aluminum , Electrical conductivity , Heat sinks , Heat transfer , Flow (Dynamics) , Foams (Chemistry)

Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys

Juan Gomez, Cemal Basaran

J. Electron. Packag. June 2007, 129(2): 120–128. doi: https://doi.org/10.1115/1.2721082

Abstract

View articletitled, Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys

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Topics: Alloys , Nanoindentation , Plasticity , Solders , Strain gradient , Microelectronic devices

Convective Cooling of a PCB Like Surface With Mixed Heating Conditions in a Vertical Channel

Vipin Yadav, Keshav Kant

J. Electron. Packag. June 2007, 129(2): 129–143. doi: https://doi.org/10.1115/1.2721084

Abstract

View articletitled, Convective Cooling of a PCB Like Surface With Mixed Heating Conditions in a Vertical Channel

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Topics: Cooling , Flow (Dynamics) , Heat flux , Heating , Temperature , Convection , Wall temperature , Heat

Lifetime Estimation of Moems Devices

T. Bar-Kohany, A. Stern

J. Electron. Packag. June 2007, 129(2): 144–148. doi: https://doi.org/10.1115/1.2721085

Abstract

View articletitled, Lifetime Estimation of Moems Devices

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Topics: Cavities , Flow (Dynamics) , Leakage , Microoptoelectromechanical systems , Pressure , Water , Electrical conductance

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari

J. Electron. Packag. June 2007, 129(2): 149–156. doi: https://doi.org/10.1115/1.2721086

Abstract

View articletitled, A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

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Topics: Adhesives , Anisotropy , Ball-Grid-Array packaging , Temperature , Manufacturing , Particulate matter , Shear (Mechanics) , Contact resistance , Chain , Magnetic fields

Flow Structure and Enhanced Heat Transfer in Channel Flow With Dimpled Surfaces: Application to Heat Sinks in Microelectronic Cooling

Carlos Silva, Egidio Marotta, Leroy Fletcher

J. Electron. Packag. June 2007, 129(2): 157–166. doi: https://doi.org/10.1115/1.2721087

Abstract

View articletitled, Flow Structure and Enhanced Heat Transfer in Channel Flow With Dimpled Surfaces: Application to Heat Sinks in Microelectronic Cooling

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Topics: Channel flow , Computer simulation , Cooling , Design , Flow (Dynamics) , Friction , Heat sinks , Heat transfer , Reynolds number , Geometry

Cross-Verification of Thermal Characterization of a Microcooler

Zs. Kohári, Gy. Bognár, Gy. Horváth, A. Poppe, M. Rencz, V. Székely

J. Electron. Packag. June 2007, 129(2): 167–171. doi: https://doi.org/10.1115/1.2721089

Abstract

View articletitled, Cross-Verification of Thermal Characterization of a Microcooler

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Topics: Cooling , Flow (Dynamics) , Heat flux , Microchannels , Microcoolers , Sensors , Thermal resistance , Transients (Dynamics) , Heat , Transistors

Modeling of Rotary Screw Fluid Dispensing Processes

X. B. Chen

J. Electron. Packag. June 2007, 129(2): 172–178. doi: https://doi.org/10.1115/1.2721090

Abstract

View articletitled, Modeling of Rotary Screw Fluid Dispensing Processes

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Topics: Flow (Dynamics) , Fluids , Screws , Needles

A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems

T. Zhang, S. Rahman, K. K. Choi, K. Cho, P. Baker, M. Shakil, D. Heitkamp

J. Electron. Packag. June 2007, 129(2): 179–189. doi: https://doi.org/10.1115/1.2721092

Abstract

View articletitled, A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems

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Topics: Deformation , Durability , Fatigue , Fatigue cracks , Fatigue life , Solder joints , Solders , Cycles , Fracture (Materials) , Stress

Pressure Drop of Impingement Air Cooled Plate Fin Heat Sinks

Zhipeng Duan, Y. S. Muzychka

J. Electron. Packag. June 2007, 129(2): 190–194. doi: https://doi.org/10.1115/1.2721094

Abstract

View articletitled, Pressure Drop of Impingement Air Cooled Plate Fin Heat Sinks

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Topics: Flow (Dynamics) , Heat sinks , Pressure drop , Laminar flow

Inelastic Deformation and Fatigue of Solder Alloys Under Complicated Load Conditions

J. Liang, N. Dariavach, P. Callahan, D. Shangguan

J. Electron. Packag. June 2007, 129(2): 195–204. doi: https://doi.org/10.1115/1.2721593

Abstract

View articletitled, Inelastic Deformation and Fatigue of Solder Alloys Under Complicated Load Conditions

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Topics: Alloys , Creep , Deformation , Eutectic alloys , Solders , Stress , Temperature , Tin , Die cutting , Shearing (Deformation)

Air Cooling of Variable Array of Heated Modules in a Vertical Channel

Vipin Yadav, Keshav Kant

J. Electron. Packag. June 2007, 129(2): 205–215. doi: https://doi.org/10.1115/1.2721594

Abstract

View articletitled, Air Cooling of Variable Array of Heated Modules in a Vertical Channel

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Topics: Computer simulation , Convection , Cooling , Flow (Dynamics) , Heat transfer , Temperature , Printed circuit boards , Boundary-value problems , Turbulence , Heat flux