Topics: Integrated circuit packaging , Integrated circuits , Micromechanical devices , Modeling , Packaging , Thermal management , Workshops (Work spaces)

A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation

Zs. Benedek, B. Courtois, G. Farkas, E. Kolla´r, S. Mir, A. Poppe, M. Rencz, V. Sze´kely, K. Torki

J. Electron. Packag. December 2001, 123(4): 323–330. doi: https://doi.org/10.1115/1.1389846

Abstract

View articletitled, A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation

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Topics: Design , Sensors , Temperature , Energy dissipation , Transients (Dynamics) , Packaging , Resistors , Composite materials , Complementary metal oxide semiconductors

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

K. N. Chiang, Associate Professor, C. W. Chang, Graduate Student, C. T. Lin, Graduate Student

J. Electron. Packag. December 2001, 123(4): 331–337. doi: https://doi.org/10.1115/1.1389847

Abstract

View articletitled, Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

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Topics: Adhesives , Finite element analysis , Flip-chip devices , Manufacturing , Modeling , Particulate matter , Pressure , Springs , Mechanical behavior , Flip-chip packages

IGBT Package Design for High Power Aircraft Electronic Systems

Farhad Sarvar, David C. Whalley, Ming K. Low

J. Electron. Packag. December 2001, 123(4): 338–343. doi: https://doi.org/10.1115/1.1390341

Abstract

View articletitled, IGBT Package Design for High Power Aircraft Electronic Systems

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Topics: Design , Electronic systems , Fins , Heat conduction , Heat transfer , Modeling , Steady state , Temperature , Transients (Dynamics) , Aircraft

Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design

Mohamed-Nabil Sabry

J. Electron. Packag. December 2001, 123(4): 344–350. doi: https://doi.org/10.1115/1.1390342

Abstract

View articletitled, Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design

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Topics: Design , Fluids , Heat transfer , Microchannels , Temperature , Temperature gradient , Flow (Dynamics) , Heat , Cooling

Additional Technical Papers

Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder

V. Stolkarts, L. M. Keer, ASME Fellow, M. E. Fine

J. Electron. Packag. December 2001, 123(4): 351–355. doi: https://doi.org/10.1115/1.1407825

Abstract

View articletitled, Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder

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Topics: Cycles , Damage , Solders , Temperature , Fatigue , Simulation , Constitutive equations

Experimental Evaluation of Air-Cooling Electronics at High Altitudes

Henry Wong, Robert E. Peck

J. Electron. Packag. December 2001, 123(4): 356–365. doi: https://doi.org/10.1115/1.1392319

Abstract

View articletitled, Experimental Evaluation of Air-Cooling Electronics at High Altitudes

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Topics: Convection , Cooling , Flow (Dynamics) , Heat transfer coefficients , Seas , Temperature , Wakes , Heating , Design , Wind tunnels

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

Dagmar Beyerlein, Lee E. Hornberger

J. Electron. Packag. December 2001, 123(4): 366–371. doi: https://doi.org/10.1115/1.1388562

Abstract

View articletitled, Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

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Topics: Cavities , Design , Flow (Dynamics) , Molding , Resins , Simulation , Wire , Deformation , Computer software , Gates (Closures)

Thermal Math Modeling and Analysis of an Electronic Assembly

K. N. Shukla

J. Electron. Packag. December 2001, 123(4): 372–378. doi: https://doi.org/10.1115/1.1388561

Abstract

View articletitled, Thermal Math Modeling and Analysis of an Electronic Assembly

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Topics: Finite element methods , Heat , Heat transfer coefficients , Manufacturing , Mathematics , Modeling , Temperature , Temperature distribution , Thermal analysis , Printed circuit boards

Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling

Katsuhiko Sasaki, Associate Professor,, Ken-ichi Ohguchi, Research Associate,, Hiromasa Ishikawa, Mem. ASME, Professor,

J. Electron. Packag. December 2001, 123(4): 379–387. doi: https://doi.org/10.1115/1.1371927

Abstract

View articletitled, Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling

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Topics: Alloys , Compression , Constitutive equations , Creep , Deformation , Simulation , Solders , Stress , Temperature , Tension

Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly

Ruijun Chen, Assoc. Mem. ASME, Daniel F. Baldwin, Assoc. Mem. ASME

J. Electron. Packag. December 2001, 123(4): 388–393. doi: https://doi.org/10.1115/1.1371926

Abstract

View articletitled, Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly

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Topics: Displacement , Fixturing , Manufacturing , Deflection , Stress , Plate theory

Papers on Reliability

A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load

Ron S. Li

J. Electron. Packag. December 2001, 123(4): 394–400. doi: https://doi.org/10.1115/1.1372318

Abstract

View articletitled, A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load

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Topics: Damage , Electronic components , Failure mechanisms , Fatigue , Finite element analysis , Stress , Vibration , Design , Reliability , Random vibration