Abstract

The semiconductor process technology used in this study enables the creation of submillimeter reflector that can be reduced in size to less than 0.6 mm, a significant reduction in size compared to traditional glass components. Through innovative packaging, laser diodes and submillimeter reflector convert the side-emitted light of an edge-emitting laser (EEL) into front-emitted light. This packaged module can be seamlessly integrated using standard light emitting diode packaging technology. The wide application of diodes simplifies the packaging process, thereby reducing costs and promoting the potential for EEL market expansion.

Issue Section:
Technical Briefs
Keywords:
reflector, edge-emitting laser (EEL), chip-on-board (COB)
Topics:
Lasers

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