Topics: Damage , Finite element methods , Failure , Transients (Dynamics) , Deflection , Design , Dynamic analysis , Dynamics (Mechanics) , Electronic packages , Failure mechanisms

Solder-Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability

E. Suhir, B. Poborets

J. Electron. Packag. September 1990, 112(3): 204–209. doi: https://doi.org/10.1115/1.2904368

View articletitled, Solder-Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability

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Topics: Glass , Reliability , Solders , Stress

Solder Joint Formation in Surface Mount Technology—Part I: Analysis

S. M. Heinrich, A. F. Elkouh, N. J. Nigro, Ping S. Lee

J. Electron. Packag. September 1990, 112(3): 210–218. doi: https://doi.org/10.1115/1.2904369

Abstract

View articletitled, Solder Joint Formation in Surface Mount Technology—Part I: Analysis

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Topics: Solder joints , Surface mount technology , Solders , Density , Dimensions , Shapes , Surface mount packaging , Surface tension

Solder Joint Formation in Surface Mount Technology—Part II: Design

S. M. Heinrich, N. J. Nigro, A. F. Elkouh, P. S. Lee

J. Electron. Packag. September 1990, 112(3): 219–222. doi: https://doi.org/10.1115/1.2904370

Abstract

View articletitled, Solder Joint Formation in Surface Mount Technology—Part II: Design

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Topics: Design , Solder joints , Surface mount technology , Surface tension , Density , Dimensions , Solders , Surface mount packaging

A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging

C. G. Woychik, A. K. Trivedi

J. Electron. Packag. September 1990, 112(3): 223–233. doi: https://doi.org/10.1115/1.2904371

Abstract

View articletitled, A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging

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Topics: Nickel , Packaging , Intermetallic compounds , Tin , Gold plating , Alloys , Contamination , Nickel plating , Particulate matter , Pins (Engineering)

A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks

G. L. Lehmann, S. J. Kosteva

J. Electron. Packag. September 1990, 112(3): 234–240. doi: https://doi.org/10.1115/1.2904372

Abstract

View articletitled, A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks

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Topics: Cooling , Forced convection , Heat sinks , Heat transfer coefficients , Channel flow , Convection , Electronic packaging , Flow (Dynamics) , Geometry , Heat transfer

Enhancement of Critical Heat Flux From High Power Microelectronic Heat Sources in a Flow Channel

Issam Mudawar, Douglas E. Maddox

J. Electron. Packag. September 1990, 112(3): 241–248. doi: https://doi.org/10.1115/1.2904373

Abstract

View articletitled, Enhancement of Critical Heat Flux From High Power Microelectronic Heat Sources in a Flow Channel

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Topics: Critical heat flux , Flow (Dynamics) , Heat , Subcooling , Boiling , Fins , Flux (Metallurgy)

Effects of Heat Intensity, Size, and Position of the Components on Temperature Distribution Within an Electronic PCB Enclosure

Z.-G. Du, E. Bilgen

J. Electron. Packag. September 1990, 112(3): 249–254. doi: https://doi.org/10.1115/1.2904374

Abstract

View articletitled, Effects of Heat Intensity, Size, and Position of the Components on Temperature Distribution Within an Electronic PCB Enclosure

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Topics: Air flow , Boundary-value problems , Flow (Dynamics) , Heat , Heat transfer , Laminar flow , Natural convection , Temperature , Temperature distribution

Holographic Interferometry Using Self-Developing Optical Crystals for Heat Flux Evaluation

R. Magnusson, A. Hafiz, J. S. Bagby, A. Haji-Sheikh

J. Electron. Packag. September 1990, 112(3): 255–259. doi: https://doi.org/10.1115/1.2904375

Abstract

View articletitled, Holographic Interferometry Using Self-Developing Optical Crystals for Heat Flux Evaluation

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Topics: Crystals , Heat flux , Holographic interferometry , Heat transfer , Fluids , Heating and cooling , Interferometry , Iron , Lithium , Steady state

A Zonal Decomposition Methodology for Detailed Temperature Field Evaluation

Cha-Hsiang Tan, Michael Pecht

J. Electron. Packag. September 1990, 112(3): 260–266. doi: https://doi.org/10.1115/1.2904376

Abstract

View articletitled, A Zonal Decomposition Methodology for Detailed Temperature Field Evaluation

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Topics: Temperature , Heat conduction , Electronics , Heat transfer

Packaging Architecture Considerations of High Density Multi-Chip Electronic Packages Via System Optimization

J. P. Krusius

J. Electron. Packag. September 1990, 112(3): 267–271. doi: https://doi.org/10.1115/1.2904377

Abstract

View articletitled, Packaging Architecture Considerations of High Density Multi-Chip Electronic Packages Via System Optimization

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Topics: Density , Electronic packages , Optimization , Packaging , Complementary metal oxide semiconductors , Cycles , Design , Mechanical engineers , Printed circuit boards , Simulated annealing