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Volume 126, Issue 3

September 2004

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Research Paper

Research Paper

The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging

Samuel I-En Lin

J. Electron. Packag. September 2004, 126(3): 273–281. doi: https://doi.org/10.1115/1.1756592

Abstract

View articletitled, The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging

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Topics: Solders , Metals , Manufacturing , Thin films , Deformation

Reducing Warpage of Printed Circuit Boards by Using Wavy Traces

Parsaoran Hutapea, Joachim L. Grenestedt

J. Electron. Packag. September 2004, 126(3): 282–287. doi: https://doi.org/10.1115/1.1756591

Abstract

View articletitled, Reducing Warpage of Printed Circuit Boards by Using Wavy Traces

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Topics: Finite element analysis , Printed circuit boards , Thermoelasticity , Warping , Temperature

Two-Phase Flow and Heat Transfer in Rectangular Micro-Channels

Weilin Qu, Graduate Research Assistant, Student Mem. ASME, Seok-Mann Yoon, Postdoctoral Research Associate, Issam Mudawar, Professor and Director, Fellow ASME

J. Electron. Packag. September 2004, 126(3): 288–300. doi: https://doi.org/10.1115/1.1756589

Abstract

View articletitled, Two-Phase Flow and Heat Transfer in Rectangular Micro-Channels

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Topics: Boiling , Flow (Dynamics) , Microchannels , Two-phase flow , Heat sinks , Heat transfer , Water

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

Mitul Modi, Suresh K. Sitaraman

J. Electron. Packag. September 2004, 126(3): 301–307. doi: https://doi.org/10.1115/1.1772410

Abstract

View articletitled, Interfacial Fracture Toughness Measurement of a Ti/Si Interface

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Topics: Fracture toughness , Stress , Titanium , Silicon , Fracture (Materials) , Delamination , Metals , Adhesion , Strips , Adhesives

Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?

Shankar Krishnan, Suresh V. Garimella

J. Electron. Packag. September 2004, 126(3): 308–316. doi: https://doi.org/10.1115/1.1772411

Abstract

View articletitled, Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?

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Topics: Copper , Heat sinks , Junctions , Melting , Phase change materials , Temperature , Thermal conductivity , Transients (Dynamics) , Thermal management , Energy storage

Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components

Hiroshi Honda, ZhengGuo Zhang, Nobuo Takata

J. Electron. Packag. September 2004, 126(3): 317–324. doi: https://doi.org/10.1115/1.1772412

Abstract

View articletitled, Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components

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Topics: Boiling , Critical heat flux , Electronic components , Flow (Dynamics) , Heat transfer , Pool boiling , Ducts , Condensers (steam plant) , Heat flux , Cooling

The Thermoelastic Analysis of Chip-Substrate System

Linzhi Wu

J. Electron. Packag. September 2004, 126(3): 325–332. doi: https://doi.org/10.1115/1.1772413

Abstract

View articletitled, The Thermoelastic Analysis of Chip-Substrate System

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Topics: Fourier series , Heat conduction , Integrated circuits , Stress , Temperature , Thermal stresses , Thermoelasticity , Stress concentration , Reliability , Heat

Trade-off Design of Extruded Heat Sinks Using Mathematical Optimization

D. J. de Kock, J. A. Visser

J. Electron. Packag. September 2004, 126(3): 333–341. doi: https://doi.org/10.1115/1.1772414

Abstract

View articletitled, Trade-off Design of Extruded Heat Sinks Using Mathematical Optimization

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Topics: Design , Heat sinks , Optimization , Thermal resistance , Tradeoffs

Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks

Duckjong Kim, Sung Jin Kim, Alfonso Ortega

J. Electron. Packag. September 2004, 126(3): 342–350. doi: https://doi.org/10.1115/1.1772415

Abstract

View articletitled, Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks

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Topics: Heat sinks , Modeling , Heat transfer , Pressure drop , Fluid dynamics

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Martine Baelmans

J. Electron. Packag. September 2004, 126(3): 351–358. doi: https://doi.org/10.1115/1.1772416

Abstract

View articletitled, Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

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Topics: Flip-chip assemblies , Stress , Thermomechanics , Flip-chip devices , Deformation , Structural mechanics , Finite element model

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Changqing Liu, Paul Conway, Dezhi Li, Michael Hendriksen

J. Electron. Packag. September 2004, 126(3): 359–366. doi: https://doi.org/10.1115/1.1773391

Abstract

View articletitled, Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

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Topics: Flip-chip , Nanoindentation , Shear (Mechanics) , Solders , Tin , Flip-chip devices , Intermetallic compounds , Testing , Reliability , Shear strength

Behavior of Lead-Free Solder Under Thermomechanical Loading

Y. Wei, C. L. Chow, K. J. Lau, P. Vianco, H. E. Fang

J. Electron. Packag. September 2004, 126(3): 367–373. doi: https://doi.org/10.1115/1.1773197

Abstract

View articletitled, Behavior of Lead-Free Solder Under Thermomechanical Loading

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Topics: Constitutive equations , Damage , Deformation , Finite element analysis , Lead-free solders , Solders , Stress , Temperature , Thermomechanics , Alloys

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student

J. Electron. Packag. September 2004, 126(3): 374–383. doi: https://doi.org/10.1115/1.1773198

Abstract

View articletitled, On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

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Topics: Design , Finite element analysis , Finite element model , Heat , Heat conduction , Junctions , Manufacturing , Modeling , Multi-chip modules , Natural convection

Multi-Physics Simulation of a Microprocessor Package Under Water Cooling

Liu Bao-Min, Mui Y. C.

J. Electron. Packag. September 2004, 126(3): 384–389. doi: https://doi.org/10.1115/1.1774197

Abstract

View articletitled, Multi-Physics Simulation of a Microprocessor Package Under Water Cooling

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Topics: Cooling , Flow (Dynamics) , Simulation , Thermal stresses , Water , Thermal resistance , Temperature , Physics

Environmental Aging and Deadhesion of Polyimide Dielectric Films

Steven Murray, Craig Hillman, Michael Pecht

J. Electron. Packag. September 2004, 126(3): 390–397. doi: https://doi.org/10.1115/1.1773853

Abstract

View articletitled, Environmental Aging and Deadhesion of Polyimide Dielectric Films

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Topics: Adhesion , Damage , Fatigue , Stress , Temperature , Thin films , Polymers , Failure , Fracture (Materials) , Design

Strain Energy Density Criterion for Reliability Life Prediction of Solder Joints in Electronic Packaging

I. Guven, Mem. ASME, V. Kradinov, J. L. Tor, E. Madenci, Mem. ASME

J. Electron. Packag. September 2004, 126(3): 398–405. doi: https://doi.org/10.1115/1.1773855

Abstract

View articletitled, Strain Energy Density Criterion for Reliability Life Prediction of Solder Joints in Electronic Packaging

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Topics: Cycles , Density , Fracture (Materials) , Reliability , Solder joints , Stress , Finite element analysis , Solders , Electronic packaging

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Research Paper

The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging

Reducing Warpage of Printed Circuit Boards by Using Wavy Traces

Two-Phase Flow and Heat Transfer in Rectangular Micro-Channels

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?

Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components

The Thermoelastic Analysis of Chip-Substrate System

Trade-off Design of Extruded Heat Sinks Using Mathematical Optimization

Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Behavior of Lead-Free Solder Under Thermomechanical Loading

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Multi-Physics Simulation of a Microprocessor Package Under Water Cooling

Environmental Aging and Deadhesion of Polyimide Dielectric Films

Strain Energy Density Criterion for Reliability Life Prediction of Solder Joints in Electronic Packaging

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