Volume 124 Issue 3 | J. Electron. Packag.

Technical Papers

Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited

C. Q. Ru

J. Electron. Packag. September 2002, 124(3): 141–146. doi: https://doi.org/10.1115/1.1481037

View articletitled, Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited

Topics: Shear stress , Stress , Thermal stresses , Shear (Mechanics) , Differential equations , Displacement , Boundary-value problems

Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

Robert Darveaux

J. Electron. Packag. September 2002, 124(3): 147–154. doi: https://doi.org/10.1115/1.1413764

Abstract

View articletitled, Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

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Topics: Fatigue life , Finite element analysis , Fracture (Materials) , Constitutive equations , Solder joints , Simulation , Density

Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

A. Bhattacharya, Research Assistant, R. L. Mahajan, Professor

J. Electron. Packag. September 2002, 124(3): 155–163. doi: https://doi.org/10.1115/1.1464877

Abstract

View articletitled, Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

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Topics: Fins , Flow (Dynamics) , Heat sinks , Heat transfer coefficients , Metal foams , Forced convection , Heat transfer

The Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink

H. B. Ma, G. P. Peterson

J. Electron. Packag. September 2002, 124(3): 164–169. doi: https://doi.org/10.1115/1.1478058

Abstract

View articletitled, The Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink

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Topics: Heat sinks , Heat transfer , Thermal conductivity , Temperature distribution , Cooling , Heat pipes , Numerical analysis

Could Shock Tests Adequately Mimic Drop Test Conditions?

E. Suhir, ASME Fellow

J. Electron. Packag. September 2002, 124(3): 170–177. doi: https://doi.org/10.1115/1.1487356

Abstract

View articletitled, Could Shock Tests Adequately Mimic Drop Test Conditions?

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Topics: Dynamic response , Impulse (Physics) , Shock (Mechanics) , Vibration , Stress , Life testing , Deflection

Shape Optimal Design of Contact Springs of Electronic Connectors

Yeh-Liang Hsu, Yuan-Chan Hsu, Ming-Sho Hsu

J. Electron. Packag. September 2002, 124(3): 178–183. doi: https://doi.org/10.1115/1.1463730

Abstract

View articletitled, Shape Optimal Design of Contact Springs of Electronic Connectors

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Topics: Design , Springs , Shapes

Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects

J. H. Okura, A. Dasgupta, J. F. J. M. Caers

J. Electron. Packag. September 2002, 124(3): 184–187. doi: https://doi.org/10.1115/1.1477193

Abstract

View articletitled, Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects

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Topics: Durability , Intermetallic compounds , Stress , Finite element analysis , Life testing , Solder joints , Failure , Temperature

Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung

J. Electron. Packag. September 2002, 124(3): 188–191. doi: https://doi.org/10.1115/1.1477191

Abstract

View articletitled, Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

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Topics: Boron , Contact resistance , Lithium , Particulate matter , Ions , Sodium , Silicones , Solders , Thermal conductivity , Water

Effective Local Flexural Stiffness of Ball Grid Array Assemblies

Jung-Chuan Lee, Mem. ASME, Mostafa Rassaian, Mem. ASME

J. Electron. Packag. September 2002, 124(3): 192–197. doi: https://doi.org/10.1115/1.1463733

Abstract

View articletitled, Effective Local Flexural Stiffness of Ball Grid Array Assemblies

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Topics: Ball-Grid-Array packaging , Displacement , Stiffness , Finite element methods , Deflection , Printed circuit boards , Stress

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

Shiva P. Gadag, Susan K. Patra, Volkan Ozguz, Phillipe Marchand, Sadik Esener

J. Electron. Packag. September 2002, 124(3): 198–204. doi: https://doi.org/10.1115/1.1481894

Abstract

View articletitled, Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

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Topics: Cables , Ceramics , Composite materials , Convection , Cooling , Design , Finite element analysis , Finite element model , Heat , Heat sinks

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

John H. Lau, Fellow ASME, S. W. Ricky Lee, Stephen H. Pan, Chris Chang

J. Electron. Packag. September 2002, 124(3): 205–211. doi: https://doi.org/10.1115/1.1462626

Abstract

View articletitled, Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

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Topics: Creep , Flip-chip devices , Solder joints , Solders , Flip-chip , Printed circuit board assemblies

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

John H. Lau, Fellow ASME, Stephen H. Pan, Chris Chang

J. Electron. Packag. September 2002, 124(3): 212–220. doi: https://doi.org/10.1115/1.1462625

Abstract

View articletitled, A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

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Topics: Corners (Structural elements) , Fracture (Materials) , Solder joints , Fatigue , Density , Semiconductor wafers , Cycles

Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

Sheng Liu, I. Charles Ume

J. Electron. Packag. September 2002, 124(3): 221–226. doi: https://doi.org/10.1115/1.1464878

Abstract

View articletitled, Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

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Topics: Flip-chip , Flip-chip devices , Inspection , Modeling , Signals , Solder joints , Solders , Vibration , Vibration analysis , Oscillating frequencies

Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves

D. Josell, W. E. Wallace, J. A. Warren, D. Wheeler, A. C. Powell, IV

J. Electron. Packag. September 2002, 124(3): 227–233. doi: https://doi.org/10.1115/1.1463732

Abstract

View articletitled, Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves

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Topics: Displacement , Flip-chip , Modeling , Shear (Mechanics) , Solder joints , Solders , Wetting , Geometry , Copper

Papers on Reliability

Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging

Y. T. Lin, Graduate Assistant, C. T. Peng, Graduate Assistant, K. N. Chiang, Associate Professor

J. Electron. Packag. September 2002, 124(3): 234–239. doi: https://doi.org/10.1115/1.1481368

Abstract

View articletitled, Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging

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Topics: Copper , Event history analysis , Finite element methods , Flip-chip , Packaging , Reliability , Semiconductor wafers , Solders , Wire , Finite element analysis

Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate

Johan Liu, Zonghe Lai

J. Electron. Packag. September 2002, 124(3): 240–245. doi: https://doi.org/10.1115/1.1478059

Abstract

View articletitled, Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate

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Topics: Adhesive joints , Adhesives , Contact resistance , Cycles , Failure , Flip-chip , Reliability , Temperature , Testing , Electrical resistance

Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints

Y. W. Chan, T. H. Ju, Saeed A. Hareb, Y. C. Lee, Jih-Shun Wu, Mirng-Ji Lii

J. Electron. Packag. September 2002, 124(3): 246–253. doi: https://doi.org/10.1115/1.1451844

Abstract

View articletitled, Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints

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Topics: Manufacturing , Reliability , Shapes , Solder joints , Solders , Warping , Modeling , Ball-Grid-Array packaging , Fatigue life , Cavities

High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry

Elena Martynenko, Wen Zhou, Alexander Chudnovsky, Ron S. Li, Larry Poglitsch

J. Electron. Packag. September 2002, 124(3): 254–259. doi: https://doi.org/10.1115/1.1462628

Abstract

View articletitled, High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry

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Topics: Displacement , Failure , Fatigue , Fracture (Materials) , High cycle fatigue , Reliability , Stress , Temperature , Circuits , Testing

Damage Accumulation During Stress Relaxation of Polymer Films in Bending

D. Ingman, Y. Michlin

J. Electron. Packag. September 2002, 124(3): 260–265. doi: https://doi.org/10.1115/1.1463731

Abstract

View articletitled, Damage Accumulation During Stress Relaxation of Polymer Films in Bending

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Topics: Damage , Relaxation (Physics) , Stress , Strips , Deformation , Polymer films

Thermomechanical Durability of High I/O BGA Packages

P. Davuluri, S. Shetty, A. Dasgupta, S. Young

J. Electron. Packag. September 2002, 124(3): 266–270. doi: https://doi.org/10.1115/1.1477192

Abstract

View articletitled, Thermomechanical Durability of High I/O BGA Packages

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Topics: Ball-Grid-Array packages , Cycles , Durability , Failure , Modeling , Solder joints , Solders , Stress , Stress analysis (Engineering) , Thermomechanics

Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abe´

J. Electron. Packag. September 2002, 124(3): 271–276. doi: https://doi.org/10.1115/1.1481374

Abstract

View articletitled, Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

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Topics: Adhesives , Diamonds , Fracture toughness , Methane , Particulate matter , Silicon , Synthetic diamonds , Fracture (Materials) , Graphite

Validation of Electronic Package Reliability Using Speckle Interferometry

H.-Y. Yeh, K. Cote

J. Electron. Packag. September 2002, 124(3): 277–280. doi: https://doi.org/10.1115/1.1478060

Abstract

View articletitled, Validation of Electronic Package Reliability Using Speckle Interferometry

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Topics: Creep , Displacement measurement , Electronic packages , Electronic speckle pattern interferometry , Interferometry , Reliability , Thermal expansion , Solder joints , Temperature , Cycles

Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests

E. Suhir

J. Electron. Packag. September 2002, 124(3): 281–291. doi: https://doi.org/10.1115/1.1486470

Abstract

View articletitled, Accelerated Life Testing (ALT) in Microelectronics and Photonics: <em>Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests</em>

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Topics: Failure , Failure mechanisms , Lasers , Life testing , Probability , Reliability , Stress , Temperature , Design , Microelectronic devices

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

Pradeep Sharma, Abhijit Dasgupta

J. Electron. Packag. September 2002, 124(3): 292–297. doi: https://doi.org/10.1115/1.1493202

Abstract

View articletitled, Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

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Topics: Creep , Damage , Fatigue , Grain boundaries , Nucleation (Physics) , Solders , Stress , Particulate matter , Micromechanics (Engineering)

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

Pradeep Sharma, Abhijit Dasgupta

J. Electron. Packag. September 2002, 124(3): 298–304. doi: https://doi.org/10.1115/1.1493203

Abstract

View articletitled, Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

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Topics: Creep , Cycles , Damage , Durability , Failure , Fatigue , Grain size , Hydrostatics , Micromechanics (Engineering) , Solders

Technical Briefs

An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder

G. Y. Li, Y. C. Chan

J. Electron. Packag. September 2002, 124(3): 305–310. doi: https://doi.org/10.1115/1.1486012

Abstract

View articletitled, An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder

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Topics: Electron diffraction , Intermetallic compounds , Solder joints , Solders , Tin , X-ray diffraction , Silver , X-rays , Transmission electron microscopy , Thick films

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Sheng Chang and, Fu-Pen Chiang, Yifan Guo

J. Electron. Packag. September 2002, 124(3): 310–313. doi: https://doi.org/10.1115/1.1481367

Abstract

View articletitled, Measurement of Thermal Deformation of Interconnect Layers Using SIEM

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Topics: Deformation , Dielectric materials , Displacement , Electron microscopy , Interferometry , Packaging , Reliability , Resolution (Optics) , Thermal deformation , Thermal expansion

Book Review

Solders and Soldering

Howard H. Manko,, Author, Anthony J. Rafanelli,, Reviewer

J. Electron. Packag. September 2002, 124(3): 314. doi: https://doi.org/10.1115/1.1503063

Extract

View articletitled, Solders and Soldering

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Topics: Soldering , Solders , Alloys , Materials properties

Technical Papers

Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited

Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

The Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink

Could Shock Tests Adequately Mimic Drop Test Conditions?

Shape Optimal Design of Contact Springs of Electronic Connectors

Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects

Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Effective Local Flexural Stiffness of Ball Grid Array Assemblies

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves

Papers on Reliability

Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging

Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate

Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints

High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry

Damage Accumulation During Stress Relaxation of Polymer Films in Bending

Thermomechanical Durability of High I/O BGA Packages

Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

Validation of Electronic Package Reliability Using Speckle Interferometry

Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

Technical Briefs

An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Book Review

Solders and Soldering

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