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A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing
K.-F. Becker, T. Braun, A. Neumann, A. Ostmann, E. Coko, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl
J. Electron. Packag. March 2005, 127(1): 1–6.
doi: https://doi.org/10.1115/1.1846058
Topics:
Lasers
,
Manufacturing
,
Packaging
,
Reliability
,
Semiconductor wafers
,
System-in-package
,
Flip-chip devices
,
Epoxy adhesives
,
Epoxy resins
Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications
J. Electron. Packag. March 2005, 127(1): 7–11.
doi: https://doi.org/10.1115/1.1846059
Topics:
Adhesives
,
Bonding
,
Semiconductor wafers
,
Fracture toughness
,
Wedges
,
Tensile strength
Adhesive Joining Process and Joint Property With Low Melting Point Filler
J. Electron. Packag. March 2005, 127(1): 12–17.
doi: https://doi.org/10.1115/1.1846060
Topics:
Adhesives
,
Alloys
,
Fillers (Materials)
,
Heat conduction
,
Melting point
,
Resins
,
Joining
,
Copper
,
Epoxy resins
,
Self-organization
Resin Self-Alignment Processes for Self-Assembly Systems
J. Electron. Packag. March 2005, 127(1): 18–24.
doi: https://doi.org/10.1115/1.1846061
Topics:
Resins
,
Surface tension
,
Self-assembly
Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS Packaging
J. Electron. Packag. March 2005, 127(1): 25–28.
doi: https://doi.org/10.1115/1.1846063
Topics:
Epoxy adhesives
,
Fibers
,
Finite element analysis
,
Optical fiber
,
Shear (Mechanics)
,
Silicon
,
Temperature
,
MEMS packaging
,
Epoxy resins
Various Adhesives for Flip Chips
J. Electron. Packag. March 2005, 127(1): 29–32.
doi: https://doi.org/10.1115/1.1846064
Topics:
Adhesives
,
Bonding
,
Flip-chip
,
Flip-chip devices
,
Reliability
,
Temperature
,
Epoxy adhesives
,
Epoxy resins
,
Manufacturing
,
Packaging
Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film
J. Electron. Packag. March 2005, 127(1): 33–37.
doi: https://doi.org/10.1115/1.1846065
Topics:
Polymer films
,
Thin films
,
Testing
,
Creep
,
Nanoindentation
,
Stress
,
Temperature
,
Viscoelasticity
PCR Microchip Array Based on Polymer Bonding Technique
J. Electron. Packag. March 2005, 127(1): 38–42.
doi: https://doi.org/10.1115/1.1849231
Topics:
Bonding
,
DNA
,
Fluorescence
,
Integrated circuits
,
Packaging
,
Photoresists
,
Polymers
,
Epoxy adhesives
,
Epoxy resins
,
Silicon
Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate
J. Electron. Packag. March 2005, 127(1): 43–46.
doi: https://doi.org/10.1115/1.1846066
Topics:
Adhesion
,
Adhesives
,
Anisotropy
,
Testing
,
Fracture toughness
,
Reliability
,
Pressure
Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications
J. Electron. Packag. March 2005, 127(1): 47–51.
doi: https://doi.org/10.1115/1.1849232
Topics:
Residual stresses
,
Resins
,
Strips
,
Numerical analysis
,
Temperature
,
Finite element analysis
,
Stress
Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions
J. Electron. Packag. March 2005, 127(1): 52–58.
doi: https://doi.org/10.1115/1.1846068
Thermal Design and Optimization Methodology for Integrated Power Electronics Modules
J. Electron. Packag. March 2005, 127(1): 59–66.
doi: https://doi.org/10.1115/1.1849233
Topics:
Design
,
Thermal analysis
,
Temperature
,
Optimization
An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature
J. Electron. Packag. March 2005, 127(1): 67–75.
doi: https://doi.org/10.1115/1.1849234
Topics:
Computational fluid dynamics
,
Flow (Dynamics)
,
Heat transfer
,
Junctions
,
Modeling
,
Temperature
,
Turbulence
,
Viscosity
,
Eddies (Fluid dynamics)
,
Air flow
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